Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a method for manufacturing microelectronic devices includes forming a stand-off layer over a plurality of microelectronic dies on a microfeature workpiece, removing selected portions of the stand-off layer to form a plurality of stand-offs on corresponding dies, cutting the workpiece to singulate the dies, attaching a first singulated die to a support member, and coupling a second die to the stand-off on the first singulated die.

Abstract: A laser module includes an alignment plate having a template plate having a laser diode aperture and a photodiode aperture. A weld plate and a reflector are coupled to the template plate. The structure further includes a heat sink coupled to the alignment plate. A photodiode subassembly is mounted within the photodiode aperture and to the heat sink. Further, a laser diode subassembly is mounted within the laser diode aperture and to the heat sink. In the above manner, the photodiode subassembly, laser diode subassembly and reflected are precisely aligned.

Abstract: A simple, inexpensive method and apparatus are provided for increasing the thickness of a body molded on a semiconductor package without the need for a new mold, or for reworking the parts of an existing mold. The method includes providing a mold having parts that engage each other at respective interfacial surfaces, and a shim having a selected thickness and an opening through an interior portion thereof. The shim is interposed between the interfacial surfaces of the mold parts such that the mold parts are spaced apart by the thickness of the shim, and such that the mold parts and the shim opening define a cavity in the mold. The length and width of the cavity of the mold thus remain the same, while the height of the cavity, and hence, the thickness of the molded body, is increased by the thickness of the shim.

Abstract: An integrated circuit chip carrier (100) provides an improved mounting pad density. The chip carrier (100) includes a flexible substrate (102) with pads (104) on the top surface for interconnection with an attached integrated circuit chip (302). The chip carrier (100) further includes a mounting pad array (502) on the bottom surface having an interconnection with the pads (104), and a rigid substrate (202) having an array of holes (204) extending through it. The top surface of the rigid substrate (202) is fixedly attached to the bottom surface of the flexible substrate (102). Individual holes of the array of holes (204) correspond to and align with individual pads of the mounting pad array (502). The chip carrier (100) further includes solder (206) disposed on the mounting pad array (502) and extending through the array of holes (204) beyond the bottom surface of the rigid substrate (202) for mounting the integrated circuit chip carrier (100) to a circuit bearing substrate (700).

Abstract: A wire bond pad arrangement (104) has an improved pad density for providing a plurality of wire bond terminations for interconnection with corresponding terminations (604) of an IC chip (302. The wire bond pad arrangement (104) includes a substrate (102) and a plurality of pads (912) disposed on the substrate (102) adjacent to one another to form a row of pads (912). Each of the pads (912) is formed in a trapezoidal shape having short and long sides parallel to one another and substantially perpendicular to a line from a central point of the pad (912) to a central point of the corresponding termination (604) of the IC chip (302). The long sides of adjacent pads (912) are positioned alternately towards and away from the corresponding terminations (604) of the IC chip 302).