Patents by Inventor Jong-cheon Park
Jong-cheon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9721795Abstract: A method of forming patterns includes forming pillars and first peripheral patterns on an underlying layer, forming a separation wall layer covering sidewalls of the pillars and the first peripheral patterns, forming blocking portions on the separation wall layer to fill first openings between the first peripheral patterns, forming a block copolymer layer filling gap regions between the pillars, annealing the block copolymer layer to form first domains and a second domain surrounding the first domains, removing the first domains and removing portions of the separation wall layer to form second openings, removing the second domain and the blocking portions, removing the pillars and the first peripheral patterns to form third openings and fourth openings, and patterning the underlying layer to form fifth openings that extend from the second and third openings and sixth openings that extend from the fourth openings.Type: GrantFiled: August 3, 2015Date of Patent: August 1, 2017Assignee: SK Hynix Inc.Inventors: Jong Cheon Park, You Song Kim, Sung Kwang Kim, Jung Hyung Lee
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Patent number: 9691614Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends froType: GrantFiled: August 22, 2016Date of Patent: June 27, 2017Assignee: SK Hynix Inc.Inventors: Keun Do Ban, Jong Cheon Park, Jung Gun Heo, Hong Ik Kim, Cheol Kyu Bok
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Publication number: 20160358771Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends froType: ApplicationFiled: August 22, 2016Publication date: December 8, 2016Inventors: Keun Do BAN, Jong Cheon PARK, Jung Gun HEO, Hong Ik KIM, Cheol Kyu BOK
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Publication number: 20160293443Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends froType: ApplicationFiled: September 10, 2015Publication date: October 6, 2016Inventors: Keun Do BAN, Jong Cheon PARK, Jung Gun HEO, Hong Ik KIM, Cheol Kyu BOK
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Patent number: 9449840Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends froType: GrantFiled: September 10, 2015Date of Patent: September 20, 2016Assignee: SK Hynix Inc.Inventors: Keun Do Ban, Jong Cheon Park, Jung Gun Heo, Hong Ik Kim, Cheol Kyu Bok
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Publication number: 20160254153Abstract: A method of forming patterns includes forming pillars and first peripheral patterns on an underlying layer, forming a separation wall layer covering sidewalls of the pillars and the first peripheral patterns, forming blocking portions on the separation wall layer to fill first openings between the first peripheral patterns, forming a block copolymer layer filling gap regions between the pillars, annealing the block copolymer layer to form first domains and a second domain surrounding the first domains, removing the first domains and removing portions of the separation wall layer to form second openings, removing the second domain and the blocking portions, removing the pillars and the first peripheral patterns to form third openings and fourth openings, and patterning the underlying layer to form fifth openings that extend from the second and third openings and sixth openings that extend from the fourth openings.Type: ApplicationFiled: August 3, 2015Publication date: September 1, 2016Inventors: Jong Cheon PARK, You Song KIM, Sung Kwang KIM, Jung Hyung LEE
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Patent number: 9245796Abstract: A method of fabricating an interconnection structure according to an embodiment of the present invention, includes patterning a dielectric layer to form a first recession region, including a first nest-shaped recession region having a first width and a first line-shaped recession region having a second width, which is less than the first width. A guide spacer layer is formed on sidewalls of the first recession region to provide a second recession region including a second nest-shaped recession region in the first nest-shaped recession region. A self-assembling block copolymer material is formed to fill the second nest-shaped recession region. The self-assembling block copolymer material is annealed to form a polymer block domain and a polymer block matrix, surrounding the polymer block domain. The polymer block domain is removed to expose a portion of the dielectric layer. The exposed portion of the dielectric layer is etched to form a via cavity.Type: GrantFiled: October 28, 2015Date of Patent: January 26, 2016Assignee: SK Hynix Inc.Inventors: Keun Do Ban, Cheol Kyu Bok, Min Ae Yoo, Jong Cheon Park
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Patent number: 9202744Abstract: A method of fabricating an interconnection structure according to an embodiment of the present invention, includes patterning a dielectric layer to form a first recession region, including a first nest-shaped recession region having a first width and a first line-shaped recession region having a second width, which is less than the first width. A guide spacer layer is formed on sidewalls of the first recession region to provide a second recession region including a second nest-shaped recession region in the first nest-shaped recession region. A self-assembling block copolymer material is formed to fill the second nest-shaped recession region. The self-assembling block copolymer material is annealed to form a polymer block domain and a polymer block matrix, surrounding the polymer block domain. The polymer block domain is removed to expose a portion of the dielectric layer. The exposed portion of the dielectric layer is etched to form a via cavity.Type: GrantFiled: December 17, 2014Date of Patent: December 1, 2015Assignee: SK Hynix Inc.Inventors: Keun Do Ban, Cheol Kyu Bok, Min Ae Yoo, Jong Cheon Park
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Patent number: 7157605Abstract: 4-aminodiphenylamine is prepared by reacting carbanilide and nitrobenzene in an adequate solvent, which may be nitrobenzene, in the presence of an appropriate organic base, which may be tetramethylammonium hydroxide, alone or in mixture with an inorganic base and subsequently reducing the reaction product in the presence of an appropriate catalyst and hydrogen gas. The subsequent reduction may be carried out on the reaction mixture before the reaction mixture is subjected to separation.Type: GrantFiled: September 14, 2005Date of Patent: January 2, 2007Assignee: Korea Kumho Petrochemical Co., Ltd.Inventors: Jin-eok Kim, Jong-cheon Park, Kil-sun Lee, Jung-hee Jang
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Publication number: 20060258887Abstract: 4-aminodiphenylamine is prepared by reacting carbanilide and nitrobenzene in an adequate solvent, which may be nitrobenzene, in the presence of an appropriate organic base, which may be tetramethylammonium hydroxide, alone or in mixture with an inorganic base and subsequently reducing the reaction product in the presence of an appropriate catalyst and hydrogen gas. The subsequent reduction may be carried out on the reaction mixture before the reaction mixture is subjected to separation.Type: ApplicationFiled: September 14, 2005Publication date: November 16, 2006Inventors: Jin-eok Kim, Jong-cheon Park, Kil-sun Lee, Jung-hee Jang
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Publication number: 20030212959Abstract: Disclosed herein is a system and method for processing Web documents. The Web document processing system includes a script, a database, a template and a processing engine. The script designates commands to indicate where the information of a Web document is fetched from, which part of the information of the Web document is valuable, and how the information of the Web document is extracted. The database stores the information of Web documents processed through the script. The template prescribes the output format of the information of Web documents stored in the database. The processing engine produces output results according to the output format prescribed by the template and outputting the output results.Type: ApplicationFiled: February 20, 2003Publication date: November 13, 2003Inventors: Young Sik Lee, Jong Cheon Park