Patents by Inventor Jong Chun

Jong Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for RF shielding of a semiconductor package
    Patent number: 8093691
    Abstract: A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: January 10, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Ruben Fuentes, Christopher Scanlan, Jong Chun