Abstract: A manufacturing process in which a plurality of fluid jetting apparatuses are formed includes forming and sequentially adhering a heat driving part, a membrane and a nozzle part, respectively. The fluid jetting apparatuses are completed as a wafer unit by forming the nozzle part by forming a nozzle plate on a substrate of a wafer by a spinning process; forming jetting fluid barriers on the nozzle plate by the spinning process; forming jetting fluid chambers in the jetting fluid barriers; forming nozzles in the nozzle plate; and separating the substrate from the nozzle plate after the nozzle part and the membrane are adhered to each other. The forming jetting fluid chambers is accomplished by a process of wet etching, and the forming nozzles is accomplished by a treating apparatus of a laser beam or by a process of reactive ion etching.