Patents by Inventor Jong-Chun WEE

Jong-Chun WEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11665845
    Abstract: An electronic device includes a display; an upper housing surrounding a periphery of the display and forming a front of the electronic device; a lower housing coupled to the upper housing and forming a rear of the electronic device; and a window waterproof member disposed in an aperture between the upper housing and the periphery of the display. The window waterproof member includes an outer sheath composed of a first material; and an inner core composed of a second material more rigid than the first material and disposed substantially in the outer sheath such that each of an upper surface and a lower surface of the inner core facing the front and the rear of the electronic device, respectively, does not protrude out of a periphery of the outer sheath.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: May 30, 2023
    Inventors: Sung Eun Park, Jeong Eun Kim, Jae Uk Ahn, Jong Chun Wee, Hyung Woo Lee, Sang Hyuck Jung
  • Publication number: 20210352817
    Abstract: An electronic device includes a display; an upper housing surrounding a periphery of the display and forming a front of the electronic device; a lower housing coupled to the upper housing and forming a rear of the electronic device; and a window waterproof member disposed in an aperture between the upper housing and the periphery of the display. The window waterproof member includes an outer sheath composed of a first material; and an inner core composed of a second material more rigid than the first material and disposed substantially in the outer sheath such that each of an upper surface and a lower surface of the inner core facing the front and the rear of the electronic device, respectively, does not protrude out of a periphery of the outer sheath.
    Type: Application
    Filed: July 26, 2021
    Publication date: November 11, 2021
    Inventors: Sung Eun PARK, Jeong Eun KIM, Jae Uk AHN, Jong Chun WEE, Hyung Woo LEE, Sang Hyuck JUNG
  • Patent number: 11112828
    Abstract: According to certain embodiments of the present disclosure, an electronic device and manufacturing method are disclosed. The electronic device includes: a housing including a first face, a second face, and a side member surrounding a space defined between the first face and the second face, a support member within the housing such that a side face of the support member is oriented towards an inner wall of the side member, a circuit board mounted on one face of the support member, an electrically conductive plate mounted on a second face, and a contact member mounted on the support member to electrically couple at least a portion of the side member to the circuit board, wherein the contact member includes an end portion adjacent to the plate, and an end face of the end portion includes a width smaller than a width of another portion of the contact member.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: September 7, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Hwa Jung, Young Kyu Kim, Young Moon Park, Jae Uk Ahn, Jong Chun Wee
  • Patent number: 10698367
    Abstract: An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: June 30, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Eun Park, Jong-Chun Wee, Wook-Jin Lee, Jae-Uk Ahn
  • Publication number: 20190196412
    Abstract: According to certain embodiments of the present disclosure, an electronic device and manufacturing method are disclosed. The electronic device includes: a housing including a first face, a second face, and a side member surrounding a space defined between the first face and the second face, a support member within the housing such that a side face of the support member is oriented towards an inner wall of the side member, a circuit board mounted on one face of the support member, an electrically conductive plate mounted on a second face, and a contact member mounted on the support member to electrically couple at least a portion of the side member to the circuit board, wherein the contact member includes an end portion adjacent to the plate, and an end face of the end portion includes a width smaller than a width of another portion of the contact member.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 27, 2019
    Inventors: Tae Hwa JUNG, Young Kyu KIM, Young Moon PARK, Jae Uk AHN, Jong Chun WEE
  • Publication number: 20190072903
    Abstract: An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.
    Type: Application
    Filed: August 29, 2018
    Publication date: March 7, 2019
    Inventors: Sung-Eun PARK, Jong-Chun WEE, Wook-Jin LEE, Jae-Uk AHN