Patents by Inventor Jong-Chun WEE

Jong-Chun WEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device including waterproof structure
    Patent number: 10698367
    Abstract: An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: June 30, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Eun Park, Jong-Chun Wee, Wook-Jin Lee, Jae-Uk Ahn
  • ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE
    Publication number: 20190072903
    Abstract: An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.
    Type: Application
    Filed: August 29, 2018
    Publication date: March 7, 2019
    Inventors: Sung-Eun PARK, Jong-Chun WEE, Wook-Jin LEE, Jae-Uk AHN