Patents by Inventor Jong Dae BAEK

Jong Dae BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11773021
    Abstract: The present invention provides a concrete vacuum tube segment for a hyper-speed transportation system using ultra-high performance concrete (UHPC) and a manufacturing method thereof. A concrete vacuum tube segment for a hyper-speed transportation system can be easily manufactured using UHPC, in which shrinkage and structural cracking do not occur due to mixing a binder and a short fiber to secure airtightness on the basis of a maximum fill theory, and accordingly, shrinkage of the concrete vacuum tube segment can be reduced even in a partial-vacuum state in which the magnitude of drying shrinkage is very small and quick drying occurs; when mixing the UHPC, an antifoaming agent is mixed and a circular vacuum pump is used to remove generated entrapped air to minimize the entrapped air; and a capsule-type crack healing material, which is able to repair fine cracks, is compacted to secure airtightness of the concrete vacuum tube segment.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: October 3, 2023
    Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Gum Sung Ryu, Jae Yoon Kang, Gi Hong An, Byung Suk Kim, Jae Joon Song, Kyung Taek Koh, Jong Dae Baek
  • Patent number: 11472445
    Abstract: The present invention provides a crack repair material of a concrete vacuum tube segment using ultra-high performance concrete (UHPC) for a hyper-speed transportation system and a crack repairing method for the same capable of, in a case in which a vacuum tube segment of a hyper-speed transportation system, such as the Hyperloop, is manufactured using UHPC, repairing cracks formed in the UHPC vacuum tube segment easily and conveniently using a crack growth prevention material and a patch repair material and capable of immediately repairing cracks formed in the UHPC vacuum tube segment to secure airtightness so that operation of a vacuum pump is minimized and overload of the vacuum pump is prevented.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: October 18, 2022
    Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Gum Sung Ryu, Byung Suk Kim, Kyung Taek Koh, Jae Joon Song, Jae Yoon Kang, Jong Dae Baek, Gi Hong An
  • Publication number: 20220135491
    Abstract: The present disclosure relates to ultra-high density concrete composite containing super-absorbent polymer (SAP)-Attached Fibers, suitable for making a near-vacuum tube for hyperloop transportation system, a method for manufacturing the ultra-high density concrete composite, a method for manufacturing a concrete member using the ultra-high density concrete composite and an ultra-high density concrete member manufactured by the method.
    Type: Application
    Filed: October 27, 2021
    Publication date: May 5, 2022
    Inventors: Kyung-Taek KOH, Gum-Sung RYU, Byung-Suk KIM, Gi Hong AN, Jong-Dae BAEK, Jae-Yoon KANG, Jae-Joon SONG
  • Publication number: 20220135479
    Abstract: The present invention provides a concrete vacuum tube segment for a hyper-speed transportation system using ultra-high performance concrete (UHPC) and a manufacturing method thereof. A concrete vacuum tube segment for a hyper-speed transportation system can be easily manufactured using UHPC, in which shrinkage and structural cracking do not occur due to mixing a binder and a short fiber to secure airtightness on the basis of a maximum fill theory, and accordingly, shrinkage of the concrete vacuum tube segment can be reduced even in a partial-vacuum state in which the magnitude of drying shrinkage is very small and quick drying occurs; when mixing the UHPC, an antifoaming agent is mixed and a circular vacuum pump is used to remove generated entrapped air to minimize the entrapped air; and a capsule-type crack healing material, which is able to repair fine cracks, is compacted to secure airtightness of the concrete vacuum tube segment.
    Type: Application
    Filed: December 3, 2020
    Publication date: May 5, 2022
    Applicant: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Gum Sung RYU, Jae Yoon KANG, Gi Hong AN, Byung Suk KIM, Jae Joon SONG, Kyung Taek KOH, Jong Dae BAEK
  • Publication number: 20220135088
    Abstract: The present invention provides a crack repair material of a concrete vacuum tube segment using ultra-high performance concrete (UHPC) for a hyper-speed transportation system and a crack repairing method for the same capable of, in a case in which a vacuum tube segment of a hyper-speed transportation system, such as the Hyperloop, is manufactured using UHPC, repairing cracks formed in the UHPC vacuum tube segment easily and conveniently using a crack growth prevention material and a patch repair material and capable of immediately repairing cracks formed in the UHPC vacuum tube segment to secure airtightness so that operation of a vacuum pump is minimized and overload of the vacuum pump is prevented.
    Type: Application
    Filed: December 3, 2020
    Publication date: May 5, 2022
    Applicant: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Gum Sung RYU, Byung Suk KIM, Kyung Taek KOH, Jae Joon SONG, Jae Yoon KANG, Jong Dae BAEK, Gi Hong AN
  • Patent number: 10637088
    Abstract: Various embodiments may provide a method of forming an energy conversion device. The method may include forming an electrolyte layer on the first surface of the semiconductor substrate. The method may also include forming a cavity on the second surface of the semiconductor substrate using a deep reactive ion etch. The method may further include enlarging said cavity by carrying out one or more wet etches so that the enlarged cavity is at least partially defined by a vertical arrangement comprising a first lateral cavity surface of the semiconductor substrate extending substantially along a first direction, and a second lateral cavity surface of the semiconductor substrate adjoining the first lateral cavity surface. The method may include forming a first electrode on a first surface of the electrolyte layer, and forming a second electrode on a second surface of the electrolyte layer.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: April 28, 2020
    Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Pei-Chen Su, Yong Jin Yoon, Jong Dae Baek
  • Publication number: 20180159162
    Abstract: Various embodiments may provide a method of forming an energy conversion device. The method may include forming an electrolyte layer on the first surface of the semiconductor substrate. The method may also include forming a cavity on the second surface of the semiconductor substrate using a deep reactive ion etch. The method may further include enlarging said cavity by carrying out one or more wet etches so that the enlarged cavity is at least partially defined by a vertical arrangement comprising a first lateral cavity surface of the semiconductor substrate extending substantially along a first direction, and a second lateral cavity surface of the semiconductor substrate adjoining the first lateral cavity surface. The method may include forming a first electrode on a first surface of the electrolyte layer, and forming a second electrode on a second surface of the electrolyte layer.
    Type: Application
    Filed: May 20, 2016
    Publication date: June 7, 2018
    Inventors: Pei-Chen SU, Yong Jin YOON, Jong Dae BAEK