Patents by Inventor Jong-Dai Park

Jong-Dai Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975914
    Abstract: Provided is an electric vehicle battery transportation container having a battery fixing hook, one or more foldable anti-slip parts installed on a seat base manufactured in a plate shape having a closed upper surface stand upright to prevent left- right slip and front-rear slip of an electric vehicle battery, a ratchet which tightens a belt to fix the electric vehicle battery to the seat base in a state in which a battery fixing hook connected to the ratchet accommodated in a ratchet accommodation recess part formed in the seat base by the belt is inserted into an assembly hole formed in a lower bracket of the electric vehicle battery loaded on the seat base, and a corner support shaft unevenly coupled to a support shaft insertion groove formed with an inclined structure having a decreasing inner diameter to load seat bases on a transportation vehicle in multiple stages.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: May 7, 2024
    Assignees: HYUNDAI GLOVIS CO., LTD., NPC CO., LTD.
    Inventors: Woo Suck Nam, Oh Seong Kim, Jong Dai Park
  • Publication number: 20240084171
    Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
  • Patent number: 11787974
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: October 17, 2023
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Weoun Gyuen Moon, Jae Hyun Kim, Kyu Soon Shin, Jong Dai Park, Min Gun Lee, Sung Hoon Jin, Goo Hwa Lee, Gyeong Sook Cho, Jae Hong Yoo
  • Publication number: 20230201992
    Abstract: A method of polishing a substrate having amorphous carbon layer deposited thereon removes protrusions on the ACL surface by using a soft pad with a low hardness and a polishing slurry containing non-spherical modified fumed silica with high friction force with the surface.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 29, 2023
    Inventors: Heesuk KIM, Goo Hwa LEE, Jaehong YOO, Jong Dai PARK, Jae Hyun KIM, Juyoung YUN, Jisung LEE, Seonung CHOI, Jae-hwi LEE, Bong Soo AHN, Sam-jong CHOI
  • Publication number: 20230029885
    Abstract: In the present invention related to an electric vehicle battery transportation container having a battery fixing hook, one or more foldable anti-slip parts installed on a seat base manufactured in a plate shape having a closed upper surface stand upright to prevent left-right slip and front-rear slip of an electric vehicle battery at the same time, a ratchet tightens a belt to fix the electric vehicle battery to the seat base in a state in which a battery fixing hook connected to the ratchet accommodated in a ratchet accommodation recess part formed in the seat base by the belt is inserted into an assembly hole formed in a lower bracket of the electric vehicle battery loaded on the seat base, and a corner support shaft is unevenly coupled to a support shaft insertion groove formed with an inclined structure having a decreasing inner diameter to load seat bases on a transportation vehicle in multiple stages.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 2, 2023
    Applicants: HYUNDAI GLOVIS CO., Ltd., NPC CO., Ltd.
    Inventors: Woo Suck NAM, Oh Seong KIM, Jong Dai PARK
  • Publication number: 20230031585
    Abstract: In the present invention related to an electric vehicle battery transportation container having a shield sleeve, a ratchet tightens a belt to fix an electric vehicle battery to a seat base in a state in which a battery fixing hook connected to a leading end portion of the ratchet accommodated in a ratchet accommodation recess part formed in the seat base is inserted into an assembly hole formed in a lower bracket of the electric vehicle battery loaded on the seat base, one or more foldable anti-slip parts installed on the seat base stand upright to prevent left-right slip and front-rear slip of the electric vehicle battery at the same time, and a corner support shaft formed with an inclined structure having a decreasing inner diameter is unevenly coupled to a support shaft insertion groove to load seat bases on a transportation vehicle in multiple stages.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 2, 2023
    Applicants: HYUNDAI GLOVIS CO., Ltd., NPC CO., Ltd.
    Inventors: Woo Suck NAM, Oh Seong KIM, Jong Dai PARK
  • Publication number: 20210340405
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Application
    Filed: June 30, 2021
    Publication date: November 4, 2021
    Inventors: Weoun Gyuen MOON, Jae Hyun KIM, Kyu Soon SHIN, Jong Dai PARK, Min Gun LEE, Sung Hoon JIN, Goo Hwa LEE, Gyeong Sook CHO, Jae Hong YOO
  • Patent number: 11001732
    Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 11, 2021
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
  • Publication number: 20190077993
    Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 14, 2019
    Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
  • Publication number: 20190077994
    Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 14, 2019
    Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
  • Patent number: 10043678
    Abstract: The present invention relates to a slurry composition for reducing scratches generated when polishing the metal film in a manufacturing process of a semiconductor integrated circuit, by lowering frictional force so that a temperature of the composition which may rise during the polishing is lowered, the thermal stability of the slurry is improved and the size increase of particles in the slurry is suppressed, and a method for reducing scratches using the same. The method comprises the steps of applying a slurry composition for polishing a metal film to a substrate on which the metal film is formed, the slurry composition containing an organic solvent including a nitrogen atom and a glycol-based organic solvent; and making a polishing pad to be contacted to the substrate and moving the polishing pad with respect to the substrate, thereby removing at least part of the metal film from the substrate.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: August 7, 2018
    Assignee: DONGJIN SEMICHEM CO., LTD.
    Inventors: Chang Yong Park, Jong Dai Park, Jong Chul Shin, Jae Hyun Kim, Goo Hwa Lee, Min Sung Park
  • Publication number: 20160247693
    Abstract: The present invention relates to a slurry composition for reducing scratches generated when polishing the metal film in a manufacturing process of a semiconductor integrated circuit, by lowering frictional force so that a temperature of the composition which may rise during the polishing is lowered, the thermal stability of the slurry is improved and the size increase of particles in the slurry is suppressed, and a method for reducing scratches using the same. The method comprises the steps of applying a slurry composition for polishing a metal film to a substrate on which the metal film is formed, the slurry composition containing an organic solvent including a nitrogen atom and a glycol-based organic solvent; and making a polishing pad to be contacted to the substrate and moving the polishing pad with respect to the substrate, thereby removing at least part of the metal film from the substrate.
    Type: Application
    Filed: October 21, 2014
    Publication date: August 25, 2016
    Inventors: Chang Yong PARK, Jong Dai PARK, Jong Chul SHIN, Jae Hyun KIM, Goo Hwa LEE, Min Sung PARK
  • Patent number: 8362690
    Abstract: The present invention relates to a sealing method for a display element, and more particularly, to a sealing method for a display element which fundamentally prevents an error due to contact between light emitting bodies of upper and lower sealing members by protecting a surface of a light emitting layer and an electrode with a curing body of a photocurable transparent composition, enhances workability of a display element sealing, provides good moisture resistance and adhesiveness and improves an aperture ratio of a display element by making a top emission available to thereby make a thinner, larger display element.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: January 29, 2013
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Jung-Hyun Son, Han-Bok Joo, Sang-Kyu Lee, Jong-Dai Park
  • Patent number: 8241375
    Abstract: A method for preparing a chemical mechanical polishing slurry composition comprises the steps of preparing an aqueous iron salt solution by admixing an iron salt and cooled water of 5° C. or less; preparing an oxide containing silicon and iron as an additive by admixing and stirring a silicon salt and the aqueous iron salt solution for carrying out a reaction of the silicon salt and the aqueous iron salt solution to form an additive solution; and mixing the additive solution with at least one abrasive, at least one oxidizing agent and optionally at least one additional component to form the chemical mechanical polishing slurry composition.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: August 14, 2012
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Jong-Dai Park, Dong-Wan Kim
  • Publication number: 20120187334
    Abstract: A method for preparing a chemical mechanical polishing slurry composition comprises the steps of preparing an aqueous iron salt solution by admixing an iron salt and cooled water of 5° C. or less; preparing an oxide containing silicon and iron as an additive by admixing and stirring a silicon salt and the aqueous iron salt solution for carrying out a reaction of the silicon salt and the aqueous iron salt solution to form an additive solution; and mixing the additive solution with at least one abrasive, at least one oxidizing agent and optionally at least one additional component to form the chemical mechanical polishing slurry composition.
    Type: Application
    Filed: March 28, 2012
    Publication date: July 26, 2012
    Applicant: DONGJIN SEMICHEM CO., LTD.
    Inventors: Jong-Dai PARK, Dong-Wan Kim
  • Patent number: 7964521
    Abstract: The present invention relates to a getter paste composition, and more particularly, to a getter paste composition which is quickly densified at low densification temperatures to be applied to a device that is weak to heat, provides good adhesiveness, controls moisture and gas effectively and is screen-printable to thereby improve productivity.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: June 21, 2011
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Jung-Hyun Son, Sang-Kyu Lee, Han-Bok Joo, Jong-Dai Park
  • Publication number: 20110039412
    Abstract: Disclosed herein are a chemical mechanical polishing slurry composition for chemical mechanical planarization of metal layers, which comprises a non-ionized, heat-activated nano-catalyst, and a polishing method using the same. The polishing slurry composition comprises: a non-ionized, heat-activated nano-catalyst which releases electrons and holes by energy generated in a chemical mechanical polishing process; an abrasive; and an oxidizing agent. The non-ionized, heat-activated nano-catalyst and the abrasive are different from each other, and the non-ionized, heat-activated nano-catalyst is preferably a semiconductor material which releases electrons and holes at a temperature of 10 to 100° C. in an aqueous solution state, more preferably a transition metal silicide selected from the group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi), mixtures thereof, and most preferably, a semiconductor material such as nano ferrosilicon.
    Type: Application
    Filed: December 21, 2009
    Publication date: February 17, 2011
    Applicant: DONGJIN SEMICHEM CO., LTD.
    Inventors: Jong Dai Park, Jin Hyuk Lim, Jung Min Choi, Hyun Goo Kong, Jae Hyun Kim, Hye Jung Park
  • Patent number: 7887715
    Abstract: Disclosed herein are a chemical mechanical polishing slurry composition for chemical mechanical planarization of metal layers, which comprises a non-ionized, heat-activated nano-catalyst, and a polishing method using the same. The polishing slurry composition comprises: a non-ionized, heat-activated nano-catalyst which releases electrons and holes by energy generated in a chemical mechanical polishing process; an abrasive; and an oxidizing agent. The non-ionized heat-activated nano-catalyst and the abrasive are different from each other, and the non-ionized, heat-activated nano-catalyst is preferably a semiconductor material which releases electrons and holes at a temperature of 10 to 100° C. in an aqueous solution state, more preferably a transition metal silicide selected from the group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi), mixtures thereof, and most preferably, a semiconductor material such as nano ferrosilicon.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: February 15, 2011
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Jong Dai Park, Jin Hyuk Lim, Jung Min Choi, Hyun Goo Kong, Jae Hyun Kim, Hye Jung Park
  • Patent number: 7863207
    Abstract: The present invention relates to a glass frit and a sealing method for an electric element using the same, and more particularly, to a glass frit which provides a good sealing effect to moisture and gas and is processable at low temperatures, and a sealing method for an electric element using the same.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: January 4, 2011
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Jung-Hyun Son, Sang-Kyu Lee, Han-Bok Joo, Jong-Dai Park
  • Publication number: 20090120012
    Abstract: Disclosed is a method for preparing an additive solution which can be contained in a chemical mechanical polishing slurry composition used for a semiconductor manufacturing process. The method for preparing an additive solution for a chemical mechanical polishing slurry composition comprises the steps of: preparing an aqueous iron salt solution by admixing an iron salt and cooled water of 5° C. or less; and preparing an oxide containing silicon and iron by admixing and stirring a silicon salt and the aqueous iron salt solution for carrying out a reaction of the silicon salt and the aqueous iron salt solution.
    Type: Application
    Filed: December 16, 2008
    Publication date: May 14, 2009
    Applicant: Dongjin Semichem Co., Ltd.
    Inventors: Jong-Dai Park, Dong-Wan Kim