Patents by Inventor Jong-Dai Park
Jong-Dai Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11975914Abstract: Provided is an electric vehicle battery transportation container having a battery fixing hook, one or more foldable anti-slip parts installed on a seat base manufactured in a plate shape having a closed upper surface stand upright to prevent left- right slip and front-rear slip of an electric vehicle battery, a ratchet which tightens a belt to fix the electric vehicle battery to the seat base in a state in which a battery fixing hook connected to the ratchet accommodated in a ratchet accommodation recess part formed in the seat base by the belt is inserted into an assembly hole formed in a lower bracket of the electric vehicle battery loaded on the seat base, and a corner support shaft unevenly coupled to a support shaft insertion groove formed with an inclined structure having a decreasing inner diameter to load seat bases on a transportation vehicle in multiple stages.Type: GrantFiled: July 21, 2022Date of Patent: May 7, 2024Assignees: HYUNDAI GLOVIS CO., LTD., NPC CO., LTD.Inventors: Woo Suck Nam, Oh Seong Kim, Jong Dai Park
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Publication number: 20240084171Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
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Patent number: 11787974Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.Type: GrantFiled: June 30, 2021Date of Patent: October 17, 2023Assignee: Dongjin Semichem Co., Ltd.Inventors: Weoun Gyuen Moon, Jae Hyun Kim, Kyu Soon Shin, Jong Dai Park, Min Gun Lee, Sung Hoon Jin, Goo Hwa Lee, Gyeong Sook Cho, Jae Hong Yoo
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Publication number: 20230201992Abstract: A method of polishing a substrate having amorphous carbon layer deposited thereon removes protrusions on the ACL surface by using a soft pad with a low hardness and a polishing slurry containing non-spherical modified fumed silica with high friction force with the surface.Type: ApplicationFiled: December 22, 2022Publication date: June 29, 2023Inventors: Heesuk KIM, Goo Hwa LEE, Jaehong YOO, Jong Dai PARK, Jae Hyun KIM, Juyoung YUN, Jisung LEE, Seonung CHOI, Jae-hwi LEE, Bong Soo AHN, Sam-jong CHOI
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Publication number: 20230029885Abstract: In the present invention related to an electric vehicle battery transportation container having a battery fixing hook, one or more foldable anti-slip parts installed on a seat base manufactured in a plate shape having a closed upper surface stand upright to prevent left-right slip and front-rear slip of an electric vehicle battery at the same time, a ratchet tightens a belt to fix the electric vehicle battery to the seat base in a state in which a battery fixing hook connected to the ratchet accommodated in a ratchet accommodation recess part formed in the seat base by the belt is inserted into an assembly hole formed in a lower bracket of the electric vehicle battery loaded on the seat base, and a corner support shaft is unevenly coupled to a support shaft insertion groove formed with an inclined structure having a decreasing inner diameter to load seat bases on a transportation vehicle in multiple stages.Type: ApplicationFiled: July 21, 2022Publication date: February 2, 2023Applicants: HYUNDAI GLOVIS CO., Ltd., NPC CO., Ltd.Inventors: Woo Suck NAM, Oh Seong KIM, Jong Dai PARK
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Publication number: 20230031585Abstract: In the present invention related to an electric vehicle battery transportation container having a shield sleeve, a ratchet tightens a belt to fix an electric vehicle battery to a seat base in a state in which a battery fixing hook connected to a leading end portion of the ratchet accommodated in a ratchet accommodation recess part formed in the seat base is inserted into an assembly hole formed in a lower bracket of the electric vehicle battery loaded on the seat base, one or more foldable anti-slip parts installed on the seat base stand upright to prevent left-right slip and front-rear slip of the electric vehicle battery at the same time, and a corner support shaft formed with an inclined structure having a decreasing inner diameter is unevenly coupled to a support shaft insertion groove to load seat bases on a transportation vehicle in multiple stages.Type: ApplicationFiled: July 21, 2022Publication date: February 2, 2023Applicants: HYUNDAI GLOVIS CO., Ltd., NPC CO., Ltd.Inventors: Woo Suck NAM, Oh Seong KIM, Jong Dai PARK
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Publication number: 20210340405Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.Type: ApplicationFiled: June 30, 2021Publication date: November 4, 2021Inventors: Weoun Gyuen MOON, Jae Hyun KIM, Kyu Soon SHIN, Jong Dai PARK, Min Gun LEE, Sung Hoon JIN, Goo Hwa LEE, Gyeong Sook CHO, Jae Hong YOO
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Patent number: 11001732Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.Type: GrantFiled: November 13, 2018Date of Patent: May 11, 2021Assignee: Dongjin Semichem Co., Ltd.Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
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Publication number: 20190077993Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.Type: ApplicationFiled: November 13, 2018Publication date: March 14, 2019Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
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Publication number: 20190077994Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.Type: ApplicationFiled: November 13, 2018Publication date: March 14, 2019Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
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Patent number: 10043678Abstract: The present invention relates to a slurry composition for reducing scratches generated when polishing the metal film in a manufacturing process of a semiconductor integrated circuit, by lowering frictional force so that a temperature of the composition which may rise during the polishing is lowered, the thermal stability of the slurry is improved and the size increase of particles in the slurry is suppressed, and a method for reducing scratches using the same. The method comprises the steps of applying a slurry composition for polishing a metal film to a substrate on which the metal film is formed, the slurry composition containing an organic solvent including a nitrogen atom and a glycol-based organic solvent; and making a polishing pad to be contacted to the substrate and moving the polishing pad with respect to the substrate, thereby removing at least part of the metal film from the substrate.Type: GrantFiled: October 21, 2014Date of Patent: August 7, 2018Assignee: DONGJIN SEMICHEM CO., LTD.Inventors: Chang Yong Park, Jong Dai Park, Jong Chul Shin, Jae Hyun Kim, Goo Hwa Lee, Min Sung Park
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Publication number: 20160247693Abstract: The present invention relates to a slurry composition for reducing scratches generated when polishing the metal film in a manufacturing process of a semiconductor integrated circuit, by lowering frictional force so that a temperature of the composition which may rise during the polishing is lowered, the thermal stability of the slurry is improved and the size increase of particles in the slurry is suppressed, and a method for reducing scratches using the same. The method comprises the steps of applying a slurry composition for polishing a metal film to a substrate on which the metal film is formed, the slurry composition containing an organic solvent including a nitrogen atom and a glycol-based organic solvent; and making a polishing pad to be contacted to the substrate and moving the polishing pad with respect to the substrate, thereby removing at least part of the metal film from the substrate.Type: ApplicationFiled: October 21, 2014Publication date: August 25, 2016Inventors: Chang Yong PARK, Jong Dai PARK, Jong Chul SHIN, Jae Hyun KIM, Goo Hwa LEE, Min Sung PARK
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Patent number: 8362690Abstract: The present invention relates to a sealing method for a display element, and more particularly, to a sealing method for a display element which fundamentally prevents an error due to contact between light emitting bodies of upper and lower sealing members by protecting a surface of a light emitting layer and an electrode with a curing body of a photocurable transparent composition, enhances workability of a display element sealing, provides good moisture resistance and adhesiveness and improves an aperture ratio of a display element by making a top emission available to thereby make a thinner, larger display element.Type: GrantFiled: July 22, 2008Date of Patent: January 29, 2013Assignee: Dongjin Semichem Co., Ltd.Inventors: Jung-Hyun Son, Han-Bok Joo, Sang-Kyu Lee, Jong-Dai Park
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Patent number: 8241375Abstract: A method for preparing a chemical mechanical polishing slurry composition comprises the steps of preparing an aqueous iron salt solution by admixing an iron salt and cooled water of 5° C. or less; preparing an oxide containing silicon and iron as an additive by admixing and stirring a silicon salt and the aqueous iron salt solution for carrying out a reaction of the silicon salt and the aqueous iron salt solution to form an additive solution; and mixing the additive solution with at least one abrasive, at least one oxidizing agent and optionally at least one additional component to form the chemical mechanical polishing slurry composition.Type: GrantFiled: March 28, 2012Date of Patent: August 14, 2012Assignee: Dongjin Semichem Co., Ltd.Inventors: Jong-Dai Park, Dong-Wan Kim
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Publication number: 20120187334Abstract: A method for preparing a chemical mechanical polishing slurry composition comprises the steps of preparing an aqueous iron salt solution by admixing an iron salt and cooled water of 5° C. or less; preparing an oxide containing silicon and iron as an additive by admixing and stirring a silicon salt and the aqueous iron salt solution for carrying out a reaction of the silicon salt and the aqueous iron salt solution to form an additive solution; and mixing the additive solution with at least one abrasive, at least one oxidizing agent and optionally at least one additional component to form the chemical mechanical polishing slurry composition.Type: ApplicationFiled: March 28, 2012Publication date: July 26, 2012Applicant: DONGJIN SEMICHEM CO., LTD.Inventors: Jong-Dai PARK, Dong-Wan Kim
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Patent number: 7964521Abstract: The present invention relates to a getter paste composition, and more particularly, to a getter paste composition which is quickly densified at low densification temperatures to be applied to a device that is weak to heat, provides good adhesiveness, controls moisture and gas effectively and is screen-printable to thereby improve productivity.Type: GrantFiled: September 4, 2008Date of Patent: June 21, 2011Assignee: Dongjin Semichem Co., Ltd.Inventors: Jung-Hyun Son, Sang-Kyu Lee, Han-Bok Joo, Jong-Dai Park
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Publication number: 20110039412Abstract: Disclosed herein are a chemical mechanical polishing slurry composition for chemical mechanical planarization of metal layers, which comprises a non-ionized, heat-activated nano-catalyst, and a polishing method using the same. The polishing slurry composition comprises: a non-ionized, heat-activated nano-catalyst which releases electrons and holes by energy generated in a chemical mechanical polishing process; an abrasive; and an oxidizing agent. The non-ionized, heat-activated nano-catalyst and the abrasive are different from each other, and the non-ionized, heat-activated nano-catalyst is preferably a semiconductor material which releases electrons and holes at a temperature of 10 to 100° C. in an aqueous solution state, more preferably a transition metal silicide selected from the group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi), mixtures thereof, and most preferably, a semiconductor material such as nano ferrosilicon.Type: ApplicationFiled: December 21, 2009Publication date: February 17, 2011Applicant: DONGJIN SEMICHEM CO., LTD.Inventors: Jong Dai Park, Jin Hyuk Lim, Jung Min Choi, Hyun Goo Kong, Jae Hyun Kim, Hye Jung Park
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Patent number: 7887715Abstract: Disclosed herein are a chemical mechanical polishing slurry composition for chemical mechanical planarization of metal layers, which comprises a non-ionized, heat-activated nano-catalyst, and a polishing method using the same. The polishing slurry composition comprises: a non-ionized, heat-activated nano-catalyst which releases electrons and holes by energy generated in a chemical mechanical polishing process; an abrasive; and an oxidizing agent. The non-ionized heat-activated nano-catalyst and the abrasive are different from each other, and the non-ionized, heat-activated nano-catalyst is preferably a semiconductor material which releases electrons and holes at a temperature of 10 to 100° C. in an aqueous solution state, more preferably a transition metal silicide selected from the group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi), mixtures thereof, and most preferably, a semiconductor material such as nano ferrosilicon.Type: GrantFiled: December 21, 2009Date of Patent: February 15, 2011Assignee: Dongjin Semichem Co., Ltd.Inventors: Jong Dai Park, Jin Hyuk Lim, Jung Min Choi, Hyun Goo Kong, Jae Hyun Kim, Hye Jung Park
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Patent number: 7863207Abstract: The present invention relates to a glass frit and a sealing method for an electric element using the same, and more particularly, to a glass frit which provides a good sealing effect to moisture and gas and is processable at low temperatures, and a sealing method for an electric element using the same.Type: GrantFiled: September 2, 2008Date of Patent: January 4, 2011Assignee: Dongjin Semichem Co., Ltd.Inventors: Jung-Hyun Son, Sang-Kyu Lee, Han-Bok Joo, Jong-Dai Park
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Publication number: 20090120012Abstract: Disclosed is a method for preparing an additive solution which can be contained in a chemical mechanical polishing slurry composition used for a semiconductor manufacturing process. The method for preparing an additive solution for a chemical mechanical polishing slurry composition comprises the steps of: preparing an aqueous iron salt solution by admixing an iron salt and cooled water of 5° C. or less; and preparing an oxide containing silicon and iron by admixing and stirring a silicon salt and the aqueous iron salt solution for carrying out a reaction of the silicon salt and the aqueous iron salt solution.Type: ApplicationFiled: December 16, 2008Publication date: May 14, 2009Applicant: Dongjin Semichem Co., Ltd.Inventors: Jong-Dai Park, Dong-Wan Kim