Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.

Abstract: The present invention relates to a pipe connection assembly of a heat exchanger for connecting a header tank and a pipe of the heat exchanger, in which a means for preventing a welding ring that fixes a manifold and a pipe from entering into a hollow at one end of the manifold before welding is disposed, and a space is formed between the inner surface of the one end of the manifold and the outer surface of the pipe, thereby preventing the molten welding ring from flowing out.

Abstract: Provided is a radiator and condenser assembly, and more particularly, a radiator and condenser assembly capable of forming a pair of protrusions for horizontally fixing the condenser at a lower portion of a header tank of the radiator and forming a fixed part in a ‘U’ shape for fixing the condenser in a front and back direction to directly fix a vapor-liquid separator of the condenser to the header tank of the radiator to remove a fixed bracket formed in the condenser, thereby saving component manufacturing costs and additional process and processing costs for forming the fixed bracket.

Abstract: Provided is a liquid pump included in a module in which a flow path is changed depending on an operation mode. The liquid pump may have a flow path change means and a liquid transfer means integrally formed with each other; may reduce a package size by forming an inner flow path which may change a flow of cooling water in the flow path change means and the liquid transfer means which are integrally formed with each other; may have a simplified assembling structure and a coupling structure preventing both cooling water leakage and assembly loosening; and may minimize the number of components, assembling tools and connected portions in the module.

Abstract: The heater module includes a fluid pump including a pump inlet configured to introduce cooling water thereinto, a pump outlet configured to pressurize and discharge the introduced cooling water, cooling water heating heater including a heater inlet configured to introduce thereinto the cooling water discharged from the pump outlet of the fluid pump, a heating unit configured to heat the introduced cooling water, a heater outlet configured to discharge the heated cooling water, a flow channel switch valve for switching a circulation flow channel of the cooling water, wherein the fluid pump is integrally formed with one side of the cooling water heating heater to embody both a heating mode and a battery temperature-rising mode by one heater module for heating cooling water. Thus, a connection hose for connection components is removed or a length thereof is minimized, a fluid pump and a valve housing are reduced, thereby reducing costs.

Abstract: Provided is a radiator and condenser assembly, and more particularly, a radiator and condenser assembly capable of forming a pair of protrusions for horizontally fixing the condenser at a lower portion of a header tank of the radiator and forming a fixed part in a ‘U’ shape for fixing the condenser in a front and back direction to directly fix a vapor-liquid separator of the condenser to the header tank of the radiator to remove a fixed bracket formed in the condenser, thereby saving component manufacturing costs and additional process and processing costs for forming the fixed bracket.

Abstract: A cooling module includes a first radiator configured to cool a fuel cell stack. A second radiator is positioned in a predetermined area in front of the first radiator in an air flow direction and configured to cool an electronic component. A first condenser is positioned in the other remaining area in front of the first radiator in the air flow direction and heat-exchanged with ambient air to condense a refrigerant. A second condenser is provided within the second radiator and heat-exchanged with a coolant to condense a refrigerant. The second radiator and the first condenser are positioned alongside each other in front of the first radiator. The second condenser is provided within the second radiator.

Abstract: This invention relates to a radioactive patch/film and process of preparation thereof. The radioactive patch/film containing radioactive material can irradiate on skin directly. The radioactive patch/film is prepared by the process, wherein, various forms of the patch/film containing stable nuclide is prepared and irradiated with neutrons. The patch/film is very effective to treat various kinds of cancers, and dermal diseases.