Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.

Abstract: A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.

Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.

Abstract: A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.

Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.

Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.