Patents by Inventor Jong-Eok Ban
Jong-Eok Ban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11001461Abstract: A component mounting apparatus includes a component mounting unit including a suction configured to adsorb and transport a component; a first light source configured to emit first light to the component; a second light source configured to emit second light to a Fiducial mark of a substrate; a filter configured to transmit the first light reflected by the component through the filter and reflect the second light reflected by the Fiducial mark; and an image capturer configured to detect the first light transmitted through the filter and the second light reflected by the filter.Type: GrantFiled: April 30, 2019Date of Patent: May 11, 2021Assignee: HANWHA PRECISION MACHINERY CO., LTD.Inventors: Jong Eok Ban, Byung Ju Kim, Sung Ho Jo, Eun Suk Yoon
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Patent number: 10893640Abstract: A component pickup apparatus includes a component pickup unit including a plurality of nozzles, each of the plurality of nozzles configured to adsorb a component; a light emitter configured to emit light toward the plurality of nozzles; an image splitter configured to receive an image of the plurality of nozzles generated by the light and configured to split the image of the plurality of nozzles into different groups; and an image capturer configured to capture an image outputted from the image splitter. The image splitter is configured to guide a first image of a first group of the plurality of nozzles to a first row of the image capturer and guide a second image of a second group of the plurality of nozzles to a second row of the image capturer.Type: GrantFiled: April 30, 2019Date of Patent: January 12, 2021Assignee: HANWHA PRECISION MACHINERY CO., LTD.Inventors: Jong Eok Ban, Byung Ju Kim, Sung Ho Jo, Eun Suk Yoon
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Publication number: 20190344982Abstract: A component mounting apparatus includes a component mounting unit including a suction configured to adsorb and transport a component; a first light source configured to emit first light to the component; a second light source configured to emit second light to a Fiducial mark of a substrate; a filter configured to transmit the first light reflected by the component through the filter and reflect the second light reflected by the Fiducial mark; and an image capturer configured to detect the first light transmitted through the filter and the second light reflected by the filter.Type: ApplicationFiled: April 30, 2019Publication date: November 14, 2019Applicant: HANWHA PRECISION MACHINERY CO., LTD.Inventors: Jong Eok BAN, Byung Ju KIM, Sung Ho JO, Eun Suk YOON
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Publication number: 20190350113Abstract: A component pickup apparatus includes a component pickup unit including a plurality of nozzles, each of the plurality of nozzles configured to adsorb a component; a light emitter configured to emit light toward the plurality of nozzles; an image splitter configured to receive an image of the plurality of nozzles generated by the light and configured to split the image of the plurality of nozzles into different groups; and an image capturer configured to capture an image outputted from the image splitter. The image splitter is configured to guide a first image of a first group of the plurality of nozzles to a first row of the image capturer and guide a second image of a second group of the plurality of nozzles to a second row of the image capturer.Type: ApplicationFiled: April 30, 2019Publication date: November 14, 2019Applicant: HANWHA PRECISION MACHINERY CO., LTD.Inventors: Jong Eok BAN, Byung Ju KIM, Sung Ho JO, Eun Suk YOON
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Patent number: 9055709Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.Type: GrantFiled: January 19, 2010Date of Patent: June 9, 2015Assignee: SAMSUNG TECHWIN CO., LTD.Inventors: Jhin-Woo Shin, Tae-Sung Jang, Jong-Eok Ban
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Patent number: 9049810Abstract: A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.Type: GrantFiled: June 13, 2011Date of Patent: June 2, 2015Assignee: SAMSUNG TECHWIN CO., LTD.Inventor: Jong-eok Ban
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Patent number: 8926124Abstract: Provided are a light apparatus of a chip mounter which emits light to sides of a plurality of parts picked up by a plurality of nozzles of a chip mounter, the light apparatus including: at least one light module including a plurality of sloping portions each of which includes a plurality of slopes, wherein a slope of the plurality of slopes includes a light source emitting light to a side of a first part picked up by a first nozzle among the plurality of nozzles of the chip mounter.Type: GrantFiled: March 12, 2013Date of Patent: January 6, 2015Assignee: Samsung Techwin Co., Ltd.Inventors: Jae Hyun Park, Jong Eok Ban
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Publication number: 20130250571Abstract: Provided are a light apparatus of a chip mounter which emits light to sides of a plurality of parts picked up by a plurality of nozzles of a chip mounter, the light apparatus including: at least one light module including a plurality of sloping portions each of which includes a plurality of slopes, wherein a slope of the plurality of slopes includes a light source emitting light to a side of a first part picked up by a first nozzle among the plurality of nozzles of the chip mounter.Type: ApplicationFiled: March 12, 2013Publication date: September 26, 2013Applicant: SAMSUNG TECHWIN CO., LTD.Inventors: Jae Hyun PARK, Jong Eok BAN
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Patent number: 8505194Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.Type: GrantFiled: August 10, 2011Date of Patent: August 13, 2013Assignee: Samsung Techwin Co., Ltd.Inventors: Jong-eok Ban, Byung-Ju Kim
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Patent number: 8359735Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.Type: GrantFiled: April 16, 2010Date of Patent: January 29, 2013Assignee: Samsung Techwin Co., Ltd.Inventors: Jong-Eok Ban, Seong-Ku Kim
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Publication number: 20120036711Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.Type: ApplicationFiled: August 10, 2011Publication date: February 16, 2012Applicant: SAMSUNG TECHWIN CO., LTD.Inventors: Jong-eok BAN, Byung-Ju KIM
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Publication number: 20110302766Abstract: A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.Type: ApplicationFiled: June 13, 2011Publication date: December 15, 2011Applicant: SAMSUNG TECHWIN CO., LTD.Inventor: Jong-eok BAN
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Publication number: 20100263203Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.Type: ApplicationFiled: April 16, 2010Publication date: October 21, 2010Applicant: SAMSUNG TECHWIN CO., LTD.Inventors: Jong-Eok BAN, Seong-Ku KIM
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Patent number: 7810635Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.Type: GrantFiled: October 16, 2007Date of Patent: October 12, 2010Assignee: Samsung Techwin Co., Ltd.Inventors: Seong-Ku Kim, Jong-Eok Ban
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Publication number: 20100180435Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.Type: ApplicationFiled: January 19, 2010Publication date: July 22, 2010Applicant: Samsung Techwin Co., Ltd.Inventors: Jhin-Woo SHIN, Tae-Sung JANG, Jong-Eok BAN
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Publication number: 20080092680Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.Type: ApplicationFiled: October 16, 2007Publication date: April 24, 2008Applicant: Samsung Techwin Co., Ltd.Inventors: Seong-Ku Kim, Jong-Eok Ban