Patents by Inventor Jong-Eun Hong

Jong-Eun Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100122911
    Abstract: Disclosed is a method for coating a metallic interconnect for a solid oxide fuel cell (SOFC), the method including the steps of: carrying out pre-treatment for removing impurities adhered on a surface of the metallic interconnect; and carrying out pulse plating with cobalt as an anode, and the metallic interconnect as a cathode, in which an average current density (Ia) is set in a room-temperature cobalt plating solution, and a maximum current density (Ip), a current-on time (Ton) and a current-off time (Toff) are adjusted based on Ia=Ip×Ton/(Ton+Toff). Through the disclosed method, it is possible to obtain a metallic interconnect having a coating surface which has a high electrical conductivity and a high chrome volatilization inhibiting property and can minimize the occurrence of micro-cracks and micro-pores, thereby improving the performance of the SOFC.
    Type: Application
    Filed: November 13, 2009
    Publication date: May 20, 2010
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Rak-Hyun Song, Dong-Ryul Shin, Tak-Hyung Lim, Seung-Bok Lee, Jong-Eun Hong, Seong-Soo Pyo
  • Publication number: 20100124684
    Abstract: Disclosed is a method for heating a metallic interconnect for a solid oxide fuel cell (SOFC) to 150˜300° C., which can minimize the thermal shock by reducing a temperature difference between the metallic interconnect and a coating material during a thermal plasma coating process on the metallic interconnect for the SOFC. Accordingly, through the disclosed method, a densified coating layer with minimized micro pores/cracks can be formed on the surface of the metallic interconnect. Thus, it is possible to reduce the loss in output performance during the operation of the SOFC at a high temperature, and to maintain the long-term durability and performance of the metallic interconnect.
    Type: Application
    Filed: November 13, 2009
    Publication date: May 20, 2010
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Rak-Hyun Song, Dong-Ryul Shin, Tak-Hyung Lim, Seung-Bok Lee, Young-Sung Yoo, Jong-Eun Hong, Seong-Soo Pyo