Patents by Inventor Jong G. Ok

Jong G. Ok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11592441
    Abstract: Provided is a nanoplasmonic sensor and a kit for biomolecule analysis, and a method of analyzing a biomolecule using the same. The method includes: providing the nanoplasmonic sensor including a dielectric grating extending in one direction, and a metal structure disposed to cover an upper surface and a side surface of the dielectric grating and have at least one bent portion; immobilizing a first probe molecule on a surface of the metal structure; hybridizing an analyte with the first probe molecule by introducing the analyte having a base sequence complementary to the first probe molecule; binding a second probe molecule that is hybridized with the first probe molecule to the analyte; binding an enzyme to the second probe molecule; introducing a substrate that reacts with the enzyme to produce a precipitate by an enzymatic reaction; and measuring localized surface plasmon resonance in the metal structure.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: February 28, 2023
    Assignees: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Tae Geol Lee, Hee Kyung Na, Jung Sub Wi, Jong G. OK
  • Patent number: 10661273
    Abstract: Methods of forming two-dimensional nanopatterns are provided. The method may comprise periodically contacting a vibrating tool comprising a patterned grating edge with a substrate along a first direction in a grating-vibrational indentation patterning process. The patterned grating edge defines a plurality of rows and a plurality of interspersed troughs. The periodic contacting creates a two dimensional array of discontinuous voids in a single-stroke across the surface of the substrate. In other aspects, a microfluidic device for selective arrangement of a microspecies or nanospecies is provided, that includes a substrate comprising a surface defining a two-dimensional pattern of microvoids or nanovoids. In yet other aspects, the present disclosure provides a method for selective arrangement of a microspecies or nanospecies on a substrate.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: May 26, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Jong G. Ok, Lingjie J. Guo, Long Chen, Ashwin Panday
  • Publication number: 20200072830
    Abstract: Provided is a nanoplasmonic sensor and a kit for biomolecule analysis, and a method of analyzing a biomolecule using the same. The method includes: providing the nanoplasmonic sensor including a dielectric grating extending in one direction, and a metal structure disposed to cover an upper surface and a side surface of the dielectric grating and have at least one bent portion; immobilizing a first probe molecule on a surface of the metal structure; hybridizing an analyte with the first probe molecule by introducing the analyte having a base sequence complementary to the first probe molecule; binding a second probe molecule that is hybridized with the first probe molecule to the analyte; binding an enzyme to the second probe molecule; introducing a substrate that reacts with the enzyme to produce a precipitate by an enzymatic reaction; and measuring localized surface plasmon resonance in the metal structure.
    Type: Application
    Filed: December 11, 2018
    Publication date: March 5, 2020
    Inventors: Tae Geol LEE, Hee Kyung NA, Jung Sub WI, Jong G. OK
  • Patent number: 10185218
    Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Sukgyu Hahm
  • Patent number: 10007124
    Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 26, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonyong Park, Dongouk Kim, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Jaeseung Chung, Sukgyu Hahm
  • Patent number: 9855703
    Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: January 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jaeseung Chung, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Patent number: 9784896
    Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: October 10, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Sunghoon Lee, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Patent number: 9658484
    Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (?m); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 ?m, where the connection layer connects the plurality of pattern structure units to each other.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Jaeseung Chung, Sukgyu Hahm
  • Publication number: 20170100716
    Abstract: Methods of forming two-dimensional nanopatterns are provided. The method may comprise periodically contacting a vibrating tool comprising a patterned grating edge with a substrate along a first direction in a grating-vibrational indentation patterning process. The patterned grating edge defines a plurality of rows and a plurality of interspersed troughs. The periodic contacting creates a two dimensional array of discontinuous voids in a single-stroke across the surface of the substrate. In other aspects, a microfluidic device for selective arrangement of a microspecies or nanospecies is provided, that includes a substrate comprising a surface defining a two-dimensional pattern of microvoids or nanovoids. In yet other aspects, the present disclosure provides a method for selective arrangement of a microspecies or nanospecies on a substrate.
    Type: Application
    Filed: October 13, 2016
    Publication date: April 13, 2017
    Inventors: Jong G. Ok, Lingjie J. Guo, Long Chen, Ashwin Panday
  • Publication number: 20160062132
    Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 3, 2016
    Inventors: Joonyong Park, Dongouk Kim, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Jaeseung Chung, Sukgyu Hahm
  • Publication number: 20160054498
    Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
    Type: Application
    Filed: June 8, 2015
    Publication date: February 25, 2016
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Sunghoon Lee, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Publication number: 20160033818
    Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (?m); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 ?m, where the connection layer connects the plurality of pattern structure units to each other.
    Type: Application
    Filed: August 4, 2015
    Publication date: February 4, 2016
    Inventors: Sunghoon LEE, Dongouk KIM, Joonyong PARK, Jihyun BAE, Bongsu SHIN, Jong G. OK, Ilsun YOON, Jaeseung CHUNG, Sukgyu HAHM
  • Publication number: 20160023400
    Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
    Type: Application
    Filed: June 8, 2015
    Publication date: January 28, 2016
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Sukgyu Hahm
  • Publication number: 20160023399
    Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.
    Type: Application
    Filed: May 29, 2015
    Publication date: January 28, 2016
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jaeseung Chung, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon