Abstract: Disclosed is a liquid composition for an encapsulant of an organic light-emitting device. The liquid composition is free of a physical and chemical hygroscopic agent (getter) but includes a binder material having high hygroscopicity including an aliphatic 4-functionalized epoxy-based compound. Thus, the liquid composition for the encapsulant may be rapidly cured at low temperature and may secure excellent storage stability under a high temperature environment.

Abstract: An adhesive film for a display includes a first adhesive layer including an adhesive resin; a water-vapor barrier layer disposed on the first adhesive layer; a second adhesive layer disposed on the water-vapor barrier layer and including an adhesive resin; and an optical film disposed on the second adhesive layer, wherein at least one layer of the first adhesive layer or the water-vapor barrier layer contains at least one tungsten oxide selected from a group consisting of cesium-doped tungsten oxide (CWO; cesium-doped WO3) and tungsten oxide (WO3).

Abstract: Provided is an adhesive film for a display, in which the adhesive film has a high absorption capacity in a near infrared region and maintains a high transmittance in a visible region, thereby guaranteeing visibility.

Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus for each frequency at a temperature of 50° C. or more as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.

Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus at high temperature as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.

Abstract: An adhesive film and a laminate film including the same are disclosed. The adhesive film contains an adhesive resin and a near-infrared ray blocking agent, wherein visible-ray transmittance of the adhesive film in a wavelength band of 400 to 700 nm is in a range of 80 to 95%, and near-infrared ray transmittance of the adhesive film in a wavelength band of 800 to 1,500 nm is in a range of 10 to 70%.

Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus for each frequency at a temperature of 50° C. or more as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.

Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus at high temperature as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.

Abstract: An apparatus for remote-controlling an auxiliary device remote-controls easily the auxiliary device used with preset main devices in a conference, a seminar, a lecture, etc. The apparatus a main device remote controller configured to control setting components of the main device, an auxiliary device remote controller configured to control setting components of the auxiliary device, and a controller configured to receive and memorize a first control signal outputted from the main device remote controller, receive a second control signal outputted from the auxiliary device remote controller, and delivers the received first control signal or the second control signal to the main device or the auxiliary device.

Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.

Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.

Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.

Abstract: An apparatus for remote-controlling an auxiliary device remote-controls easily the auxiliary device used with preset main devices in a conference, a seminar, a lecture, etc. The apparatus a main device remote controller configured to control setting components of the main device, an auxiliary device remote controller configured to control setting components of the auxiliary device, and a controller configured to receive and memorize a first control signal outputted from the main device remote controller, receive a second control signal outputted from the auxiliary device remote controller, and delivers the received first control signal or the second control signal to the main device or the auxiliary device.