Abstract: The present disclosure provides a support unit and a substrate treating apparatus. A support unit according to an embodiment of the present disclosure includes a heater assembly including an upper plate and a lower plate formed of metal, and a heater disposed between the upper plate and the lower plate; a cover plate disposed on the upper plate, and formed of ceramic; a sealing member inserted into a cover vacuum hole of the cover plate and an upper vacuum hole of the upper plate, which are formed to be connected to each other, and having a hollow portion communicating with the upper vacuum hole.

Abstract: A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes: a chuck member; a ceramic puck disposed on the chuck member; a focus ring disposed to surround the ceramic puck; an insulating layer disposed below the focus ring to surround the chuck member; and two electrodes formed in the insulating layer, wherein a distance between the two electrodes is adjustable to form a variable capacitance.

Abstract: Disclosed is a heating plate for supporting and heating a substrate, the heating plate including: a base layer on which a substrate is seated; a bonding layer bonded to a lower surface of the base layer, and a bonding force reducing body disposed between the base layer and the bonding layer to reduce interfacial bonding force between the bonding layer and the base layer.

Abstract: Disclosed are an electrostatic chuck capable of precisely controlling the temperature of a peripheral area of a substrate and a plasma processing apparatus including the same. The electrostatic chuck configured to support a substrate in a plasma processing apparatus includes a plate configured to support the substrate using electrostatic force and having a disc shape, a first partition wall formed in an annular shape on a peripheral portion of the plate, a second partition wall formed in an annular shape at a position farther inward than the first partition wall on the peripheral portion of the plate, and a connection partition wall configured to interconnect the first partition wall and the second partition wall to partition the peripheral portion of the plate into a plurality of peripheral areas.

Abstract: According to various embodiments, there is provided an electronic device including a first housing having a bottom surface formed to be disposed on a specific portion of a top surface of a toilet, a second housing connected to one side of the first housing, a third housing connected to another side of the first housing and having a shape 5 extending from a point connected to the first housing by a specific length in a direction associated with a first curvature, and a detection unit having a shape of a second curvature corresponding to the first curvature, and the detection unit is rotatably coupled to at least a portion of the third housing.

Abstract: The present invention relates to a urine testing kit. The objective of the present invention is to provide a urine testing kit in which the effects of humidity, non-uniformity of reagent reactions, and interference between items are minimized, and fluid can easily flow into the kit, thus increasing the reaction efficiency with urine.

Abstract: According to various embodiments, there is provided an electronic device including a first housing having a bottom surface formed to be disposed on a specific portion of a top surface of a toilet, a second housing connected to one side of the first housing, a third housing connected to another side of the first housing and having a shape extending from a point connected to the first housing by a specific length in a direction associated with a first curvature, and a detection unit having a shape of a second curvature corresponding to the first curvature, and the detection unit is rotatably coupled to at least a portion of the third housing.

Abstract: Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.

Abstract: Provided is a substrate supporting apparatus with improved durability. The substrate supporting apparatus includes a body configured to support a substrate and formed of a dielectric substance; a heat transfer medium supply hole installed to penetrate the body; a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode.

Abstract: According to various embodiments, there is provided an electronic device including a first housing having a bottom surface formed to be disposed on a specific portion of a top surface of a toilet, a second housing connected to one side of the first housing, a third housing connected to another side of the first housing and having a shape extending from a point connected to the first housing by a specific length in a direction associated with a first curvature, and a detection unit having a shape of a second curvature corresponding to the first curvature, and the detection unit is rotatably coupled to at least a portion of the third housing.

Abstract: A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.

Abstract: Disclosed is a substrate processing apparatus that allows a substrate to be supported on an ultra-thin heating plate so as to be spaced from the ultra-thin heating plate in a proximity manner. The substrate processing apparatus includes a heating plate for heating a substrate; and a through proximity pin installed in the heating plate so as to pass through a through-hole formed in the heating plate such that the substrate is spaced from the heating plate by a spacing via the through proximity pin.

Abstract: Proposed is a thermal processing apparatus, an operation method thereof, and photo spinner equipment having a bake unit as the thermal processing apparatus, capable of uniformly applying heat to the entire area of a substrate by minimizing defamation of the substrate using low vacuum pressure. The thermal processing apparatus includes the base plate provided in a disc shape, a support pin provided on an upper surface of the base plate, a vacuum hole formed through the base plate, and a protruding member provided at a height lower than that of the support pin on the upper surface of the base plate.

Abstract: Provided is a substrate supporting apparatus with improved durability. The substrate supporting apparatus includes a body configured to support a substrate and formed of a dielectric substance; a heat transfer medium supply hole installed to penetrate the body; a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode.

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes: a chuck member; a ceramic puck disposed on the chuck member; a focus ring disposed to surround the ceramic puck; an insulating layer disposed below the focus ring to surround the chuck member; and two electrodes formed in the insulating layer, wherein a distance between the two electrodes is adjustable to form a variable capacitance.

Abstract: Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.

Abstract: Provided is a fluid analysis apparatus and a method of controlling the same. The fluid analysis apparatus include an actuator provided on a part of the fluid analysis apparatus, a mounting portion on which a fluid accommodating cartridge is mounted thereon, the fluid accommodating cartridge provided with a well in which a fluid sample is accommodated, a measurement portion configured to transmit light to the fluid accommodating cartridge and detect an optical signal from the light passed through the fluid accommodating cartridge, and a controller configured to control an operation of the actuator based on the optical signal detected by the measurement portion such that the light transmitted from the measurement portion passes through a central portion of the well to perform an accurate inspection on the fluid sample.

Abstract: Disclosed is a method for manufacturing a cooling plate for cooling a substrate, including an operation of manufacturing a coolant pipe by using a tubular pipe, an operation of inserting the coolant pipe into a casting mold that defines a plate, and an operation of casting the cooling plate by injecting a molten metal into the casting mold.

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a process chamber having a treatment space, a support unit that supports a substrate in the treatment space, and a supply line that supplies a process gas into the treatment space, and the support unit includes a heating plate provided with a heater pattern on a lower surface thereof and that heats the supported substrate, and an insulation layer covering the heater pattern and the lower surface of the heating plate.