Abstract: A method of manufacturing a pre-mold substrate includes preparing an electrically conductive substrate, forming a groove on one surface of the substrate, arranging a resin to cover one surface of the substrate and the groove, removing a portion of the resin so that at least a portion of one surface of the substrate protrudes higher than a surface of the resin covering the groove, and forming a circuit pattern on another surface of the substrate.

Abstract: An electronic device is disclosed. The electronic device comprises an image acquisition unit configured to acquire medical images captured at a plurality of positions, and a processor configured to generate tree structure data of three-dimensional candidate points corresponding to points along center lines of blood vessel regions of a reference image and a sub-image of the medical images, determine a three-dimensional path based on the tree structure data, determine a three-dimensional diameter for each of the points on the three-dimensional path, and reconstruct the three-dimensional shape of the blood vessels corresponding to the three-dimensional path based on the determined three-dimensional diameter.

Abstract: According to an aspect of the present disclosure, there is provided a pre-mold substrate including an electroconductive base member, which includes a first pre-mold groove formed in a bottom surface and a second pre-mold groove formed in a top surface and constitutes a circuit pattern; a first pre-mold resin disposed in the first pre-mold groove; and a second pre-mold resin disposed in the second pre-mold groove.

Abstract: A method for correcting blood flow velocity is provided, including receiving a plurality of medical images depicting a target blood vessel, receiving electrocardiogram data of an object of measurement, calculating blood flow velocity of the target blood vessel using the plurality of medical images, and correcting the calculated blood flow velocity based on the electrocardiogram data and standard blood flow velocity data of the target blood vessel.

Abstract: A method of manufacturing a pre-mold substrate includes preparing an electrically conductive substrate, forming a groove on one surface of the substrate, arranging a resin to cover one surface of the substrate and the groove, removing a portion of the resin so that at least a portion of one surface of the substrate protrudes higher than a surface of the resin covering the groove, and forming a circuit pattern on another surface of the substrate.

Abstract: According to an aspect of the present disclosure, there is provided a pre-mold substrate including an electroconductive base member, which includes a first pre-mold groove formed in a bottom surface and a second pre-mold groove formed in a top surface and constitutes a circuit pattern; a first pre-mold resin disposed in the first pre-mold groove; and a second pre-mold resin disposed in the second pre-mold groove.

Abstract: A substrate surface grinding apparatus includes: a grinding device including a plurality of grinding rollers configured to grind a surface of a substrate; and a substrate support member configured to support the substrate, wherein rotational axes of the grinding rollers are disposed to be inclined to rotational axes of adjacent grinding rollers.

Abstract: According to an embodiment of the disclosure, a method of fabricating a carrier for a wafer level package (WLP) by using a lead frame, wherein the lead frame is fabricated by forming a trench and a post by performing first half etching on an upper surface of a base substrate comprising a conductive material, filling the first-half-etched surface with resin of an insulating material, removing the resin exposed to outside of the trench so that an upper surface of the trench and an upper surface of the resin are at a same level, and performing second half etching on a lower surface of the base substrate, in which a memory chip is attached to the lower surface of the base substrate.

Abstract: According to one or more embodiments, there is provided an apparatus for polishing a surface of a substrate to remove a resin layer formed on the surface of the substrate having a groove, the apparatus including: a laser irradiation apparatus configured to irradiate a laser to the resin layer to remove at least a portion of a resin from the resin layer except for a portion of the resin layer arranged in the groove.

Abstract: According to an embodiment of the disclosure, a method of fabricating a carrier for a wafer level package (WLP) by using a lead frame, wherein the lead frame is fabricated by forming a trench and a post by performing first half etching on an upper surface of a base substrate comprising a conductive material, filling the first-half-etched surface with resin of an insulating material, removing the resin exposed to outside of the trench so that an upper surface of the trench and an upper surface of the resin are at a same level, and performing second half etching on a lower surface of the base substrate, in which a memory chip is attached to the lower surface of the base substrate.