Abstract: A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.

Abstract: A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.

Abstract: A method of implanting metallic nanowires or nanotube upon substrate with assistance of an electric field is proposed. The resulting structure having implanted and/or oriented nanowires or nanotubes has excellent electron emission behavior, and thus can be used as the electron field emission source in the application of a field emission display or lighting products.

Abstract: This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate consists of a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate provides structural strength and surface-mount capability. The buffer layer provides the adhesion between the substrate and the nanostructure layer. The nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhances adhesion for metallization and electronic materials.

Abstract: This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate comprises a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate can enhance the structural strength and surface-mount capability. The buffer layer provides the adhesion between a substrate and a nanostructure layer. Nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhancing adhesion for metallization and electronic materials. This layer also provides required properties for integrating electronic such as thermal conductivity, electrical insulation, dielectric, etc.