Patents by Inventor Jong-Hoon Cho

Jong-Hoon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128476
    Abstract: The present disclosure relates to a catalyst for a fuel cell electrode including an active particle which includes a core comprising platinum, a transition metal excluding platinum, and an oxide of a non-transition metal; and a shell disposed on the core and including platinum, wherein the active particle includes platinum and the non-transition metal in a molar ratio of 100:1.80 to 100:4.00, a method of preparing the same, and a fuel cell including the same.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 18, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Jung Hoon KIM, Jong Jun PARK, Eun Young YOU, Lim KIM, Sung Chul LEE, Jong Myung LEE, Young Ick CHO
  • Patent number: 11952652
    Abstract: Provided is a method of manufacturing a zinc-plated steel sheet. The method includes: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; and zinc plating the annealed steel sheet by dipping in a molten zinc plating bath. Further provided is a method of manufacturing a hot-press part including: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; zinc plating the annealed steel sheet by dipping in a molten zinc plating bath; heating the zinc-plated steel sheet; and press forming the heated steel sheet.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: April 9, 2024
    Assignee: POSCO CO., LTD
    Inventors: Il-Ryoung Sohn, Jong-Sang Kim, Joong-Chul Park, Yeol-Rae Cho, Jin-Keun Oh, Han-Gu Cho, Bong-Hoon Chung, Jong-Seog Lee
  • Patent number: 11945744
    Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
  • Publication number: 20240091759
    Abstract: Disclosed herein is a method of depositing a transition metal single-atom catalyst including preparing a carbon carrier, and depositing a transition metal single-atom catalyst on the carbon carrier, in which the carbon carrier is surface-treated by an oxidation process, and wherein the deposition is carried out by an arc plasma process.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong Min KIM, Sang Hoon KIM, Chang Kyu HWANG, Seung Yong LEE, So Hye CHO, Jae Won CHOI
  • Publication number: 20240073416
    Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee University
    Inventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
  • Patent number: 8841754
    Abstract: A semiconductor device having a via structure in a stress relief layer is provided. The semiconductor device may include an isolation layer on the circuit region, a stress relief layer on the via region, and a via structure in the stress relief layer and the substrate. The stress relief layer may have a thickness larger than that of the isolation layer and a stepped cross section.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: September 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sin-Woo Kang, Jang-Ho Kim, Woon-Seob Lee, Jong-Hoon Cho, Sung-Dong Cho, Yeong-Lyeol Park
  • Publication number: 20130249045
    Abstract: A semiconductor device having a via structure in a stress relief layer is provided. The semiconductor device may include an isolation layer on the circuit region, a stress relief layer on the via region, and a via structure in the stress relief layer and the substrate. The stress relief layer may have a thickness larger than that of the isolation layer and a stepped cross section.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 26, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sin-Woo Kang, Jang-Ho Kim, Woon-Seob Lee, Jong-Hoon Cho, Sung-Dong Cho, Yeong-Lyeol Park