Patents by Inventor Jong-Hoon Cho

Jong-Hoon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices with stress relief layers
    Patent number: 8841754
    Abstract: A semiconductor device having a via structure in a stress relief layer is provided. The semiconductor device may include an isolation layer on the circuit region, a stress relief layer on the via region, and a via structure in the stress relief layer and the substrate. The stress relief layer may have a thickness larger than that of the isolation layer and a stepped cross section.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: September 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sin-Woo Kang, Jang-Ho Kim, Woon-Seob Lee, Jong-Hoon Cho, Sung-Dong Cho, Yeong-Lyeol Park
  • SEMICONDUCTOR DEVICES WITH STRESS RELIEF LAYERS AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20130249045
    Abstract: A semiconductor device having a via structure in a stress relief layer is provided. The semiconductor device may include an isolation layer on the circuit region, a stress relief layer on the via region, and a via structure in the stress relief layer and the substrate. The stress relief layer may have a thickness larger than that of the isolation layer and a stepped cross section.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 26, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sin-Woo Kang, Jang-Ho Kim, Woon-Seob Lee, Jong-Hoon Cho, Sung-Dong Cho, Yeong-Lyeol Park