Patents by Inventor Jong Hoon YOO

Jong Hoon YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139934
    Abstract: The inventive concept provides a teaching method for teaching a transfer position of a transfer robot. The teaching method includes: searching for an object on which a target object to be transferred by the transfer robot is placed, based on a 3D position information acquired by a first sensor; and acquiring coordinates of a second direction and coordinates of a third direction of the object based on a data acquired from a second sensor which is a different type from the first sensor.
    Type: Application
    Filed: March 8, 2023
    Publication date: May 2, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Jong Min Lee, Kwang Sup Kim, Myeong Jun Lim, Young Ho Park, Yeon Chul Song, Sang Hyun Son, Jun Ho Oh, Ji Hoon Yoo, Joong Chol Shin
  • Publication number: 20240123784
    Abstract: A bump stopper can be provided for a vehicle. The bump stopper includes an upper part, a lower part, and a connection member. The upper part and the lower part are stacked vertically and have double density. The connection member is positioned at an interface between the upper part and the lower part to connect the upper part and the lower part.
    Type: Application
    Filed: March 3, 2023
    Publication date: April 18, 2024
    Inventors: Chang Sin Lee, Sang Hoon Yoo, Jong Min Kim
  • Patent number: 11961679
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Eun Jung Lee, Jong Suk Jeong, Chun Hee Seo, Jong Hoon Yoo, Tae Hyung Kim, Ho Sam Choi, Sim Chung Kang
  • Publication number: 20240079216
    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support plate for supporting a substrate and applying a power; a plasma control unit placed above the support plate to face the support plate; and a top electrode unit positioned to surround the plasma control unit, and wherein the plasma control unit includes: a dielectric plate positioned to face a top surface of a substrate mounted on the support plate; and a metal plate positioned above the dielectric plate, and the metal plate is electrically connected to the top electrode unit.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 7, 2024
    Inventors: KWANG SUNG YOO, JONG CHAN LEE, TAE HOON KANG
  • Patent number: 11920856
    Abstract: A refrigerator includes a storage chamber having an opening; a drawer type door to open or close the opening; a display positioned at the drawer type door; a first connector provided at a sidewall of the storage chamber; a second connector provided at the drawer type door and being electrically connected to the display; a first frame coupled to an inner wall of the storage chamber, the first frame to cover the first connector; a second frame coupled to the drawer type door, the second frame to support a storage box; and a wire electrically connected between the first connector and the second connector. The first frame has a first accommodating part to accommodate one portion of the wire and the second frame has a second accommodating part to accommodate another portion of the wire.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Myung Han, Jae Hoon Lim, Gi Joong Jeong, Woo Yeol Yoo, Jong Eun Chae, Sun keun Lee
  • Publication number: 20240074065
    Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
    Type: Application
    Filed: February 17, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae YOO, Yong Gil NAMGUNG, Jong Hoon SHIN, Sang Soon CHOI, Young Chul AN
  • Patent number: 11917820
    Abstract: A method for fabricating semiconductor device includes forming an alternating stack that includes a lower multi-layered stack and an upper multi-layered stack by alternately stacking a dielectric layer and a sacrificial layer over a substrate, forming a vertical trench that divides the upper multi-layered stack into dummy stacks, and forming an asymmetric stepped trench that is extended downward from the vertical trench to divide the lower multi-layered stack into a pad stack and a dummy pad stack, wherein forming the asymmetric stepped trench includes forming a first stepped sidewall that is defined at an edge of the pad stack, and forming a second stepped sidewall that is defined at an edge of the dummy pad stack and occupies less area than the first stepped sidewall.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: February 27, 2024
    Assignee: SK hynix Inc.
    Inventors: Eun-Ho Kim, Eun-Joo Jung, Jong-Hyun Yoo, Ki-Jun Yun, Sung-Hoon Lee
  • Patent number: 11791098
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers, and a plurality of internal electrodes stacked with one of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the body and connected to the internal electrodes, respectively. The plurality of dielectric layers include a dielectric expressed by empirical formula BaM1aTi1-xSnxM2bO3 (0.008?x?0.05, 0.006?a?0.03, and 0.0006?b<0.006) in which M1 includes a rare earth element, and M2 includes at least one of Mn or V.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Suk Jeong, Jong Hoon Yoo, Chun Hee Seo, Jeong Wook Seo, Dong Geon Yoo, Dong Hun Kim, Su Been Kim
  • Patent number: 11791097
    Abstract: A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, wherein the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains has a core-double shell structure, the double shell includes a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell, the first shell includes a first element, one or more of Sn, Sb, Ge, Si, Ga, In, or Zr, and the second shell includes a second element, one or more of Ca or Sr.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: October 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Su Been Kim, Jong Hoon Yoo, Kyung Ryul Lee, Hyung Joon Jeon, Jin Woo Kim, Jong Suk Jeong
  • Patent number: 11657964
    Abstract: A multilayer capacitor includes a capacitor body including an active region having dielectric layers and internal electrodes alternately stacked therein, the capacitor body including upper and lower covers disposed on upper and lower surfaces of the active region, respectively; and an external electrode disposed on an external surface of the capacitor body. In one of the upper and lower covers, a portion thereof between a boundary surface of the active region and a boundary surface of the capacitor body is divided into a first cover region adjacent to the active region and a second cover region adjacent to the boundary surface of the capacitor body, and the first cover region includes grains having a core-shell structure doped with Sn. The first cover region includes 20% or more of Sn-doped core-shell structure grains, compared to the total of grains in the first cover region.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chun Hee Seo, Jong Suk Jeong, Jin Woo Kim, Tae Hyung Kim, Jeong Wook Seo, Dong Geon Yoo, Jong Hoon Yoo, Su Been Kim
  • Publication number: 20230145889
    Abstract: According to an aspect of the present disclosure, a capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on the body and connected to the internal electrode layer, wherein the body further includes a withstand voltage layer disposed in a region spaced apart by more than 0 to 30 nm or less in a direction from a boundary of the internal electrode layer toward the dielectric layer, and having ionic mobility, lower than ionic mobility of the dielectric layer.
    Type: Application
    Filed: April 5, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Hoon Yoo, Su Been Kim, Kyung Ryul Lee, Jong Suk Jeong, Chun Hee Seo, Dong Geon Yoo, Hyung Jun Kong
  • Publication number: 20220199326
    Abstract: A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, wherein the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains has a core-double shell structure, the double shell includes a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell, the first shell includes a first element, one or more of Sn, Sb, Ge, Si, Ga, In, or Zr, and the second shell includes a second element, one or more of Ca or Sr.
    Type: Application
    Filed: October 13, 2021
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Su Been Kim, Jong Hoon Yoo, Kyung Ryul Lee, Hyung Joon Jeon, Jin Woo Kim, Jong Suk Jeong
  • Publication number: 20220199324
    Abstract: A multilayer capacitor includes a capacitor body including an active region having dielectric layers and internal electrodes alternately stacked therein, the capacitor body including upper and lower covers disposed on upper and lower surfaces of the active region, respectively; and an external electrode disposed on an external surface of the capacitor body. In one of the upper and lower covers, a portion thereof between a boundary surface of the active region and a boundary surface of the capacitor body is divided into a first cover region adjacent to the active region and a second cover region adjacent to the boundary surface of the capacitor body, and the first cover region includes grains having a core-shell structure doped with Sn. The first cover region includes 20% or more of Sn-doped core-shell structure grains, compared to the total of grains in the first cover region.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chun Hee SEO, Jong Suk JEONG, Jin Woo KIM, Tae Hyung KIM, Jeong Wook SEO, Dong Geon YOO, Jong Hoon YOO, Su Been KIM
  • Publication number: 20220189694
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers, and a plurality of internal electrodes stacked with one of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the body and connected to the internal electrodes, respectively. The plurality of dielectric layers include a dielectric expressed by empirical formula BaM1aTi1-xSnxM2bO3 (0.008?x?0.05, 0.006?a?0.03, and 0.0006?b ?0.006) in which M1 includes a rare earth element, and M2 includes at least one of Mn or V.
    Type: Application
    Filed: November 18, 2021
    Publication date: June 16, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo KIM, Jong Suk JEONG, Jong Hoon YOO, Chun Hee SEO, Jeong Wook SEO, Dong Geon YOO, Dong Hun KIM, Su Been KIM
  • Publication number: 20220139632
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 5, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo KIM, Eun Jung Lee, Jong Suk Jeong, Chun Hee Seo, Jong Hoon Yoo, Tae Hyung Kim, Ho Sam Choi, Sim Chung Kang
  • Patent number: 10607776
    Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately stacked. The dielectric layers contain at least one dielectric grain having a ratio of a long axis to a short axis that is 3.5 or more. The internal electrodes contain a ceramic component containing a grain growth adjusting ingredient for dielectric grains. Each dielectric layer includes interfacial portions adjacent to the internal electrodes and a central portion disposed between the interfacial portions, and concentrations of the grain growth adjusting ingredient in the interfacial portions and the central portion are different from each other.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Chang Hak Choi, Jong Hoon Yoo, Doo Young Kim, Min Gi Sin, Chi Hwa Lee, Chul Seung Lee, Jong Han Kim
  • Patent number: 10269492
    Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes: a ceramic body including dielectric layers; and internal electrodes disposed on the dielectric layers within the ceramic body and containing a ceramic material trapped therein. The ceramic material is a dielectric material doped with an additive.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: April 23, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kum Jin Park, Chang Hak Choi, Chi Hwa Lee, Min Gi Sin, Woo Sup Kim, Jong Hoon Yoo
  • Patent number: 9875847
    Abstract: A multilayer ceramic electronic component includes a plurality of dielectric layers; and internal electrodes disposed on the dielectric layers and containing an additive. The additive contains lithium (Li) and a dielectric material.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: January 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Gi Sin, Kum Jin Park, Jong Hoon Yoo, Chi Hwa Lee, Chang Hak Choi
  • Patent number: 9842696
    Abstract: There are provided a composite perovskite powder, a preparation method thereof, and a paste composition for an internal electrode having the same, the composite perovskite powder capable of preventing ions from being eluted from an aqueous system at the time of synthesis while being ultra-atomized, such that when the composite perovskite powder is used as an inhibitor powder for an internal electrode, sintering properties of the internal electrode may be deteriorated, and sintering properties of a dielectric material may be increased; accordingly, connectivity of the internal electrode may be improved, and permittivity and reliability of a multilayer ceramic capacitor (MLCC) may be increased.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: December 12, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Chang Hak Choi, Sang Min Youn, Kwang Hee Nam, Ki Myoung Yun, Hyung Joon Jeon, Jong Hoon Yoo
  • Patent number: 9576729
    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body in which internal electrodes and dielectric layers containing a barium titanate-based compound containing calcium (Ca) are alternately stacked; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes. The dielectric layer includes interfacial portions adjacent to the internal electrodes and a central portion disposed between the interfacial portions, the interfacial portion having a calcium (Ca) concentration higher than that of the central portion.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Chang Hak Choi, Chi Hwa Lee, Jong Hoon Yoo, Min Gi Sin