Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.

Abstract: A sputtering apparatus includes: a first cylindrical target and a second cylindrical target, which are arranged in a first direction and parallel to each other; a first magnet disposed in the first cylindrical target; a second magnet disposed in the second cylindrical target; and a substrate holder spaced apart from the first and second cylindrical targets in a second direction which is perpendicular to the first direction, wherein each of a first angle formed by a first imaginary straight line from a center of the first magnet to a cylindrical axis of the first cylindrical target with a first perpendicular line and a second angle formed by a second imaginary straight line from a center to of the second magnet to a cylindrical axis of the second cylindrical target with a second perpendicular line is in a range of about 30 degrees to about 180 degrees.

Abstract: Disclosed are a photo-acoustic sensor device and a photo-acoustic sensing method of the same. The sensing method includes providing a source light in a subject and receiving an ultrasonic wave generated in the subject by the source light. The source light may have a wavelength of 1400 nm to 2500 nm in a near-infrared band.

Abstract: Provided are embodiments of an optical sheet and a backlight assembly having the optical sheet. The optical sheet can include a body, a plurality of protrusions, and a plurality of embossed portions. The body can form a substrate. One surface of the body can be provided in a planar shape, and the other surface of the body can include the plurality of protrusions, where the protrusions have a triangular shaped cross-section. Each of the protrusions can be configured with the plurality of embossed, which may be formed by a microlens pattern.

Abstract: An optical sheet includes a substrate onto which light is incident, and a convex part protruded from the substrate by a predetermined thickness. A thickness of the convex part increases from an edge to a center thereof.

Abstract: Electrostatic discharge protection device is provided that protects the gate insulating layer without using an additional circuit to lower the trigger voltage of a thyristor. The electrostatic discharge protection device includes first and second impurity regions of a bipolar transistor being spaced a predetermined distance apart in a first conductivity type semiconductor substrate, and first and second impurity regions of a field transistor perpendicular to and along both sides of the first and second impurity regions of the bipolar transistor. A gate line formed between the first and second impurity regions of the bipolar transistor on the semiconductor substrate is coupled to one of the impurity regions of the field transistor. A Vss line is coupled to the other impurity region of the field transistor. The Vss line is also coupled to the first impurity region of the bipolar transistor. A metal layer is coupled to the first impurity region of the bipolar transistor and a pad.

Abstract: A semiconductor device isolating method is disclosed which may include the steps of: forming a buffer layer and an insulating layer on a semiconductor substrate, and etching to remove partially the insulating layer so as to form an opening corresponding to the device isolating region; forming hemispherical polysilicon patterns on the whole surface of the substrate; removing the buffer layer exposed between the HSG-Si patterns on the bottom of the opening, and dry-etching the resultant exposed silicon regions to form a plurality of trenches and silicon poles with a certain depth and length; forming an oxide layer on the inside of the trench, and filling the interior of the trench with polysilicon; and oxidizing the polysilicon filled in the trench to form a device isolating region.