Abstract: An X-ray inspection device is disclosed. The present X-ray inspection device includes an X-ray tube, a detector disposed so as to face the X-ray tube, and transfer devices, for simultaneous inspection of at least two objects to be inspected, transferring at least two objects to be inspected to an inspection position between the X-ray tube and the detector.

Abstract: An X-ray inspection device is disclosed. The present X-ray inspection device includes an X-ray tube, a detector disposed so as to face the X-ray tube, and transfer devices, for simultaneous inspection of at least two objects to be inspected, transferring at least two objects to be inspected to an inspection position between the X-ray tube and the detector.

Abstract: A semiconductor package includes a package substrate including: first and second bond finger arrays, each of the first and second finger arrays arranged in a first direction on a surface of the package substrate; a first semiconductor chip disposed on the surface of the package substrate and including a first chip pad array corresponding to the first bond finger array; a second semiconductor chip disposed on the surface of the package substrate and including a second chip pad array corresponding to the second bond finger array; first bonding wires connecting bond fingers of the first bond finger array to chip pads of the first chip pad array; and second bonding wires connecting bond fingers of the second bond finger array to chip pads of the second chip pad array.

Abstract: A semiconductor package includes a package substrate including: first and second bond finger arrays, each of the first and second finger arrays arranged in a first direction on a surface of the package substrate; a first semiconductor chip disposed on the surface of the package substrate and including a first chip pad array corresponding to the first bond finger array; a second semiconductor chip disposed on the surface of the package substrate and including a second chip pad array corresponding to the second bond finger array; first bonding wires connecting bond fingers of the first bond finger array to chip pads of the first chip pad array; and second bonding wires connecting bond fingers of the second bond finger array to chip pads of the second chip pad array.

Abstract: An LED streetlamp is provided that includes: a frame; a main PCB installed in the frame, extending in a longitudinal direction of the frame, and provided with a connector at a first side surface thereof; and a plurality of LED bars, each being coupled to the frame at an end thereof and emitting light by being powered by the main PCB, the LED bars symmetrically arranged with respect to the frame and arranged at regular intervals in the longitudinal direction of the frame.

Abstract: An LED streetlamp is provided that includes: a frame; a main PCB installed in the frame, extending in a longitudinal direction of the frame, and provided with a connector at a first side surface thereof; and a plurality of LED bars, each being coupled to the frame at an end thereof and emitting light by being powered by the main PCB, the LED bars symmetrically arranged with respect to the frame and arranged at regular intervals in the longitudinal direction of the frame.