Abstract: A display device includes a substrate; a first electrode and a second electrode disposed in an emission area and a sub-region and spaced apart from each other in a first direction; a first insulating layer disposed on the first electrode and the second electrode; light emitting elements disposed on the first insulating layer in the emission area, and including ends disposed on the first and second electrodes, respectively; and a second insulating layer disposed on the first insulating layer. The second insulating layer includes a fixing pattern; a support pattern portion; and a connection portion electrically connecting the fixing pattern and the support pattern portion, and the fixing pattern includes a first region that contacts an outer surface of the light emitting elements and a second region that does not contact the outer surface of the light emitting elements.

Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed.

Abstract: The method for preparing a super absorbent polymer according to the present disclosure has a feature that it is possible to reduce the generation of a fine powder during production of the super absorbent polymer while maintaining excellent physical properties of the super absorbent polymer, including centrifuge retention capacity (CRC) and vortex removal time.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

Abstract: Provided is a method for preparing an oligomer including: supplying a monomer stream and a solvent stream to a reactor to perform an oligomerization reaction to prepare a reaction product; supplying a discharge stream from the reactor including the reaction product to a separation device and supplying a lower discharge stream from the separation device to a settling tank; adding an organic flocculant to the settling tank to settle and remove a polymer and supplying the lower discharge stream from the separation device from which the polymer is removed to a high boiling point separation column; and removing a high boiling point material from the lower portion in the high boiling point separation column and supplying an upper discharge stream including an oligomer to a solvent separation column.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.

Abstract: A semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.

Abstract: A device configured for a vehicle for supporting and massaging a neck of a passenger is provided. The device is configured such that a neck support pad is integrally formed on a lower end portion of a headrest to hold up and support the neck of a passenger, and a massage device is mounted in the neck support pad to massage the neck of the passenger, thus stably supporting and massaging the neck of the passenger sitting on a seat.

Abstract: Electronic device includes first wireless communication interface; second wireless communication interface; and controller.

Abstract: The present disclosure relates to a DC-DC converter, a vehicle, and a control method including the same, and more particularly, to a DC-DC converter, a vehicle, and a control method including the same capable of effectively detecting and responding to an interlock failure of a connector.

Abstract: A method for synthesizing a pre-hydrolyzed polysilicate, wherein a polysilicate is applied as a reactant when synthesizing the pre-hydrolyzed polysilicate, and the total amount of water added in the reaction system is specified. The method is capable of omitting a condensation reaction by applying a polysilicate as a reactant, thereby significantly shortening synthesis time and reducing production costs when compared with a typical synthesis method in which alkoxysilane-based monomer compound is used as a reactant. In addition, the gelation reaction time and the weight average molecular weight can be easily controlled, and a pre-hydrolyzed polysilicate excellent in storage stability and processability can be synthesized.

Abstract: Provided is a method of producing an oligomer, the method including: supplying a monomer stream and a solvent stream to a reactor to perform an oligomerization reaction to produce a reaction product; supplying a discharge stream of the reactor to a separation device, and supplying an upper discharge stream of the separation device including an unreacted monomer to the reactor and supplying a lower discharge stream of the separation device to a settling tank; settling a polymer in the settling tank and removing the polymer, and supplying the lower discharge stream of the separation device from which the polymer is removed to a high-boiling point separation column; removing a high-boiling point material from a lower discharge stream of the high-boiling point separation column and supplying an upper discharge stream of the high-boiling point separation column including an oligomer to a solvent separation column; and separating a solvent and the oligomer in the solvent separation column.

Abstract: A display device includes a first electrode disposed on a substrate, a first insulating film disposed on the first electrode and having a first opening formed, a second insulating film disposed on the first insulating film and having a second opening, and a contact electrode electrically contacting at least a portion of the first electrode through the first opening and the second opening, wherein a side surface of the first insulating film defines the first opening, and the second insulating film overlaps the side surface of the first insulating film such that the contact electrode and the first insulating film are not in contact with each other.

Abstract: The present disclosure relates to an apparatus for preparing an oligomer, the apparatus including: a reactor for oligomerizing a feed stream containing a fed monomer; a stirrer inserted into a hole formed in an upper portion of the reactor; and a solvent transfer line extending inward from a side of the reactor, wherein the stirrer includes a rotating shaft vertically extending downward from the upper portion of the reactor, and a blade having a conical shape whose vertex is positioned at a lower end of the rotating shaft and outer diameter increases from a bottom toward a top, and the solvent transfer line has a plurality of spray nozzles formed in a direction toward the blade.

Abstract: The present disclosure provides a mobile communications system line number sheet management device and method. Provided, according to one aspect of the present disclosure, is a line number sheet management device and method, for automating access network-related line number sheet management by automatically collecting and updating line number information, the line number information being collected from a mobile communications base station management server (mobile communications system management server) and a fronthaul management server. Provided, according to another aspect of the present disclosure, is a fronthaul device for: acquiring unique information of a base station by receiving an optical signal from any one of a radio unit (RU) and a digital unit (DU); and transmitting the unique information of the base station to a fronthaul management server.

Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.

Abstract: An apparatus and a method for providing a haptic control signal of a haptic device are disclosed. The apparatus for providing a haptic control signal of a haptic device comprises: a haptic pattern data determination unit for determining haptic pattern data on the basis of at least one of an audio signal and an additional effect signal; a haptic control signal generation unit for generating a haptic control signal for controlling a vibration operation of the haptic device on the basis of the haptic pattern data; and a transmission unit for transmitting the haptic control signal to the haptic device.

Abstract: An actuator includes a fixed frame, a movable frame accommodated in the fixed frame and moving linearly and rotationally on a plane perpendicular to an optical axis, a driving unit disposed in the fixed frame and the movable frame to provide driving force for moving the movable frame; a sensor substrate including a movable portion coupled to the movable frame to move together with the movable frame, and a fixed portion coupled to the fixed frame; and an image sensor disposed on the sensor substrate. The movable frame includes a reinforcing plate made of a material different from a material of the movable frame, and the reinforcing plate includes a bent portion bent toward the sensor substrate.