Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Abstract: There is provided an angular velocity sensor including first and second mass bodies provided within a first frame, a first flexible connector system connecting the first and second mass bodies and the first frame and that includes at least one sensor to detect displacements of the first and second mass bodies, a second flexible connector system connecting the first frame to a second frame provided separate from the first frame and that includes a driver to drive movement of the first frame relative to the second frame, so angular velocities can be measured based on the first and second mass bodies being enabled to rotate in a first axis direction and translated in a second axis direction, and based on the first frame being flexibly connected to the second frame so that a rotation displacement of the first frame is made in a third axis direction.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

Abstract: There is provided an angular velocity sensor including first and second mass bodies provided within a first frame, a first flexible connector system connecting the first and second mass bodies and the first frame and that includes at least one sensor to detect displacements of the first and second mass bodies, a second flexible connector system connecting the first frame to a second frame provided separate from the first frame and that includes a driver to drive movement of the first frame relative to the second frame, so angular velocities can be measured based on the first and second mass bodies being enabled to rotate in a first axis direction and translated in a second axis direction, and based on the first frame being flexibly connected to the second frame so that a rotation displacement of the first frame is made in a third axis direction.

Abstract: There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.

Abstract: Embodiments of the invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force.

Abstract: Embodiments of the invention provide a cap module for MEMS including a substrate, a first negative photoresist, which is formed on one surface of the substrate, and a second negative photoresist, which is formed on one surface of the first negative photoresist.

Abstract: Embodiments of the invention provide a micro electro mechanical system (MEMS) sensor module, including a sensor, a substrate connected to the sensor, and an external board connected to the substrate by a conductive connector. The substrate is provided with a cavity so as to be opposite to the sensor.

Abstract: Disclosed herein is an MEMS sensor, including: a sensor unit; and a substrate connected to the sensor unit, in which the substrate may be provided with a flexible printed circuit board (FPCB) to correspond to an outer peripheral portion of the sensor unit.

Abstract: Disclosed herein is a TPMS transmission module having a power saving function, the TPMS transmission module including: a micom outputting a switch turn-off control signal when a vehicle having the TPMS transmission module mounted therein is stopped; a switch supplying a power when the switch is turned on and blocking the supply of the power when it is turned off; an energy generator generating and outputting an electric power when a tire rotates; and a switch controller turning on the switch when the electric power of a predetermined voltage or more is generated in the energy generator and turning off the switch when a switch turn off control signal is output from the micom.

Abstract: There is provided a tire location discrimination device, including: a plurality of pressure gauges each measuring internal pressure of a plurality of tires; and an operation unit receiving and processing pressure signals each generated from the plurality of pressure gauges, respectively, according to curves of a road surface, wherein signals values or phase differences of the pressure signals are compared with each other by the operation unit to discriminate the tire locations.

Abstract: Disclosed herein is a tire pressure monitoring system, including an electrical device unit including a pressure sensor for detecting an air pressure of a tire; a housing that is accommodated in the electrical device unit and into which the air pressure of the tire is introduced; a valve antenna having one end that is inserted into the housing and the other end into which the air pressure of the tire is introduced; a conduction member having one end that is electrically connected to the electrical device unit and the other end that is electrically connected to the valve antenna; and a coupling member fixing and coupling the housing and the valve antenna to each other, wherein the valve antenna transmits a pressure signal about the air pressure of the tire, which is detected by the pressure sensor, to a receiver of a vehicle.

Abstract: There is provided a haptic feedback actuator according to an exemplary embodiment of the present invention, including: a vibrating plate provided on one surface of a haptic device to transfer vibrations; and an actuator provided on the haptic device and including a composite layer in which a sensing electrode providing a sensing voltage Va based on a touch pressure of the haptic device and a driving electrode providing a driving voltage Vd corresponding to the sensing voltage Va are formed and a piezoelectric material generating vibrations according to the driving voltage Vd by being combined with one surface of the composite layer.