Patents by Inventor Jong Ik Park

Jong Ik Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11631531
    Abstract: A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and including a plurality of wall surfaces respectively connecting the one surface and the other surface, a coil portion embedded in the body, first and second external electrodes spaced apart from each other on one surface of the body, and respectively connected to the coil portion, a groove formed continuously along an edge of the other surface of the body, and a stress relieving portion disposed on the other surface of the body to fill at least a portion of the groove.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: April 18, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jong Ik Park
  • Patent number: 11469036
    Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jong Ik Park
  • Publication number: 20200343038
    Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.
    Type: Application
    Filed: July 10, 2020
    Publication date: October 29, 2020
    Inventor: Jong Ik PARK
  • Publication number: 20200312536
    Abstract: A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and including a plurality of wall surfaces respectively connecting the one surface and the other surface, a coil portion embedded in the body, first and second external electrodes spaced apart from each other on one surface of the body, and respectively connected to the coil portion, a groove formed continuously along an edge of the other surface of the body, and a stress relieving portion disposed on the other surface of the body to fill at least a portion of the groove.
    Type: Application
    Filed: September 10, 2019
    Publication date: October 1, 2020
    Inventor: Jong Ik PARK
  • Patent number: 10734157
    Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jong Ik Park
  • Publication number: 20200227984
    Abstract: Provided is a method for manufacturing an actuator coil structure including: disposing a base layer including polyimide on a substrate; forming a conductive micro pattern coil on the base layer by a plating process; filling spaces of the micro pattern coil with an insulating layer; and removing the substrate from the base layer by separation to form an actuator coil structure for a camera autofocus or anti-shake function.
    Type: Application
    Filed: July 30, 2018
    Publication date: July 16, 2020
    Inventor: Jong Ik PARK
  • Patent number: 9984804
    Abstract: A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: May 29, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ik Park, Min Sung Choi, Jae Yeol Choi, Jin Mo Ahn
  • Patent number: 9490061
    Abstract: A coil component includes a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively, the substrates having respective cores; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: November 8, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ik Park, Jin Mo Ahn
  • Publication number: 20160322154
    Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.
    Type: Application
    Filed: January 20, 2016
    Publication date: November 3, 2016
    Inventor: Jong Ik PARK
  • Publication number: 20160307688
    Abstract: A chip component includes a first body part in which at least one pillar part is formed, a winding coil having a central portion fitted onto the at least one pillar part, and a second body part stacked on the first body part so that the winding coil is embedded between the first body part and the second body part.
    Type: Application
    Filed: March 22, 2016
    Publication date: October 20, 2016
    Inventor: Jong Ik PARK
  • Publication number: 20160268039
    Abstract: A coil component includes a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively, the substrates having respective cores; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.
    Type: Application
    Filed: December 30, 2015
    Publication date: September 15, 2016
    Inventors: Jong Ik PARK, Jin Mo AHN
  • Publication number: 20160217909
    Abstract: A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.
    Type: Application
    Filed: November 12, 2015
    Publication date: July 28, 2016
    Inventors: Jong Ik PARK, Min Sung CHOI, Jae Yeol CHOI, Jin Mo AHN
  • Patent number: 7460579
    Abstract: A semiconductor laser device comprises: a substrate having a top surface divided into a first region and a second region; a high-output LD including a first conductivity-type clad layer, an active layer, and a second conductivity-type clad layer including an upper portion having a first ridge structure, sequentially formed on the first region of the substrate; and a low-output LD including a first conductivity-type clad layer, an active layer, and a second conductivity-type clad layer including an upper portion having a second ridge structure, sequentially formed on the second region of the substrate, wherein the first and second ridge structures are formed in such a manner that they are extended to both ends opposed to each other, the first ridge structure is bent at two or more bending positions, and the second ridge structure is rectilinear.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: December 2, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Ik Park, Yu Seung Kim, Ki Won Moon, Hye Ran Oh