Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.

Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.

Abstract: A membrane device for manufacturing a crash pad for a vehicle including a real wood sheet includes a vacuum device main body having a plurality of vacuum holes such that a real wood sheet to be temporarily attached to a core is mounted in the vacuum device main body, a cover having a silicone film to define a vacuum space together with the vacuum device main body, a vacuum module to suck air in the vacuum device main body through the vacuum holes, and a control unit to compress the real wood sheet and the core, which are temporarily attached and mounted on the vacuum device main body, for a preset time by sucking air in the vacuum space through the vacuum holes in a state in which the vacuum device main body is covered by the cover.

Abstract: A real wood sheet capable of being used for automatic wrapping, the real wood sheet including a wood layer; a mesh layer disposed on a surface of the wood layer; and a flexible layer disposed on a surface of the mesh layer such that the mesh layer is disposed between the wood layer and the flexible layer.

Abstract: Disclosed are wood preforming devices for manufacturing a crash pad for a vehicle including a real wood sheet. A wood preforming device for manufacturing a crash pad for a vehicle includes a real wood sheet includes a lower press mold comprising a debossed portion provided on a portion on which a product is formed, and a support portion configured to support an upper press mold, in response to the lower press mold and the upper press mold pressing each other, the support portion having a protrusion for fixing a real wood sheet, the upper press mold having an embossed portion corresponding to the debossed portion of the lower press mold, and a movable core provided on the debossed portion of the lower press mold and being configured to guide the real wood sheet by moving upward from the debossed portion, in response to the upper press mold moving downward.

Abstract: A press apparatus for vehicle crash pads including real wood sheets. The press apparatus includes a lower press including an engraved part, and a support part to support an upper press, the support part having a fixing protrusion, the upper press including an embossed part, first slides fixed to maintain a shape of the engraved part during a compression process of the real wood sheet, the first slides compressing a rear surface of the real wood sheet while rising along the embossed part, and a second slide to compress the real wood sheet during the compression process of the real wood sheet. During a wrapping process of the real wood sheet, the second slide compresses the real wood sheet to an inner rear surface of a core while falling such that a portion of the real wood sheet bent inward of the engraved part is wound around the core.

Abstract: A semiconductor device includes a first interlayer insulating film disposed on a substrate and having a first trench. A first lower conductive pattern fills the first trench and includes first and second valley areas that are spaced apart from each other in a first direction parallel to an upper surface of the substrate. The first and second valley areas are recessed toward the substrate. A second interlayer insulating film is disposed on the first interlayer insulating film and includes a second trench that exposes at least a portion of the first lower conductive pattern. An upper conductive pattern fills the second trench and includes an upper barrier film and an upper filling film disposed on the upper barrier film. The upper conductive pattern at least partially fills the first valley area.

Abstract: A method for manufacturing a light emitting element includes forming a first semiconductor structure including a first semiconductor layer doped with a first conductivity type dopant disposed on a base substrate, a light emitting layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the light emitting layer and doped with a second conductivity type dopant; forming a second semiconductor structure spaced apart from another second semiconductor structure on the base substrate by etching the first semiconductor structure in a direction perpendicular to a surface of the base substrate; and activating a second conductivity type dopant in the second semiconductor layer of the second semiconductor structure to form a light emitting element core.

Abstract: Disclosed is a wireless power transmitting apparatus including a power transmitting coil generating an induced electromotive force on a power receiving coil of a terminal, a magnet casing composed of a first space in a cylinder shape where the power transmitting coil is inserted, and a second space sharing a central axis of the cylinder with the first space, wherein the second space is a space between the first space and a cylinder having a diameter greater than a diameter of the cylinder of the first space, a ring magnet disposed in the second space of the magnet casing in a shape of a ring, wherein the ring magnet has a height smaller than a height of the magnet casing, and is movable in a vertical direction of the magnet casing by external magnetism, and a cover constructed in a direction perpendicular to an axis of the power transmitting coil.

Abstract: An electronic device includes a narrowband internet of things (NB-IoT) circuit; a shared central processor to control the narrowband internet of things circuit; a shared memory to store data or code from the shared central processor; and a communicator controlled by the shared central processor. The communicator stores the data or the code in the shared memory.

Abstract: A semiconductor device includes a first interlayer insulating film disposed on a substrate and having a first trench. A first lower conductive pattern fills the first trench and includes first and second valley areas that are spaced apart from each other in a first direction parallel to an upper surface of the substrate. The first and second valley areas are recessed toward the substrate. A second interlayer insulating film is disposed on the first interlayer insulating film and includes a second trench that exposes at least a portion of the first lower conductive pattern. An upper conductive pattern fills the second trench and includes an upper barrier film and an upper filling film disposed on the upper barrier film. The upper conductive pattern at least partially fills the first valley area.

Abstract: A wireless power module includes a coil layer including a coil including a curved area, a wiring board disposed on the coil layer, and a plurality of conductive lines disposed on the wiring board. At least a portion of the conductive lines crosses the curved area within a predetermined angle range when viewed in a plane.

Abstract: A drum structure for laundry treatment device and a method of manufacturing a drum are disclosed. The drum structure for laundry treatment device includes a drum center formed of a metal sheet in a cylindrical shape having a hollow, and the drum center includes a reduced drum portion formed by reducing both ends of the drum center, and a curved portion formed in the reduced drum portion. The drum structure for laundry treatment device and the method of manufacturing a drum do not need to separately manufacture a drum front and a drum rear, do not require separate molds for the manufacture of the drum front and the drum rear, and can reduce the overall manufacturing cost.

Abstract: A kit for detecting an antigen from which false positive signals are removed is provided. The kit includes a substrate; a capture antibody attachable onto the substrate and having a capture strand labeled with a fluorescent material; a detection antibody having a detection strand labeled with a fluorescent material and complementary to some or all of a base sequence of the capture strand; and a blocking strand having a base sequence capable of complementary binding to the capture strand or the detection strand to prevent the detection strand and the capture strand from complementary binding to each other.

Abstract: An electronic device includes a narrowband internet of things (NB-IoT) circuit; a shared central processor to control the narrowband internet of things circuit; a shared memory to store data or code from the shared central processor; and a communicator controlled by the shared central processor. The communicator stores the data or the code in the shared memory.

Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.

Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.

Abstract: Provided is an interposer using an inclined electrode and a manufacturing method thereof. The interposer may include a first plate having at least one inclined surface formed between a first layer in which an upper portion is located and a second layer in which a lower portion is located, a second plate having an upper portion formed along the first layer and a lower portion formed to extend along the upper portion of the first plate, at least one inclined surface, and the second layer, and at least one electrode formed along the upper portion of the first plate, at least one inclined surface, and the lower portion of the second plate. In the at least one electrode, a portion formed along the upper portion of the first plate and a portion formed along the lower portion of the second plate may be exposed.

Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.

Abstract: A semiconductor device includes a first interlayer insulating film disposed on a substrate and having a first trench. A first lower conductive pattern fills the first trench and includes first and second valley areas that are spaced apart from each other in a first direction parallel to an upper surface of the substrate. The first and second valley areas are recessed toward the substrate. A second interlayer insulating film is disposed on the first interlayer insulating film and includes a second trench that exposes at least a portion of the first lower conductive pattern. An upper conductive pattern fills the second trench and includes an upper barrier film and an upper filling film disposed on the upper barrier film. The upper conductive pattern at least partially fills the first valley area.