Patents by Inventor Jong Jin WEON

Jong Jin WEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9620476
    Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: April 11, 2017
    Assignees: SEMES CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hang Lim Lee, Jong Jin Weon, Soon Hyun Kim, Seung Dae Seok
  • Publication number: 20150129135
    Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.
    Type: Application
    Filed: November 4, 2014
    Publication date: May 14, 2015
    Inventors: Hang Lim LEE, Jong Jin WEON, Soon Hyun KIM, Seung Dae SEOK