Abstract: An optical imaging system includes a first lens having a convex image-side surface, a second lens having a concave object-side surface, a third lens, a fourth lens, and a fifth lens disposed sequentially from an object side. The optical imaging system satisfies 4.8<f/IMG_HT<9.0, where f is a focal length of the optical imaging system, and IMG_HT is half a diagonal length of an imaging surface of an image sensor.

Abstract: Disclosed is an ultrasonic wave transmission structure which is provided on a path of ultrasonic waves to amplify incident ultrasonic waves. The ultrasonic wave transmission structure includes: multiple rings each provided with a body portion having a different radius from other body portions and spaced apart from another body portion adjacent thereto and a slit disposed between adjacent body portions; and a membrane disposed in the multiple rings, wherein the mass of the membrane is adjusted to vary a resonant frequency in multiple sub-membrane regions.

Abstract: Disclosed is an in-vehicle sterilization system. The system includes a sterilizer that includes one or more ultraviolet (UV) light-emitting diodes (LEDs). The system also includes processors that determine a time point at which the sterilizer is to be operated, and control operation of the sterilizer according to a result of the determination.

Abstract: Provided are a multi-layer ceramic battery (MLCB) and a method for manufacturing the same. The method for MLCB includes: forming a laminated body by laminating a first solid electrolyte layer interposed between a plurality of unit battery cells, respectively; forming an intermediate protective layer to cover a surface of the laminated body and to expose an end section of one side or the other side in the longitudinal direction of the laminated body; forming an outer protective layer to cover a surface of the intermediate protective layer and to expose the end section of one side or the other side in the longitudinal direction of the laminated body; and forming a pair of external electrodes to partially connect each end surface of the laminated body, respectively and to partially surround one side or the other side in the longitudinal direction of the laminated body.

Abstract: A switch apparatus, includes: a base module including a base case, and a moving magnet movably mounted in the base case; and a manipulation module including a manipulation case, and a first magnet fixedly mounted in the manipulation case, wherein the moving magnet moves between a hold position and a releasable position, the hold position refers to a position in which the manipulation module is held onto the base module as an attractive force acts between the moving magnet and the first magnet, and the releasable position refers to a position in which the manipulation module is releasable from the base module as a repulsive force acts between the moving magnet and the first magnet.

Abstract: A holographic-based directional sound device is provided, the device including: a sound wave generating means generating a sound wave; and a flat plate configured to have the sound wave generating means installed at the center so as to radiate the sound wave to the outside through a surface, and to be composed of a plurality of unit cells, in which at least one groove is formed on a surface of the unit cell, and a radiation angle of the sound wave is determined according to a depth of the groove with respect to the unit cell, wherein the depth of the groove is determined by an individual surface admittance calculated by a cosine function or a sine function of the sum of a first value and a second value on the basis of a preset radiation angle of the sound wave and a preset frequency of the sound wave.

Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially arranged in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system and each having a refractive power, wherein an entire field of view of the optical imaging system is 50° or greater, and TTL/f<1.0, where TTL is a distance from an object-side surface of the first lens to the imaging plane, and f is an overall focal length of the optical imaging system.

Abstract: Disclosed are a drug evaluation method and apparatus. The drug evaluation method includes acquiring cell images in response to a drug to be evaluated, loading an image processing-based learning model trained so as to predict molar concentrations, outputting molar concentrations of cells corresponding to the cell images by applying the learning model to the acquired cell images, and calculating a drug evaluation value used to evaluate effects of the drug on the cells based on the molar concentrations of the cells corresponding to the cell images output through the learning model.

Abstract: An optical imaging system includes a first lens having a convex image-side surface, a second lens having a concave object-side surface, a third lens, a fourth lens, and a fifth lens disposed sequentially from an object side. The optical imaging system satisfies 4.8<f/IMG_HT<9.0, where f is a focal length of the optical imaging system, and IMG_HT is half a diagonal length of an imaging surface of an image sensor.

Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

Abstract: A molding method for a cover window includes: locally heating a peripheral portion of a glass substrate around a central portion of the glass substrate to a temperature of about 610° C. to about 670° C., forming a cover window by pressing the glass substrate, and annealing and cooling the cover window. Accordingly, a cover window in which each of edges has an outwardly convex curved surface through a glass substrate may be formed. In addition, the surface roughness of a cover window formed through a glass substrate may be improved.

Abstract: A display device includes a base substrate including a first area, a second area, and a third area between the first and second areas and bendable to a degree, insulating layers on the base substrate, a signal line overlapping the first to third areas and including a first line portion in the first area, a second line portion in the first area, the second area, and the third area and on a layer different from the first line portion, and a first connection portion in the first area and on a layer different those of the first and second line portions, wherein the second line portion is connected to a second portion of the first connection portion via a single second contact hole defined in an insulating layer between the second line portion and the second portion of the first connection portion, the insulating layer being an organic layer.

Abstract: A method for fabricating semiconductor device includes forming an alternating stack that includes a lower multi-layered stack and an upper multi-layered stack by alternately stacking a dielectric layer and a sacrificial layer over a substrate, forming a vertical trench that divides the upper multi-layered stack into dummy stacks, and forming an asymmetric stepped trench that is extended downward from the vertical trench to divide the lower multi-layered stack into a pad stack and a dummy pad stack, wherein forming the asymmetric stepped trench includes forming a first stepped sidewall that is defined at an edge of the pad stack, and forming a second stepped sidewall that is defined at an edge of the dummy pad stack and occupies less area than the first stepped sidewall.

Abstract: There are provided a memory system and an operating method of the memory system. The memory system includes: a main controller for transmitting main data having N bits through a main channel, where N is a positive integer; memory devices for storing sub-data constituting the main data, and transmitting the sub-data through sub-channels; and a sub-controller for communicating with the main controller through the main channel, and communicating with the memory devices through the sub-channels. The sub-controller generates the sub-data each having n bits where n is a positive integer less than N, by dividing the main data, generates sub-data strobe clocks by decreasing a frequency of a main data strobe clock synchronized with the main data, and transmits/receives the sub-data to/from the memory devices in synchronization with the sub-data strobe clocks.

Abstract: A new use of a cyclo histidine-proline (Cyclo His-Pro, CHP) is disclosed. A composition including cyclo histidine-proline (CHP) as an active ingredient has an excellent protective effect to protect kidney and liver cells from damage and/or toxicity induced by various causes. The composition is useful and effective in protecting kidney and/or liver cells/tissues and in treating a subject with kidney and/or liver diseases and/or damages.

Abstract: The present invention relates to equipment for preparing a polyolefin elastomer including a reactor to which a solvent and a raw material are supplied, a primary devolatilizer which devolatilizes a product discharged from the reactor to remove an unreacted material (primary devolatilization recovery flow), and to discharge the remainder thereof (primary devolatilization preparation flow), a secondary devolatilizer which re-devolatilizes the primary devolatilization preparation flow discharged from the primary devolatilizer to further remove an unreacted material (secondary devolatilization recovery flow), and to discharge the remainder thereof (secondary devolatilization preparation flow), a finisher which scrubs, using water, the secondary devolatilization preparation flow discharged from the secondary devolatilizer, so that the unreacted material and the water are evaporated and a polymer product remains, and a flash drum which removes low-molecular materials (impurity removal flow) from the primary devolat

Abstract: A semiconductor package may include: a substrate having a first side and a second side on a same plane; a first semiconductor chip disposed over the second side of the substrate; a first one-side third semiconductor chip stack disposed over the first side of the substrate and spaced apart from the first semiconductor chip; a second semiconductor chip stack disposed over the first semiconductor chip and the first one-side third semiconductor chip stack, the second semiconductor chip stack including one or more second semiconductor chips; and a second one-side third semiconductor chip stack disposed over the second semiconductor chip stack, wherein each of the third semiconductor chip stacks includes a plurality of third semiconductor chips that are offset-stacked, offset towards the first side as the third semiconductor chips are farther from the substrate, each of the third semiconductor chip stacks being electrically connected to the substrate.

Abstract: Embodiments of the present disclosure relate to a storage device based on a daisy chain topology. According to embodiments of the present disclosure, a storage device may include a plurality of memory package chips each including a plurality of memory dies capable of storing data; and a controller communicating with the plurality of memory package chips and connected to the plurality of memory package chips through one or more daisy chain circuits.

Abstract: An embodiment provides a wafer cassette stoker comprising: a cassette on which a plurality of wafers are loaded; a plurality of chambers disposed in one line while forming at least one layer, wherein the cassette after being cleaned is inserted in each of the chambers and a humidity control unit for supplying a compressed dry air (CDA) into the insides of the chambers so as to control humidity of the cassette.