Abstract: An electrostatic chuck of the present invention includes a top block and a bottom block bonded by a bonding layer. The top block has a first plate on which a chucking electrode and a heater are installed, and the bottom block is provided with a cooling member. A second plate made of a material having lower heat transfer rate than the first plate is disposed between the first plate and the bottom block. Accordingly, when the heater is heated at a high temperature, it is possible to prevent the bonding layer from being damaged by thermal impact.