Patents by Inventor Jong Keun Jun

Jong Keun Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of attaching a die onto a pad of a lead frame
    Patent number: 5851853
    Abstract: An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive by dispensing the epoxy adhesive onto the die pad, decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, and placing the chip into the adhesive to attach the chip to the die pad. The hot gas used may be air or nitrogen, having a temperature from 50.degree. C. to 70.degree. C. The hot gas is blown from a blower between the die pad and the dispenser, and may be blown onto the epoxy adhesive from more than one direction.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: December 22, 1998
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwa Young Lee, Jong Keun Jun, Tae Hyuk Kim, Jae Won Lee