Patents by Inventor Jong Keun Song

Jong Keun Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948545
    Abstract: A sound control device in a vehicle and control method thereof may include obtaining energy per unit time of an audio signal corresponding to a preset low frequency band, calculating an allowable reference value based on a difference between a magnitude of energy per unit time of the audio signal and a magnitude of a preset maximum allowable input of a speaker, monitoring whether a magnitude of energy per unit time of a noise control signal for eliminating noise in the vehicle exceeds the allowable reference value, and adjusting a magnitude of the noise control signal when the magnitude of energy per unit time of the noise control signal exceeds the allowable reference value.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: April 2, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jung Keun You, Jong Won Lee, Kaang Dok Yee, Chi Sung Oh, Hyun Jin Song
  • Publication number: 20240090873
    Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG MEDISON CO., LTD.
    Inventors: Kang-sik Kim, Bae-hyeong Kim, Jong-keun Song
  • Patent number: 11826198
    Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG MEDISON CO. LTD.
    Inventors: Kang-sik Kim, Bae-hyeong Kim, Jong-keun Song
  • Patent number: 11684339
    Abstract: An apparatus for estimating bio-information is provided. The apparatus includes: an ultrasound image acquirer configured to acquire ultrasound images of an object; a pressurizer configured to apply pressure to the object to occlude a blood vessel; and a processor configured to estimate a change in a diameter of the blood vessel using the ultrasound images acquired by the ultrasound image acquirer before and after an occlusion of the blood vessel, and estimate bio-information based on the estimated change in the diameter of the blood vessel.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: June 27, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: So Young Lee, Jong Keun Song, Byung Hoon Ko, Hyun Seok Moon, Sang Kon Bae, Eui Seok Shin, Jeong Eun Hwang
  • Publication number: 20230097703
    Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.
    Type: Application
    Filed: December 2, 2022
    Publication date: March 30, 2023
    Applicant: SAMSUNG MEDISON CO., LTD.
    Inventors: Kang-sik KIM, Bae-hyeong KIM, Jong-keun SONG
  • Patent number: 11540807
    Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: January 3, 2023
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Kang-sik Kim, Bae-hyeong Kim, Jong-keun Song
  • Publication number: 20220378402
    Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Applicant: SAMSUNG MEDISON CO., LTD.
    Inventors: Kang-sik KIM, Bae-hyeong KIM, Jong-keun SONG
  • Patent number: 11504090
    Abstract: An ultrasound diagnosis apparatus includes: a two-dimensional (2D) transducer array in which a plurality of transducers that transmit/receive an ultrasound signal to/from an object are arranged in two dimensions; an analog beamformer configured to perform analog beamforming in a first direction, and perform analog beamforming in a second direction perpendicular to the first direction on signals respectively received by the plurality of transducers; and a digital beamformer configured to perform digital beamforming on the signals that are analog-beamformed in the first direction, and perform digital beamforming on the signals that are analog-beamformed in the second direction.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG MEDISON CO. LTD.
    Inventors: Kang-sik Kim, Bae-hyeong Kim, Jong-keun Song
  • Patent number: 11382605
    Abstract: An ultrasound probe, including a transducer module configured to receive an echo ultrasound signal reflected from a subject in response to a transmitted ultrasound signal, and a driver chip provided in the transducer module, the driver chip being configured to focus at least one of the ultrasound signal and the echo ultrasound signal, wherein the driver chip includes a fine analog beamformer configured to apply a fine delay and a coarse analog beamformer configured to apply a coarse delay, wherein the fine analog beamformer is arranged in a first inner region of a plurality of inner regions of the driver chip, the first inner region being located opposite to the transducer module, and wherein the coarse analog beamformer is arranged in a second inner region of the plurality of inner regions of the driver chip, the second inner region being different from the first inner region.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: July 12, 2022
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Jong Keun Song, Tae Ho Jeon
  • Patent number: 11272906
    Abstract: In accordance with one aspect of the present disclosure, an ultrasound imaging apparatus comprising: an ultrasonic probe for transmitting ultrasonic waves to a target object and receiving ultrasonic waves reflected from the object; a beamforming unit for beamforming the received ultrasonic wave and outputting a beamforming signal; a sampling unit for adjusting the number of sampling times of the beamforming signal according to the amount of motion of the object; and an image processing unit for matching and synthesizing the sampled signals.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: March 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Chan Park, Jong Keun Song, Joo Young Kang, Jung Ho Kim
  • Patent number: 11181468
    Abstract: Provided is an apparatus configured to analyze a component of an object, the apparatus including a signal detection sensor including a light source configured to emit light to the object, a detector configured to detect a signal of light scattered or reflected from the object, an ultrasonic generator configured to transmit an ultrasonic wave toward the object at irregular ultrasonic transmission time intervals to modulate a frequency of the light emitted to the object, and a controller configured to control the ultrasonic transmission time intervals of the ultrasonic generator to be irregular, and a processor configured to control the signal detection sensor and analyze the component of the object based on the signal of light detected by the detector.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Wook Shim, Hyun Seok Moon, Jong Keun Song
  • Publication number: 20210251508
    Abstract: An apparatus for estimating bio-information is provided. The apparatus includes: an ultrasound image acquirer configured to acquire ultrasound images of an object; a pressurizer configured to apply pressure to the object to occlude a blood vessel; and a processor configured to estimate a change in a diameter of the blood vessel using the ultrasound images acquired by the ultrasound image acquirer before and after an occlusion of the blood vessel, and estimate bio-information based on the estimated change in the diameter of the blood vessel.
    Type: Application
    Filed: August 13, 2020
    Publication date: August 19, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: So Young LEE, Jong Keun SONG, Byung Hoon KO, Hyun Seok MOON, Sang Kon BAE, Eui Seok SHIN, Jeong Eun HWANG
  • Publication number: 20210255092
    Abstract: Provided is an apparatus configured to analyze a component of an object, the apparatus including a signal detection sensor including a light source configured to emit light to the object, a detector configured to detect a signal of light scattered or reflected from the object, an ultrasonic generator configured to transmit an ultrasonic wave toward the object at irregular ultrasonic transmission time intervals to modulate a frequency of the light emitted to the object, and a controller configured to control the ultrasonic transmission time intervals of the ultrasonic generator to be irregular, and a processor configured to control the signal detection sensor and analyze the component of the object based on the signal of light detected by the detector.
    Type: Application
    Filed: August 17, 2020
    Publication date: August 19, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Wook SHIM, Hyun Seok MOON, Jong Keun SONG
  • Patent number: 11024796
    Abstract: Provided are an ultrasonic probe and a method of manufacturing the same. The method includes: forming a plurality of grooves by removing regions of a first insulating layer and a first silicon wafer from a first substrate including the first silicon wafer and the first insulating layer; bonding a second substrate including a second silicon wafer, a second insulating layer, and a silicon thin layer to the first substrate, such that the plurality of grooves turn into a plurality of cavities; removing the second silicon wafer from the second substrate; forming transducer cells on regions of the second insulating layer corresponding to the plurality of cavities; and forming a plurality of unit substrates by cutting the first substrate, the silicon thin layer, and the second insulating layer.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Young-il Kim, Jong-keun Song, Tae-ho Jeon, Min-seog Choi
  • Publication number: 20210030395
    Abstract: A method of generating an ultrasound image includes: setting a focal point in an object; transmitting, based on a location of the focal point, ultrasound signals into the object by using a plurality of elements in a transducer; receiving, via the plurality of elements, ultrasound echo signals obtained by reflecting the ultrasound signals from the object; and performing beamforming on the received ultrasound echo signals, wherein the performing of the received ultrasound echo signals includes: setting, based on the location of the focal point, a plurality of delay times respectively corresponding to the plurality of elements; determining capacitors respectively corresponding to the plurality of elements based on the set plurality of delay times; and respectively performing the beamforming on the received ultrasound echo signals by using the determined capacitors.
    Type: Application
    Filed: April 26, 2018
    Publication date: February 4, 2021
    Inventors: Seung-woo CHO, Jong-keun SONG
  • Patent number: 10660612
    Abstract: An embodiment of the disclosure provides an ultrasound probe including a single large-area ASIC in which a plurality of ultrasonic transducer elements are bonded. According to an embodiment, an ultrasound probe comprises: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound; and an integrated circuit, in which the transducer array is bonded, including a plurality of driving elements corresponding to the plurality of transducer elements, wherein the integrated circuit comprises a time delay table configured to output time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: May 26, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il Cho, Jong Keun Song
  • Patent number: 10485512
    Abstract: The ultrasonic diagnostic apparatus includes an ultrasonic transducer array in which ultrasonic transducer elements are two-dimensionally arranged; and a controller configured to control the ultrasonic transducer elements to transmit ultrasonic signals and control the ultrasonic transducer elements arranged in rows of the ultrasonic transducer array to sequentially receive ultrasonic echo signals.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: November 26, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baehyung Kim, Youngil Kim, Jong Keun Song, Seungheun Lee, Kyungil Cho
  • Patent number: 10413275
    Abstract: Disclosed herein is an ultrasound probe including a transducer array configured to generate ultrasonic waves, an integrated circuit disposed on a back surface of the transducer array by using an adhesive member, a printed circuit board connected to the integrated circuit and configured to output a signal to the integrated circuit, and a pad bridge disposed on front surfaces of the printed circuit board and the integrated circuit by using the adhesive member and configured to electrically connect the printed circuit board with the integrated circuit. An area of a region of the ultrasound probe contacting the human body may be reduced without reducing the size of the transducer array, and the integrated circuit and the printed circuit board may be integrally connected by using the adhesive member.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsung Lee, Youngil Kim, Jong Keun Song, Minseog Choi
  • Patent number: 10368845
    Abstract: Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyungil Cho, Jong Keun Song, Seungheun Lee, Baehyung Kim, Youngil Kim
  • Patent number: 10327735
    Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il Cho, Jong Keun Song, Bae Hyung Kim, Young Il Kim, Seung Heun Lee