Patents by Inventor Jong-Kil Park

Jong-Kil Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220230059
    Abstract: Provided is a method of operating a neuron in a neuromorphic system. The method includes evaluating a membrane potential value at a corresponding time when receiving an input spike, time-modulating a synaptic weight of the membrane potential value and converting the time-modulated synaptic weight into a membrane potential value at a reference time, and generating an output spike when the membrane potential value at the reference time exceeds a certain threshold value. The membrane potential value at the reference time is represented by a floating point number including a predetermined bit of exponent and mantissa, and the floating point number includes time information. The method further includes accessing a memory and scanning a neural state variable when a timer is updated to “0” to update the neural state variable to an updated value at a reference time.
    Type: Application
    Filed: January 19, 2022
    Publication date: July 21, 2022
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong Kil PARK, In Ho KIM, Su Youn LEE, Jong Keuk PARK, Joon Young KWAK, Jae Wook KIM, Yeon Joo JEONG
  • Publication number: 20220230060
    Abstract: A neuromorphic device includes: a neuron block unit including a plurality of neurons; a synapse block unit including a plurality of synapses; and a topology block unit including a plurality of parallel Look-Up Table (LUT) modules including pre and post neuron elements configured with addresses of a presynaptic neuron and a postsynaptic neuron. Each of the plurality of neurons has an intrinsic address, each of the plurality of synapses has an intrinsic address. The parallel LUT module is partitioned based on a first synapse address among synapse addresses, and each of the partitions is indexed based on a second synapse address among the synapse addresses.
    Type: Application
    Filed: July 5, 2019
    Publication date: July 21, 2022
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Vladimir KORNIJCUK, Doo Seok JEONG, Joon Young KWAK, Jae Wook KIM, Jong Kil PARK, In Ho KIM, Jong Keuk PARK, Su Youn LEE, Yeon Joo JEONG, Joon Yeon CHANG
  • Patent number: 11381897
    Abstract: Disclosed is an eartip for an earphone. The eartip includes a fixing portion formed to have a cylindrical shape with a bottom fixedly coupled to a nozzle of an earphone, a variable portion formed to have a cylindrical shape with a bottom coupled to a top of the fixing portion and to have a length and bending which are variable, and a contact portion formed of a flexible material and including an inner section having a cylindrical shape with a bottom coupled to a top of the variable portion and an outer section extending to be rounded downward from a top end of the inner section to surround at least parts of the inner section, the variable portion, and the fixing portion and to come into contact with an external auditory meatus of a user's ear.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: July 5, 2022
    Assignee: ALMUS Corp.
    Inventors: Ju Heon Ko, Jong Won Lee, Byung Il Min, Yun Uk Ha, Jeong Kwon Park, Won Kil Yang
  • Patent number: 9288847
    Abstract: A cold crucible induction melter includes an induction coil and a melting furnace. The induction coil serves as a water cooled segment to directly transmit an induced current to a molten material in the cold crucible induction melter (CCIM), improving energy efficiency. Simultaneously, the structure of the CCIM is simplified and enables a smooth discharge even when the molten material consists of a ceramic or a metal material with a high melting point. The cold crucible induction melter heats and melts waste using an induced current which is generated in a water cooled segment by a high frequency current that is applied to the induction coil. The water cooled segment and the induction coil are disposed in a vertical direction so that the induced current that is generated by the induction coil is directly transmitted to the molten material.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 15, 2016
    Assignee: KOREA HYDRO & NUCLEAR POWER CO., LTD
    Inventors: Cheon-Woo Kim, Seok-Mo Choi, Hyun-Jun Jo, Jong-Kil Park, Young-Bu Choi
  • Publication number: 20150348906
    Abstract: An electronic device package may include a package body, an electronic device, and at least one conductive via. The package body includes a first surface and a second surface opposite to the first surface. The electronic device is disposed on the first surface. The at least one conductive via extends through the package body and includes a first end located in a mounting region of the first surface corresponding to a region on which the electronic device is disposed. The first end may have a first dimension measured along a first direction greater than a second dimension measured along a second direction substantially perpendicular to the first direction.
    Type: Application
    Filed: December 23, 2014
    Publication date: December 3, 2015
    Inventors: Jong Kil PARK, Min Young SON
  • Patent number: 8969143
    Abstract: A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: March 3, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Daniel Kim, Jae-sung You, Jong-kil Park
  • Patent number: 8946498
    Abstract: An apparatus and method for the granulation of radioactive waste in which a preprocessing method for the vitrification of radioactive waste is simplified to conform to onsite conditions of a nuclear power plant, additives are improved, and pellets suitable for vitrification are manufactured. The apparatus for the granulation of radioactive waste includes: a body frame having an inlet and an outlet; a hopper supplying the radioactive waste to be transferred and fed through the inlet; a feeder transferring/supplying the radioactive waste supplied to a specific position and in a certain quantity; a stirrer pulverizing/mixing lumps of the radioactive waste supplied; an additive supply part supplying a lubricant to the radioactive waste fed into the stirrer; and a pellet press pressing the radioactive waste fed through the feeder into a pellet shape and discharging the pellet through the outlet.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: February 3, 2015
    Assignee: Korea Hydro Nuclear Power Co., Ltd
    Inventors: Hyun-je Cho, Deuk-man Kim, Cheon-woo Kim, Jong-kil Park, Young-bu Choi
  • Publication number: 20130316479
    Abstract: A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
    Type: Application
    Filed: August 7, 2013
    Publication date: November 28, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Daniel KIM, Jae-sung YOU, Jong-kil PARK
  • Patent number: 8564005
    Abstract: A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: October 22, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-kil Park, Jae-sung You, Sung-uk Zhang, Tae-gyu Kim, Bang-weon Lee
  • Patent number: 8513680
    Abstract: A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: August 20, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Daniel Kim, Jae-sung You, Jong-kil Park
  • Publication number: 20130182740
    Abstract: A cold crucible induction melter includes an induction coil and a melting furnace. The induction coil serves as a water cooled segment to directly transmit an induced current to a molten material in the cold crucible induction melter (CCIM), improving energy efficiency. Simultaneously, the structure of the CCIM is simplified and enables a smooth discharge even when the molten material consists of a ceramic or a metal material with a high melting point. The cold crucible induction melter heats and melts waste using an induced current which is generated in a water cooled segment by a high frequency current that is applied to the induction coil. The water cooled segment and the induction coil are disposed in a vertical direction so that the induced current that is generated by the induction coil is directly transmitted to the molten material.
    Type: Application
    Filed: September 27, 2010
    Publication date: July 18, 2013
    Applicant: Korea Hydro & Nuclear Power Co., Ltd
    Inventors: Cheon-Woo Kim, Seok-Mo Choi, Hyun-Jun Jo, Jong-Kil Park, Young-Bu Choi
  • Publication number: 20130178685
    Abstract: An apparatus and method for the granulation of radioactive waste in which a preprocessing method for the vitrification of radioactive waste is simplified to conform to onsite conditions of a nuclear power plant, additives are improved, and pellets suitable for vitrification are manufactured. The apparatus for the granulation of radioactive waste includes: a body frame having an inlet and an outlet; a hopper supplying the radioactive waste to be transferred and fed through the inlet; a feeder transferring/supplying the radioactive waste supplied to a specific position and in a certain quantity; a stirrer pulverizing/mixing lumps of the radioactive waste supplied; an additive supply part supplying a lubricant to the radioactive waste fed into the stirrer; and a pellet press pressing the radioactive waste fed through the feeder into a pellet shape and discharging the pellet through the outlet.
    Type: Application
    Filed: September 27, 2010
    Publication date: July 11, 2013
    Inventors: Hyun-je Cho, Deuk-man Kim, Cheon-woo Kim, Jong-kil Park, Young-bu Choi
  • Publication number: 20130032842
    Abstract: There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 7, 2013
    Inventors: Jong Kil PARK, Sung Uk Zhang, Jong Sup Song
  • Publication number: 20120181559
    Abstract: A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 19, 2012
    Inventors: Jong-kil Park, Jae-sung You, Sung-uk Zhang, Tae-gyu Kim, Bang-weon Lee
  • Publication number: 20120153327
    Abstract: A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
    Type: Application
    Filed: September 16, 2011
    Publication date: June 21, 2012
    Inventors: Daniel Kim, Jae-sung You, Jong-kil Park
  • Publication number: 20060122450
    Abstract: An apparatus for vitrification of a spent resin containing transition metals, and a method thereof are disclosed. The apparatus includes a crucible melter comprising upper and lower chamber, a wastes-frit input port positioned at a center of the upper chamber, a plurality of oxygen injectors slantly protruding from the upper and lower surfaces of the upper chamber, and being uniformly spaced a predetermined distance from each other, an ozone sparger penetrating the lower chamber toward an upper center in the lower chamber, an ozone generator positioned at a lower end of the ozone sparger to supply ozone to the ozone sparger, and an oxygen tank connected to the ozone generator. With this construction, it is possible to prevent generation or deposition of metallic alloys and sulfides not in a glass state during vitrification of the spent resin produced from a water purification system of a nuclear power plant.
    Type: Application
    Filed: November 22, 2005
    Publication date: June 8, 2006
    Inventors: Cheon-Woo Kim, Jong-Kil Park, Sang-Woon Shin, Jong-Hyun Ha, Myung-Jae Song
  • Patent number: 5589071
    Abstract: The present invention relates to an anion-exchange membrane extractor for boric acid separation, which is capable of separating boric acid from the radioactive liquid waste concentrated by evaporation of the radioactive liquid waste produced in the pressurized light water reactor and a method of separating boric acid from the radioactive liquid waste employing the extractor. The onion-exchange membrane extractor for boric acid separation which comprises: an upper cell being equipped with an inlet, an outlet, and fluid-injecting holes; a concentrate cell, an extract cell and a lower cell, each of which is equipped with an inlet, an outlet, fluid-injecting holes, and a supporting shelf on the upper layer; a.
    Type: Grant
    Filed: July 14, 1995
    Date of Patent: December 31, 1996
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Kun-Jai Lee, Jong-Kil Park