Patents by Inventor Jong-Kook Yoon

Jong-Kook Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
    Publication number: 20070069320
    Abstract: A wiring structure may include a pad, a conductive pattern and an insulating photoresist structure. The pad may be provided on a body and electrically connected to a circuit unit of the body. The conductive pattern may be provided on the body and may be electrically connected to the pad. The insulating photoresist structure may be provided on a surface of the conductive pattern. The insulating photoresist structure may have a contact hole through which the conductive pattern may be partially exposed. The insulating photoresist structure may be fabricated by providing a photosensitive photoresist film on the conductive layer, and patterning the photosensitive photoresist film by two photo processes.
    Type: Application
    Filed: July 14, 2006
    Publication date: March 29, 2007
    Inventors: In-Young Lee, Sung-Min Sim, Dong-Hyeon Jang, Hyun-Soo Chung, Jae-Sik Chung, Seung-Kwan Ryu, Myeong-Soon Park, Jong-Kook Yoon, Ju-Il Choi