Patents by Inventor Jong Kyu MOON

Jong Kyu MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12255083
    Abstract: A semiconductor die pickup apparatus according to an aspect of the present disclosure includes a tape peeler for peeling a mount tape from a semiconductor die, and a flipper for holding the semiconductor die, wherein the tape peeler includes a housing part having a groove that faces the mount tape, a cover part covering the groove, a roller part connected to the cover part, and a vacuum part performing vacuum suction within the groove. The roller part moves to wind the cover part.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 18, 2025
    Assignee: SK hynix Inc.
    Inventors: Jae Yeong Jung, Jong Kyu Moon
  • Publication number: 20240304467
    Abstract: A method of manufacturing a semiconductor package includes disposing semiconductor chips over a substrate. The method also includes forming a dam surrounding the semiconductor chips, the dam providing a reservoir in a perimeter region of the substrate. The method further includes forming a molding layer encapsulating the semiconductor chips on the substrate. The extrusion flowing out from the molding layer is contained in the reservoir while being blocked by the dam.
    Type: Application
    Filed: June 22, 2023
    Publication date: September 12, 2024
    Applicant: SK hynix Inc.
    Inventors: Kyung Beom SEO, Jong Kyu MOON
  • Publication number: 20240014175
    Abstract: A stack package includes stacked semiconductor dies and an encapsulant. The encapsulant is formed to cover sides of the stacked semiconductor dies. A first semiconductor die of the stack package has an overhang portion that protrudes farther into the encapsulant than a second semiconductor die of the stack package.
    Type: Application
    Filed: October 28, 2022
    Publication date: January 11, 2024
    Applicant: SK hynix Inc.
    Inventors: Kyung Beom SEO, Jong Kyu MOON, Jong Hyock PARK
  • Publication number: 20230230860
    Abstract: A semiconductor die pickup apparatus according to an aspect of the present disclosure includes a tape peeler for peeling a mount tape from a semiconductor the, and a flipper for holding the semiconductor die, wherein the tape peeler includes a housing part having a groove that faces the mount tape, a cover part covering the groove, a roller part connected to the cover part, and a vacuum part performing vacuum suction within the groove. The roller part moves to wind the cover part.
    Type: Application
    Filed: June 23, 2022
    Publication date: July 20, 2023
    Applicant: SK hynix Inc.
    Inventors: Jae Yeong JUNG, Jong Kyu MOON
  • Patent number: 11501981
    Abstract: Disclosed is a method for fabricating a semiconductor package. A mold press with upper and lower chases is used. A molded underfill (MUF) material is dispensed on a bottom surface of a mold cavity to form a first dispensed pattern with a serpentine shape. A base substrate on which die stacks are mounted is loaded on the upper chase. The mold cavity in which the die stacks are inserted is closed and MUF material flows between the die stacks to impregnate the die stacks.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: November 15, 2022
    Assignee: SK hynix Inc.
    Inventors: Kyung Beom Seo, Jong Kyu Moon, Jong Hyock Park, Song Na
  • Publication number: 20220115247
    Abstract: Disclosed is a method for fabricating a semiconductor package. A mold press with upper and lower chases is used. A molded underfill (MUF) material is dispensed on a bottom surface of a mold cavity to form a first dispensed pattern with a serpentine shape. A base substrate on which die stacks are mounted is loaded on the upper chase. The mold cavity in which the die stacks are inserted is closed and MUF material flows between the die stacks to impregnate the die stacks.
    Type: Application
    Filed: March 16, 2021
    Publication date: April 14, 2022
    Applicant: SK hynix Inc.
    Inventors: Kyung Beom SEO, Jong Kyu MOON, Jong Hyock PARK, Song NA
  • Patent number: 10109545
    Abstract: Semiconductor devices are provided. The semiconductor device includes a semiconductor layer having a first surface and a second surface that are opposite each other, a through electrode penetrating the semiconductor layer and having a protrusion that protrudes over the second surface of the semiconductor layer, a front-side bump disposed over the first surface of the semiconductor layer and electrically coupled to the through electrode, a polymer pattern disposed over the second surface of the semiconductor layer to enclose a part of the protrusion of the through electrode, and a back-side bump covering an upper surface and a sidewall of a remaining part of the protrusion of the through electrode and extending over a portion of the polymer pattern.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: October 23, 2018
    Assignee: SK HYNIX INC.
    Inventors: Jong Kyu Moon, Jong Hoon Kim, Sung Su Park
  • Patent number: 9773756
    Abstract: A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a terrace-like edge. The external connectors may be disposed over a first surface of the first semiconductor die. The second semiconductor dies may be stacked over a second surface of the first semiconductor die. The mold layer may cover sidewalls of the second semiconductor dies. The outer packaging part may have a groove in which a stack structure of the first and second semiconductor dies are accommodated. The terrace-like edge may be disposed under an edge of the mold layer to expose a sidewall of the first semiconductor die. A portion of an outer sidewall of the mold layer may be in contact with a portion of an inner surface of the outer packaging part, and the inner surface of the outer packaging part may be spaced apart from the sidewall of the first semiconductor die by the terrace-like edge.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: September 26, 2017
    Assignee: SK hynix Inc.
    Inventors: Jong Kyu Moon, Jong Won Kim, Wan Choon Park
  • Publication number: 20170186659
    Abstract: Semiconductor devices are provided. The semiconductor device includes a semiconductor layer having a first surface and a second surface that are opposite each other, a through electrode penetrating the semiconductor layer and having a protrusion that protrudes over the second surface of the semiconductor layer, a front-side bump disposed over the first surface of the semiconductor layer and electrically coupled to the through electrode, a polymer pattern disposed over the second surface of the semiconductor layer to enclose a part of the protrusion of the through electrode, and a back-side bump covering an upper surface and a sidewall of a remaining part of the protrusion of the through electrode and extending over a portion of the polymer pattern.
    Type: Application
    Filed: March 15, 2017
    Publication date: June 29, 2017
    Inventors: Jong Kyu MOON, Jong Hoon KIM, Sung Su PARK
  • Publication number: 20170154872
    Abstract: A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a terrace-like edge. The external connectors may be disposed over a first surface of the first semiconductor die. The second semiconductor dies may be stacked over a second surface of the first semiconductor die. The mold layer may cover sidewalls of the second semiconductor dies. The outer packaging part may have a groove in which a stack structure of the first and second semiconductor dies are accommodated. The terrace-like edge may be disposed under an edge of the mold layer to expose a sidewall of the first semiconductor die. A portion of an outer sidewall of the mold layer may be in contact with a portion of an inner surface of the outer packaging part, and the inner surface of the outer packaging part may be spaced apart from the sidewall of the first semiconductor die by the terrace-like edge.
    Type: Application
    Filed: March 25, 2016
    Publication date: June 1, 2017
    Inventors: Jong Kyu MOON, Jong Won KIM, Wan Choon PARK
  • Publication number: 20150270220
    Abstract: Semiconductor devices are provided. The semiconductor device includes a semiconductor layer having a first surface and a second surface that are opposite each other, a through electrode penetrating the semiconductor layer and having a protrusion that protrudes over the second surface of the semiconductor layer, a front-side bump disposed over the first surface of the semiconductor layer and electrically coupled to the through electrode, a polymer pattern disposed over the second surface of the semiconductor layer to enclose a part of the protrusion of the through electrode, and a back-side bump covering an upper surface and a sidewall of a remaining part of the protrusion of the through electrode and extending over a portion of the polymer pattern.
    Type: Application
    Filed: August 22, 2014
    Publication date: September 24, 2015
    Inventors: Jong Kyu MOON, Jong Hoon KIM, Sung Su PARK
  • Publication number: 20150123278
    Abstract: Semiconductor devices are provided. The semiconductor device includes a through electrode penetrating a substrate such that an end portion of the through electrode protrudes from a surface of the substrate, a passivation layer covering the surface of the substrate and defining a plug hole that exposes the end portion of the through electrode, and a barrier plug filling the plug hole. Related methods, related memory cards and related electronic systems are also provided.
    Type: Application
    Filed: April 7, 2014
    Publication date: May 7, 2015
    Applicant: SK HYNIX INC.
    Inventors: Sung Su PARK, Jong Kyu MOON, Wan Choon PARK, Bae Yong KIM