Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.

Abstract: A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.

Abstract: A semiconductor device includes: a semiconductor device, comprising: a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate; a storage node contact plug that is spaced apart from the bit line structure; a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; and a seed liner that is positioned between the conformal spacer and the bit line and thinner than the conformal spacer.

Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.

Abstract: A quantization device includes: a trellis-structured vector quantizer which quantizes a first error vector between an N-dimensional (here, “N” is two or more) subvector and a first predictive vector; and an inter-frame predictor which generates a first predictive vector from the quantized N-dimensional subvector, wherein the inter-frame predictor uses a predictive coefficient comprising an N×N matrix and performs an inter-frame prediction using the quantized N-dimensional subvector of a previous stage.

Abstract: A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.

Abstract: A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device includes a housing, a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device, and a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.