Patents by Inventor Jong Min JUNG

Jong Min JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961223
    Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: April 16, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SOOKMYUNG WOMEN'S UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jong Ho Park, Chang Gon Kim, Chul Woo Jung, Sang Min Lee, Min Kyoo Kang, Ji Un Lee, Kwang Hyeon Hwang, Nam Woo Kang, So Young Yoo, Seong Sin Kim, Sung Hee Lee
  • Publication number: 20240081404
    Abstract: Provided is a heater for an aerosol-generating device including a first electrically conductive pattern configured to perform heating and a second electrically conductive pattern arranged in parallel with the first electrically conductive pattern. The first electrically conductive pattern and/or the second electrically conductive pattern may include a material having a relatively small resistance temperature coefficient. Accordingly, a temperature increase rate of the heater may be greatly improved.
    Type: Application
    Filed: January 13, 2022
    Publication date: March 14, 2024
    Applicant: KT&G CORPORATION
    Inventors: Jong Seong JEONG, Gyoung Min GO, Hyung Jin BAE, Jang Won SEO, Chul Ho JANG, Min Seok JEONG, Jin Chul JUNG
  • Publication number: 20240088326
    Abstract: A light device including a substrate, and first and second light emitters spaced apart from each other, and a power source to control the first light emitter and the second light emitter, in which the first and second light emitters include a light emitting region, a wavelength conversion layer disposed on the light emitting region, and a lateral reflection layer covering a region of a side of the light emitting region and the wavelength conversion layer, the first light emitter and the second light emitter are configured to output the same or different magnitudes of power by receiving the same or different magnitudes of current, the first and second light emitters are respectively configured to emit first light and second light, the first light emitter is electrically connected to the second light emitter through a common electrode.
    Type: Application
    Filed: October 30, 2023
    Publication date: March 14, 2024
    Inventors: Bang Hyun KIM, Young-Hye Seo, Jae Ho Lee, Jong Min Lee, Seoung Ho Jung, Eui Sung Jeong
  • Patent number: 9768106
    Abstract: A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top inner output conductive patterns, a plurality of bottom inner output conductive patterns and a plurality of landing vias. The top inner output conductive patterns are formed on the top surface of the base film and respectively connected to chip inner output pads formed on a bottom surface of the semiconductor chip. The bottom inner output conductive patterns are formed on a bottom surface of the base film. The landing vias are formed to vertically penetrate the base film and to respectively connect the top inner output conductive patterns and the bottom inner output conductive patterns. The landing vias are arranged within the chip mounting region to form a two-dimensional shape.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Jin Cho, Jong-Min Jung, Yun-Ji Hur, Sung-Sik Park, Keun-Bong Lee
  • Publication number: 20160218053
    Abstract: A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top inner output conductive patterns, a plurality of bottom inner output conductive patterns and a plurality of landing vias. The top inner output conductive patterns are formed on the top surface of the base film and respectively connected to chip inner output pads formed on a bottom surface of the semiconductor chip. The bottom inner output conductive patterns are formed on a bottom surface of the base film. The landing vias are formed to vertically penetrate the base film and to respectively connect the top inner output conductive patterns and the bottom inner output conductive patterns. The landing vias are arranged within the chip mounting region to form a two-dimensional shape.
    Type: Application
    Filed: January 11, 2016
    Publication date: July 28, 2016
    Inventors: Young-Jin CHO, Jong-Min JUNG, Yun-Ji HUR, Sung-Sik PARK, Keun-Bong LEE
  • Publication number: 20080141338
    Abstract: A secure policy description method and apparatus for a secure operation system are provided. In the secure policy description method, a secure policy template is defined to have a subject, an object, and a permission assigned to the subject corresponding to the object. Then, the defined secure policy template is transformed to a TE (Type Enforcement) secure policy to be applied to a SELinux (Security enhanced Linux).
    Type: Application
    Filed: June 27, 2007
    Publication date: June 12, 2008
    Inventors: Dong Wook KIM, Kang Ho KIM, Baik Song AN, Sung In JUNG, Myung Joon KIM, Bong Nam NOH, Jung Sun KIM, Min Soo KIM, Jong Min JUNG