Abstract: Example embodiments relate to a method of measurement, an apparatus for measurement, and an ingot growing system that measure properties relating an induction heating characteristic of a graphite article. The method of measurement comprises an arranging step of arranging a graphite article to the coil comprising a winded conducting wire; and a measuring step of applying power for measurement to the coil through means of measurement connected electronically to the coil, and measuring electromagnetic properties induced in the coil. The method of measurement and the like measure electromagnetic properties of graphite articles like an ingot growing container, and an insulating material, and provide data required for selecting so that further enhanced reproducibility for growth of an ingot can be secured.

Abstract: The embodiments relate to an electrochromic device having flexibility while achieving an excellent light transmission variable function based on the electrochromic principle. The electrochromic device comprises a light transmission variable structure interposed between a first base layer and a second base layer, wherein the light transmission variable structure comprises a first chromic layer and a second chromic layer, and the value of ?TTd24 as defined in Equation (1) is 3% or less.

Abstract: A circuit board assembly includes a main board and a connection board attached to the main board. The connection board includes a base board including a connecting pad area and a mounting area, wherein the connection board is attached to the main board in the connecting pad area, and wherein the mounting area is spaced apart from the connecting pad area in a first direction and includes a driving chip mounted thereon. The connection board further includes first connection pads disposed on the connecting pad area of the base board, and second connection pads disposed on the connecting pad area of the base board. The main board includes first main pads connected to the first connection pads in a one-to-one connection and a second main pad connected to the second connection pads in a many-to-one connection.

Abstract: A method for preparing a SiC ingot includes: preparing a reactor by disposing a raw material in a crucible body and disposing a SiC seed in a crucible cover, and then wrapping the crucible body with a heat insulating material having a density of 0.14 to 0.28 g/cc; and growing the SiC ingot from the SiC seed by placing the reactor in a reaction chamber and adjusting an inside of the reactor to a crystal growth atmosphere such that the raw material is vapor-transported and deposited to the SiC seed.

Abstract: Embodiments relate to a polythiourethane-based plastic lens. When a polythiourethane-based plastic lens is polymerized according to the embodiment, the types, contents, and the like of the polythiol compounds and the isocyanate compounds are adjusted to control the storage moduli at room temperature and high temperatures, their variations, the energy attenuation (KEL) obtained therefrom, and the glass transition temperature, whereby the polythiourethane-based plastic lens thus obtained is enhanced in impact resistance and thermal resistance.

Abstract: A wafer having relaxation moduli different by 450 GPa or less, as determined by dynamic mechanical analysis, when loaded to 1 N and 18 N with a loading rate of 0.1 N/min at a temperature of 25° C.

Abstract: A method for preparing a SiC ingot includes: disposing a raw material and a SiC seed crystal facing each other in a reactor having an internal space; subliming the raw material by controlling a temperature, a pressure, and an atmosphere of the internal space; growing the SiC ingot on the seed crystal; and collecting the SiC ingot after cooling the reactor. The wafer prepared from the ingot, which is prepared from the method, generates cracks when an impact is applied to a surface of the wafer, the impact is applied by an external impact source having mechanical energy, and a minimum value of the mechanical energy is 0.194 J to 0.475 J per unit area (cm2).

Abstract: A SiC ingot includes: a main body including a first cross-sectional plane of the main body and a second cross-sectional plane of the main body facing the first cross-sectional plane; and a protrusion disposed on the second cross-sectional plane and including a convex surface from the second cross-sectional plane of the main body, wherein a first end point disposed at one end of the second cross sectional plane, a second end point disposed at another end of the second cross sectional plane, and a peak point disposed on the convex surface are disposed on a third cross-sectional plane of the main body perpendicular to the first cross-sectional plane, and wherein a radius of curvature of an arc corresponding to a line of intersection between the third cross-sectional plane and the convex surface satisfies Equation 1 below: 3D?r?37D??[Equation 1] where r is the radius of curvature of the arc corresponding to the line of intersection between the third cross-sectional plane and the convex surface, and D is a lengt

Abstract: An adhesive layer of seed crystal includes a graphitized adhesive layer, wherein the graphitized adhesive layer is prepared by heat-treating a pre-carbonized adhesive layer, and wherein the adhesive layer has Vr value of 28%/mm3 or more, and the Vr value is represented by Equation 1 below: Vr ? = { Sq ( V ? 1 - V ? 2 ) } × 1 ? 0 3 [ Equation ? ? 1 ] where Sg (%) is represented by Equation 2 below, V1 is a volume (mm3) of the pre-carbonized adhesive layer, and V2 is a volume (mm3) of the graphitized adhesive layer, Sg ? = { 1 - ( A ? 2 A ? 1 ) } × 1 ? 0 ? 0 ? % [ Equation ? ? 2 ] where A1 is an area (mm2) of the pre-carbonized adhesive layer, and A2 is an area (mm2) of the graphitized adhesive layer.

Abstract: A circuit board assembly includes a main board and a connection board attached to the main board. The connection board includes a base board including a connecting pad area and a mounting area, wherein the connection board is attached to the main board in the connecting pad area, and wherein the mounting area is spaced apart from the connecting pad area in a first direction and includes a driving chip mounted thereon. The connection board further includes first connection pads disposed on the connecting pad area of the base board, and second connection pads disposed on the connecting pad area of the base board. The main board includes first main pads connected to the first connection pads in a one-to-one connection and a second main pad connected to the second connection pads in a many-to-one connection.

Abstract: A method for preparing a SiC ingot includes preparing a crucible assembly comprising a crucible body having an internal space, loading a raw material into the internal space of the crucible body and placing a plurality of SiC seed in the internal space of the crucible body at regular intervals spaced apart from the raw material, and growing the SiC ingot from the plurality of SiC seed by adjusting the internal space of the crucible body to a crystal growth atmosphere such that the raw material is vapor-transported and deposited to the plurality of SiC seed. A density of the crucible body may be 1.70 to 1.92 g/cm3.

Abstract: The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed.

Abstract: An embodiment relates to an aromatic polythiol compound for optical materials, and the aromatic polythiol compound according to the embodiment contains a phenyl group and a large number of sulfur atoms in its polythiol structure so that a polymerizable composition and an optical material obtained therefrom have excellent optical properties such as high refractive index and low specific gravity, as well as excellent mechanical properties such as low cure shrinkage; thus, they can be advantageously used for producing various plastic optical lenses such as eyeglass lenses and camera lenses.

Abstract: Embodiments relate to a polymerizable composition comprising a phosphorus-based mold releasing agent for an optical use whose preparation process is improved, and a process for preparing the phosphorus-based mold releasing agent. The phosphorus-based mold releasing agents can be prepared more easily and conveniently by using phosphorous pentoxide, which can easily react with a monoalcohol and/or water at room temperature in the absence of a catalyst or a solvent. In addition, byproducts are not generated during the reaction. Thus, when a lens is produced by using the mold release agent obtained therefrom, it is possible to prevent a defective appearance of the lens that may be caused by byproducts, thereby further enhancing the appearance properties thereof. Further, since separate steps for removing byproducts, specifically, such steps as washing and filtration, are not required, wastewater is not generated.

Abstract: The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed.

Abstract: The embodiments relate to an electrochromic device having flexibility while achieving an excellent light transmission variable function based on the electrochromic principle. The electrochromic device comprises a light transmission variable structure interposed between a first base layer and a second base layer, wherein the light transmission variable structure comprises a first chromic layer and a second chromic layer, and the value of ?TTd24 as defined in Equation (1) is 3% or less.

Abstract: A wafer having relaxation moduli different by 450 GPa or less, as determined by dynamic mechanical analysis, when loaded to 1 N and 18 N with a loading rate of 0.1 N/min at a temperature of 25° C.

Abstract: In the method and the apparatus for releasing a molded article from a mold according to the embodiments, the lateral of the molded article in the mold is pressed, so that it is possible to minimize the damage of the mold and the molded article at the time of the release, while the amount of a mold release agent used is minimized.

Abstract: A connector assembly and a display device are provided. A connector assembly includes a first connector comprising a long-side portion at which a plurality of signal terminals is located and a short-side portion at which a power source voltage terminal is located, and a printed circuit board including a plurality of signal printed lines connected to the plurality of signal terminals and a power source voltage printed line connected to the power source voltage terminal, the first connector being arranged on the printed circuit board.

Abstract: A display device includes a display panel including a plurality of data lines and a plurality of color pixels arranged into rows, a black-grayscale correcting circuit, and a data driving circuit. The black-grayscale circuit corrects a black-level of black-grayscale data of input grayscale data to generate corrected image data. The black-grayscale circuit corrects the black-grayscale data to be applied to a current one of the rows during a current horizontal period based on the input grayscale data to be applied to a previous one of the rows during a previous horizontal period and the input grayscale data to be applied to a next one of the rows during a next horizontal period. The data driving circuit converts the corrected image data into data voltages for output to the data lines.