Patents by Inventor Jong Min Shin

Jong Min Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11118844
    Abstract: Methods for preparing a heat pipe are provided. The methods may include forming a metal foam on a surface of a first metal sheet using a slurry, placing the first metal sheet on a second metal sheet, and bonding outer portions of the first and second metal sheets. The surface of the first metal sheet faces the second metal sheet.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 14, 2021
    Inventors: Jong Min Shin, Dong Woo Yoo, So Jin Kim
  • Publication number: 20210269696
    Abstract: The present application provides a composite material and a method for producing the same. The present application can provide a composite material which comprises a metal foam and a polymer component, and has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity.
    Type: Application
    Filed: June 28, 2019
    Publication date: September 2, 2021
    Inventors: So Jin KIM, Jong Min SHIN, Dong Woo YOO
  • Publication number: 20210265112
    Abstract: The present application relates to a composite material. According to the present application, a composite material having high magnetic permeability and excellent other physical properties such as flexibility, electrical insulation, mechanical properties and/or resistance to heat or oxidation can be provided in a simple and economical process.
    Type: Application
    Filed: June 28, 2019
    Publication date: August 26, 2021
    Inventors: Dong Woo YOO, Jong Min SHIN, Jin Kyu LEE
  • Publication number: 20210259143
    Abstract: The present application relates to an electromagnetic wave shielding film, which can provide an electromagnetic wave shielding film having excellent mechanical strength, flexibility, electrical insulation properties, bonding properties with other constituents, oxidation and high-temperature stability and the like, while having excellent electromagnetic shielding ability.
    Type: Application
    Filed: June 28, 2019
    Publication date: August 19, 2021
    Inventors: Jong Min Shin, Dong Woo YOO, Jin Kyu LEE
  • Patent number: 11028189
    Abstract: An method for preparing an anion polymerization initiator, a device for preparing the same and an anion polymerization initiator prepared therefrom are provided. And the method for preparing an anion polymerization initiator according to present invention is characterized in that an amine compound of Formula 1 and/or Formula 2; an organometallic compound; and/or a conjugated diene compound are introduced in the form of a solution and reacted.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 8, 2021
    Inventors: Jae Hoon Choe, Jong Young Choi, Jung Yong Lee, Dong Cheol Choe, Hyun Ju Kim, Hyeon Hui Kim, Jong Min Shin, Woong Chan Jeong, Kwang Ho Song
  • Publication number: 20210154739
    Abstract: The present application provides a method for preparing a metal foam. The present application provides a method which can freely control characteristics, such as pore size and porosity, of the metal foam, prepare the metal foam in the form of films or sheets which have conventionally been difficult to produce, particularly the form of thin films or sheets as well, and prepare a metal foam having excellent other physical properties such as mechanical strength. According to one example of the present application, it is possible to efficiently form a structure in which such a metal foam is integrated on a metal base material with good adhesive force.
    Type: Application
    Filed: May 15, 2018
    Publication date: May 27, 2021
    Inventors: SO JIN KIM, JONG MIN SHIN, JIN KYO LEE
  • Publication number: 20210138768
    Abstract: The present application can provide a composite material which comprises a metal foam, a polymer component and an electrically conductive filler, has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity, and is also capable of controlling electrical conductivity characteristics.
    Type: Application
    Filed: July 6, 2018
    Publication date: May 13, 2021
    Inventors: Jong Min SHIN, Dong Woo YOO, So Jin KIM
  • Publication number: 20200290085
    Abstract: The present application provides a method for preparing a composite material. The present application provides a method for preparing a composite material comprising a metal foam and a polymer component, wherein the polymer component is formed in an asymmetrical structure on both sides of the metal foam, and a composite material prepared in such a manner.
    Type: Application
    Filed: September 17, 2018
    Publication date: September 17, 2020
    Inventors: Dong Woo YOO, Jong Min SHIN
  • Publication number: 20200270501
    Abstract: The present application provides a composite material and a method for preparing the same. The present application can provide a composite material which comprises a metal foam, a polymer component and a thermally conductive filler, and has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity.
    Type: Application
    Filed: September 14, 2018
    Publication date: August 27, 2020
    Inventors: Jong Min SHIN, Dong Woo YOO, So Jin KIM
  • Publication number: 20200270409
    Abstract: The present application can provide a composite material which comprises a metal foam and a polymer component and has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity.
    Type: Application
    Filed: September 17, 2018
    Publication date: August 27, 2020
    Inventors: Jong Min SHIN, Dong Woo YOO, Jin Kyu LEE
  • Publication number: 20200246873
    Abstract: The present application provides a method for producing a film. In the present application, for example, a method for producing a film which can be applied to production of a heat-dissipating material such as a heat pipe can be provided.
    Type: Application
    Filed: September 21, 2018
    Publication date: August 6, 2020
    Inventors: So Jin KIM, Jong Min SHIN, Dong Woo YOO
  • Publication number: 20200216715
    Abstract: The present application provides a composite material and a method for preparing the same. The present application can provide a composite material which comprises a metal foam and a polymer component and if necessary, further comprises a thermally conductive filler, and has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity.
    Type: Application
    Filed: September 21, 2018
    Publication date: July 9, 2020
    Inventors: SO JIN KIM, JONG MIN SHIN
  • Publication number: 20200172764
    Abstract: The present application provides a method for preparing a composite material. The present application provides a method for preparing a composite material comprising a metal porous body and a polymer component, wherein the polymer component is formed in an asymmetrical structure, and a composite material prepared in such a manner.
    Type: Application
    Filed: July 6, 2018
    Publication date: June 4, 2020
    Inventors: JONG MIN SHIN, JIN KYU LEE, DONG WOO YOO
  • Publication number: 20200158445
    Abstract: The present application provides a method for preparing a heat pipe. The present application can provide a method for preparing a heat pipe exhibiting excellent heat dissipation characteristics and durability even when formed to a thin thickness as necessary.
    Type: Application
    Filed: May 15, 2018
    Publication date: May 21, 2020
    Inventors: Jong Min SHIN, Dong Woo YOO, So Jin KIM
  • Patent number: 10649502
    Abstract: An electronic apparatus includes a communicator; and a processor configured to: transmit a message including a communication connection order among a plurality of terminals to the plurality of terminals through the communicator, and control the communicator to sequentially perform connections with the plurality of terminals corresponding to association requests respectively received from the plurality of terminals after transmitting the message.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 12, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Min Shin, Seung Wook Choi, Jin Young Bae, Chang Lae Jo
  • Publication number: 20200070248
    Abstract: The present application provides a method for manufacturing a metal foam. The present application can provide a method for manufacturing a metal foam, which is capable of forming a metal foam comprising uniformly formed pores and having excellent mechanical properties as well as the desired porosity, and a metal foam having the above characteristics. In addition, the present application can provide a method capable of forming a metal foam in which the above-mentioned physical properties are ensured, while being in the form of a thin film or sheet, within a fast process time, and such a metal foam.
    Type: Application
    Filed: November 29, 2017
    Publication date: March 5, 2020
    Inventors: Dong Woo YOO, Jin Kyu LEE, Jong Min SHIN
  • Publication number: 20190196554
    Abstract: An electronic apparatus includes a communicator; and a processor configured to: transmit a message including a communication connection order among a plurality of terminals to the plurality of terminals through the communicator, and control the communicator to sequentially perform connections with the plurality of terminals corresponding to association requests respectively received from the plurality of terminals after transmitting the message.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong Min SHIN, Seung Wook CHOI, Jin Young BAE, Chang Lae JO
  • Patent number: 10301327
    Abstract: A method for preparing an anionic polymerization initiator, a device for manufacturing the same, and an anionic polymerization initiator prepared therefrom is provided. And the method for preparing an anionic polymerization initiator according to the present invention is characterized in that in a continuous reactor an amine compound of Formula 1 and/or Formula 2; an organometallic compound; and/or a conjugated diene compound are introduced in the form of a solution and reacted.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: May 28, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Jae Hoon Choe, Dong Cheol Choe, Hyun Ju Kim, Hyeon Hui Kim, Jong Young Choi, Jung Yong Lee, Woong Chan Jeong, Jong Min Shin, Chan Joong Kim, Kwang Ho Song
  • Patent number: 10287404
    Abstract: The present application relates to a polymer particle manufacturing method, and according to an example of the manufacturing method and a manufacturing apparatus therefor, a reduction in energy can be achieved by simplifying a manufacturing process thereof.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: May 14, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Woong Chan Jeong, Jae Hoon Choe, Hyun Ju Kim, Jong Min Shin
  • Publication number: 20180291038
    Abstract: A method for preparing an anionic polymerization initiator, a device for manufacturing the same, and an anionic polymerization initiator prepared therefrom is provided. And the method for preparing an anionic polymerization initiator according to the present invention is characterized in that in a continuous reactor an amine compound of Formula 1 and/or Formula 2; an organometallic compound; and/or a conjugated diene compound are introduced in the form of a solution and reacted.
    Type: Application
    Filed: July 27, 2016
    Publication date: October 11, 2018
    Applicant: LG Chem, Ltd.
    Inventors: Jae Hoon Choe, Dong Cheol Choe, Hyun Ju Kim, Hyeon Hui Kim, Jong Young Choi, Jung Yong Lee, Woong Chan Jeong, Jong Min Shin, Chan Joong Kim, Kwang Ho Song