Patents by Inventor Jong-Myeon Lee

Jong-Myeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board
    Patent number: 10104767
    Abstract: A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: October 16, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung-Gi Ha, Jong-Myeon Lee, Jong-Rip Kim
  • Electronic component package
    Patent number: 9786573
    Abstract: An electronic component package includes: a core including a cavity, a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, wherein a thickness of the first resin layer is different from a thickness of the second resin layer.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: October 10, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong-Rip Kim, Doo-Hwan Lee, Jong-Myeon Lee
  • PRINTED CIRCUIT BOARD
    Publication number: 20170079143
    Abstract: A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.
    Type: Application
    Filed: March 28, 2016
    Publication date: March 16, 2017
    Applicant: Samsung Electro-Mechanic Co., Ltd.
    Inventors: Hyung-Gi HA, Jong-Myeon LEE, Jong-Rip KIM
  • ELECTRONIC COMPONENT PACKAGE
    Publication number: 20170018474
    Abstract: An electronic component package includes: a core including a cavity, a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, wherein a thickness of the first resin layer is different from a thickness of the second resin layer.
    Type: Application
    Filed: July 8, 2016
    Publication date: January 19, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong-Rip KIM, Doo-Hwan LEE, Jong-Myeon LEE
  • Multilayered piezoelectric/electrostrictive ceramic actuator
    Patent number: 6504287
    Abstract: The present invention relates a manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by a sintering process at low temperature. The present invention makes feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: January 7, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Jong-Myeon Lee
  • Multilayered piezoelectric/electrostrictive ceramic actuator
    Publication number: 20020125793
    Abstract: The present invention relates a manufacturing method of a multilayered piezoelectric/electrostrictive ceramic actuator by sintering process at low temperature and a multilayered piezoelectric/electrostrictive ceramic actuator manufactured by the method. The present invention as above makes effect feasible of high quality image and high speed printing as large displacement and high speed actuating is feasible because it can get great displacement and driving speed even with small variation in driving voltage because of piezoelectric/electrostrictive layer and upper electrode altenatingly heaped to multilayer.
    Type: Application
    Filed: December 12, 2001
    Publication date: September 12, 2002
    Applicant: SAMSUNG ELECTRO-MECHANICS CO.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Jong-Myeon Lee
  • Manufacturing method of multilayered piezoelectric/electrostrictive ceramic actuator
    Patent number: 6347441
    Abstract: A manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by sintering process at low temperature, making feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: February 19, 2002
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Jong-Myeon Lee