Patents by Inventor Jong Nam MOON

Jong Nam MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cutting substrate
    Patent number: 9688094
    Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: June 27, 2017
    Assignees: Samsung Display Co., Ltd., Philoptics Co., Ltd.
    Inventors: Il Young Jeong, Tae Yong Kim, Cheol Lae Roh, Je Kil Ryu, Jeong Hun Woo, Gyoo Wan Han, Ki Su Han, Tae Hyoung Cho, Jong Nam Moon
  • METHOD FOR CUTTING SUBSTRATE
    Publication number: 20160114617
    Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
    Type: Application
    Filed: January 4, 2016
    Publication date: April 28, 2016
    Inventors: Il Young JEONG, Tae Yong KIM, Cheol Lae ROH, Je Kil RYU, Jeong Hun WOO, Gyoo Wan HAN, Ki Su HAN, Tae Hyoung CHO, Jong Nam MOON
  • Method for cutting substrate
    Patent number: 9299613
    Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: March 29, 2016
    Assignees: Samsung Display Co., Ltd., Philoptics Co., Ltd.
    Inventors: Il Young Jeong, Tae Yong Kim, Cheol Lae Roh, Je Kil Ryu, Jeong Hun Woo, Gyoo Wan Han, Ki Su Han, Tae Hyoung Cho, Jong Nam Moon
  • METHOD FOR CUTTING SUBSTRATE
    Publication number: 20150108089
    Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
    Type: Application
    Filed: July 7, 2014
    Publication date: April 23, 2015
    Inventors: Il Young JEONG, Tae Yong KIM, Cheol Lae ROH, Je Kil RYU, Jeong Hun WOO, Gyoo Wan HAN, Ki Su HAN, Tae Hyoung CHO, Jong Nam MOON