Abstract: A semiconductor die stack structure includes a base die, a plurality of semiconductor die stack units, and bumps. Each of the plurality of semiconductor die stack units includes a lower semiconductor die and an upper semiconductor die. Each of the lower semiconductor die and the upper semiconductor die includes a body and a front-side pad structure. The front-side pad structure includes a front-side pad seed layer and a front-side pad pattern. The front-side pad pattern includes a first front-side pad portion, a second front-side pad portion, and a third front-side pad portion. The first front-side pad portion and the second front-side pad portion forms a staircase. The first front-side pad portion and the third front-side pad form a reverse staircase. The first front-side pad portion, the second front-side pad portion, and the third front-side pad include a same metal.

Abstract: Disclosed are a frictional resistance reducing device that effectively reduces the frictional resistance of a ship, and a ship including same. The frictional resistance reducing device comprises: a first air discharge part formed on the leading undersurface of a ship and discharging air into water; a second air discharge part formed behind the first air discharge part and discharging air into water; and an air supplying source supplying air to the first air discharge part and the second air discharge part, wherein the first air discharge part and the second air discharge part are disposed in-line along the lengthwise direction of the ship, and at least a portion of a first air discharge period of the first air discharge part and at least a portion of a second air discharge period of the second air discharge part overlap each other.

Abstract: Disclosed are a frictional resistance reducing device that effectively reduces the frictional resistance of a ship, and a ship including same. The frictional resistance reducing device comprises: a first air discharge part formed on the leading undersurface of a ship and discharging air into water, a second air discharge part formed behind the first air discharge part and discharging air into water; and an air supplying source supplying air to the first air discharge part and the second air discharge part, wherein the first air discharge part and the second air discharge part are disposed in-line along the lengthwise direction of the ship, and at least a portion of a first air discharge duration of the first air discharge part and at least a portion of a second air discharge duration of the second air discharge part overlap each other.

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract: An inductor is provided which includes a plurality of via holes vertically passing through a substrate, the substrate having insulating properties, vertical conductive portions filling the via holes, and horizontal conductive portions connecting each individual vertical conductive portions at the top and the bottom of the substrate to form a single coil structure with the vertical conductive portions.

Abstract: In a method for manufacturing an FBAR device, the device includes a substrate having a certain size, at least one device functional portion performing a resonance function by responding to electrical signals applied from the outside, the device functional portion being formed along a center portion of the substrate while defining a certain air gap therein, plural external electrodes formed on an upper surface of the substrate substantially coming into contact with both opposite edges of the upper surface, the external electrodes being electrically connected to the device functional portion, and a cap bonded onto the substrate so as to function as a cover for covering a remaining portion of the substrate except for the plural external electrodes.

Abstract: The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.

Abstract: Disclosed herein is a film bulk acoustic resonator (FBAR), an FBAR based duplexer device, and a manufacturing method thereof, which a plurality of sacrificial layer units are formed on a substrate wafer so as to be spaced apart from one another at regular distances, and device functional portions are formed on the sacrificial layer units, respectively. The device functional portions have a piezoelectric layer unit and a plurality of electrodes. Then, side wall and roof of protective formed by the use of dry film. After hardening the dry film, the wafer is cut into a plurality of the wafer sections so as to contain the device functional portions, respectively.

Abstract: Disclosed herein is an FBAR based duplexer device and a manufacturing method thereof, which can achieve miniaturization, and reduction of a manufacturing cost and enhancement of a yield due to a simplified process. According to the present invention, first, a plurality of FBAR chips are prepared. Each of the FBAR chips includes a substrate, air gaps and piezoelectric layer unit; which are successively arranged, a plurality of electrode pads electrically connected to the piezoelectric layer unit, and bump balls formed on the electrode pads in a one to one ratio. Then, a duplexer substrate having a duplexing circuit is prepared, and a plurality of the FBAR chips come into contact with the duplexer substrate. In this state, they are reversed so that the substrates of the FBAR chips face upward, and the bump balls are bonded to the duplexer substrate.

Abstract: Disclosed herein is an FBAR based duplexer device and a manufacturing method thereof, which can achieve miniaturization, and reduction of a manufacturing cost and enhancement of a yield due to a simplified process. According to the present invention, first, a plurality of FBAR chips are prepared. Each of the FBAR chips comprises a substrate, air gaps and piezoelectric layer unit, which are successively arranged, a plurality of electrode pads electrically connected to the piezoelectric layer unit, and bump balls formed on the electrode pads in a one to one ratio. Then, a duplexer substrate having a duplexing circuit is prepared, and a plurality of the FBAR chips come into contact with the duplexer substrate. In this state, they are reversed so that the substrates of the FBAR chips face upward, and the bump balls are bonded to the duplexer substrate.