Patents by Inventor Jong Ok Chun
Jong Ok Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230275061Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: May 8, 2023Publication date: August 31, 2023Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 11646290Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: June 7, 2021Date of Patent: May 9, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Publication number: 20220052016Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: June 7, 2021Publication date: February 17, 2022Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 11031366Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: June 10, 2019Date of Patent: June 8, 2021Assignee: Amkor Technology Singapore Pte. Ltd.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Publication number: 20190371760Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: June 10, 2019Publication date: December 5, 2019Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 10424556Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: August 15, 2016Date of Patent: September 24, 2019Assignee: Amkor Technology, Inc.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Publication number: 20160351525Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: August 15, 2016Publication date: December 1, 2016Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 9433117Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: May 18, 2012Date of Patent: August 30, 2016Assignee: AMKOR TECHNOLOGY, INC.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 8199518Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: February 18, 2010Date of Patent: June 12, 2012Assignee: Amkor Technology, Inc.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 8129824Abstract: A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.Type: GrantFiled: December 3, 2008Date of Patent: March 6, 2012Assignee: Amkor Technology, Inc.Inventors: Roger D. St. Amand, Nozad O. Karim, Joseph M. Longo, Lee J. Smith, Robert F. Darveaux, Jong Ok Chun, Jingkun Mao
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Patent number: 5999829Abstract: A circuit and method for controlling the power associated with a power amplifier in a portable radiotelephone includes a power amplifier, a power supply, a power supply controller, connected between the power supply and the above power amplifier, for adjusting the voltage applied to the power amplifier, and a control unit, connected to the power supply controller, for controlling the adjusted voltage of the power supply controller according to the transmitting power required in a region of a strong or weak electric field, and/or required in a one of dual (FM/CDMA) modes.Type: GrantFiled: October 31, 1997Date of Patent: December 7, 1999Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-Ok Chun, Moon-Ki Huh
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Patent number: 5731007Abstract: The present invention relates to novel pharmaceutical composition for skin diseases, in particular to novel pharmaceutical composition useful for treatment of skin diseases; e.g. burns, wounds, general operative wounds, pernio, decubitus, folliculitis, impetigo, intertrigo, radiation ulcer, acne vulgaris or infectious eczematous dermatitis comprising deproteinized dialysate of calf's blood with tissue regenerative activity and aminoglycoside antibiotic with bacterial infection inhibitory activity as active ingredients.Type: GrantFiled: July 25, 1996Date of Patent: March 24, 1998Assignee: Yungjin Pharmaceutical Co., Ltd.Inventors: Kae Jong Chung, Man Sik Chang, Jong Ok Chun, Jae Kwang Chun, Wahn Soo Choi, Sung Chul Kim