Abstract: A battery module including a battery cell stack in which a plurality of battery cells are stacked, a housing that surrounds the battery cell stack, and a pair of end plates that cover the exposed front and rear surfaces of the battery cell stack, respectively, and the battery module comprises a heat transfer member formed in a space between the battery cell stack and each of the pair of end plates.

Abstract: A battery module and a battery pack including same. The battery module includes a battery cell stack including a plurality of battery cells, and each of the plurality of battery cells includes a cooling surface and a wing folding surface; a housing that houses the battery cell stack; an upper heat sink located in an upper part of the housing; and a lower heat sink located in a lower part of the housing. The battery cell stack includes at least one first battery cell and at least one second battery cell, and the cooling surface of the at least one first battery cell is located adjacent to the lower heat sink, and the cooling surface of the at least one second battery cell is located adjacent to the upper heat sink.

Abstract: A battery module according to an embodiment of the present disclosure includes a battery cell stack in which a plurality of battery cells are stacked, a module frame for housing the battery cell stack, end plates for covering front and rear surfaces of the battery cell stack, a heat sink formed on a bottom part of the module frame, and a cooling port configured to supply a refrigerant to the heat sink, the module frame includes a module frame protrusion part, which is extended and formed so as to pass through the end plates on the bottom part of the module frame, and the cooling port is disposed in a shape protruding upward from an upper surface of the module frame protrusion part.

Abstract: A battery module including a stack of a plurality of battery cells; a housing for the battery cell stack; and an insulating member located between the battery cell stack and the housing. The insulating member is continuously formed on a lower surface and two side surfaces of the battery cell stack.

Abstract: A battery module including: a battery cell stack including a plurality of battery cells, a housing for the battery cell stack, a heat sink on a bottom portion of the housing, and a cooling port for supplying a refrigerant to the heat sink, wherein the housing includes a housing protrusion portion on the bottom portion of the housing, and the housing protrusion portion includes a first housing protrusion portion and a second housing protrusion portion that are located to be spaced apart from each other on one side of the housing. The cooling port includes a refrigerant injection port and a refrigerant discharge port, and each of the refrigerant injection port and the refrigerant discharge port is disposed on the first housing protrusion portion and the second housing protrusion portion, respectively.

Abstract: A battery module according to an embodiment of the present disclosure includes a battery cell stack in which a plurality of battery cells are stacked, a module frame for housing the battery cell stack, end plates for covering front and rear surfaces of the battery cell stack, and a cooling port configured to supply a refrigerant to a heat sink formed on a bottom part of the module frame, the module frame comprises a module frame protrusion part, which is extended and formed so as to pass through the end plates on the bottom part of the module frame, the cooling port is formed at an upper surface part of the module frame protrusion part, and the end plate comprises an end plate opening formed at a portion thereof corresponding to the cooling port and an insulator formed so as to cover the end plate opening.

Abstract: The battery module according to one embodiment of the present disclosure includes: a battery cell stack in which a plurality of battery cells are stacked; a module frame housing the battery cell stack; and a first heat sink located at an upper part of the module frame, wherein the first heat sink includes an upper plate and a lower plate, wherein a lower plate of the first heat sink constitutes an upper cover of the module frame, and wherein the first heat sink includes a cooling flow passage having at least one partition wall formed between the upper plate and the upper cover of the module frame.

Abstract: A method of manufacturing a thin-film bonded substrate used for semiconductor devices. The method includes the steps of epitaxially growing an epitaxial growth layer on a first substrate of a bulk crystal, cleaving the first substrate, thereby leaving a crystal thin film on the epitaxial growth layer, the crystal thin film being separated out of the first substrate, and bonding a second substrate to the crystal thin film, the chemical composition of the second substrate being different from the chemical composition of the first substrate. It is possible to preclude a conductive barrier layer of the related art, prevent a reflective layer from malfunctioning due to high-temperature processing, and essentially prevent cracks due to the difference in the coefficients of thermal expansion between heterogeneous materials that are bonded to each other.