Abstract: A memory device comprises a plurality of core dies including a first core die including a first through silicon via (TSV) area having a plurality of TSVs, and a first cell area including a first memory cell array to store received data, a TSV transfer circuit to input and output data to and from the first memory cell array, a first power management circuit including a latch circuit and configured to manage power of the first core die, and a core control circuit configured to control the first core die in accordance with at least one control command. The first power management circuit is configured to receive, from the core control circuit, a first control signal associated with reducing power supplied to the first cell area, and reduce at least a portion of the power supplied to the first cell area based on the first control signal.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: An integrated circuit device and a high bandwidth memory device are disclosed. The integrated circuit device includes a plurality of warpage detection sensors at a plurality of different positions, respectively, and electrically connected in series. Each of the plurality of warpage detection sensors is configured to generate a clock signal with a period that is based on a resistance that varies based on a pressure at a corresponding position, and to generate digital data by performing a counting operation in response to the clock signal.

Abstract: An integrated circuit device and a high bandwidth memory device are disclosed. The integrated circuit device includes a plurality of warpage detection sensors at a plurality of different positions, respectively, and electrically connected in series. Each of the plurality of warpage detection sensors is configured to generate a clock signal with a period that is based on a resistance that varies based on a pressure at a corresponding position, and to generate digital data by performing a counting operation in response to the clock signal.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller is configured to continuously perform a plurality of write commands on the memory device between an active command and a precharge command. In the memory system, when after a first write operation having a last write command of the plurality of write commands is performed and then the precharge command is issued, the last write command is issued for a second write operation after the precharge command. The first write operation and the second write operation write a same data to memory cells of plurality of memory cells having a same address.

Abstract: A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller is configured to continuously perform a plurality of write commands on the memory device between an active command and a precharge command. In the memory system, when after a first write operation having a last write command of the plurality of write commands is performed and then the precharge command is issued, the last write command is issued for a second write operation after the precharge command. The first write operation and the second write operation write a same data to memory cells of plurality of memory cells having a same address.

Abstract: Provided is a profiling unit and method for profiling a number of times that an input/output address of a semiconductor device is accessed. The profiling unit includes a hash unit configured to produce at least one hash value by perform a hash operation on the input/output address, and a profiling circuit configured to profile the number of times that the input/output address is accessed by using the at least one hash value.

Abstract: A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller is configured to continuously perform a plurality of write commands on the memory device between an active command and a precharge command. In the memory system, when after a first write operation having a last write command of the plurality of write commands is performed and then the precharge command is issued, the last write command is issued for a second write operation after the precharge command. The first write operation and the second write operation write a same data to memory cells of plurality of memory cells having a same address.

Abstract: A bit line pre-charge circuit for a dynamic random access memory (DRAM) uses a charge sharing scheme. The pre-charge circuit includes switching elements disposed between a power voltage node and an output node, capacitors connected between intermediate nodes and ground. The switching elements being operated by successively activated control signals to effectively charge a bit line pair to one half a power voltage using charge sharing between the capacitors.

Abstract: A bit line pre-charge circuit for a dynamic random access memory (DRAM) uses a charge sharing scheme. The pre-charge circuit includes switching elements disposed between a power voltage node and an output node, capacitors connected between intermediate nodes and ground. The switching elements being operated by successively activated control signals to effectively charge a bit line pair to one half a power voltage using charge sharing between the capacitors.

Abstract: The invention discloses a semiconductor memory device in which faulty cells causing standby current failure will be replaced with redundancy cells. The semiconductor memory device includes: a plurality of word lines, a plurality of bit lines, a plurality of cells connected between the word lines and bit lines for storing data and a memory cell array of a plurality of cell blocks having a plurality of cell power lines for providing supply voltage to the cells; a plurality of row decoder circuits for decoding external row addresses and generating selection signals for predetermined word lines included in the cell blocks; and a plurality of cell power repairing circuits for selectively blocking between cell power lines providing supply voltage to faulty cells and power source at an occurrence of faulty cells causing standby current failure.