Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, and the external electrode may include a conductive metal, a ceramic material and glass, and the glass may include silicon (Si), boron (B), sodium (Na), and aluminum (Al).

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes, and an external electrode including a connection portion disposed on the body, and a band portion in contact with the connection portion, and the external electrode may include a nickel electrode layer connected to the internal electrode and disposed on the connection portion, a glass layer disposed on the band portion, and a copper electrode layer disposed on the nickel electrode layer and the glass layer.

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.