Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.

Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.

Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

Abstract: An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.

Abstract: An apparatus and a method for coating are disclosed. The coating apparatus of the present invention, which include: a transporting part configured to transport a substrate; a coating part configured to coat a coating material on the substrate; and a squeegee installed to remove an excessive coating material after the substrate passes through the coating part and being moveable along a transporting path of the substrate, can carry out the coating operation and the squeegeeing operation together, thereby reducing the lead time of the coating operation of the substrate and increasing the productivity. By integrating the conventional coating device and squeegeeing device, the space required for installation can be saved, and the quality of coating can be improved because conditions for coating can be adjusted.

Abstract: An apparatus and a method for manufacturing a printed circuit board are disclosed. The apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.