Patents by Inventor Jong-Seok Yang

Jong-Seok Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11017918
    Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: May 25, 2021
    Assignee: DYM SOLUTION CO., LTD.
    Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
  • Patent number: 10626260
    Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: April 21, 2020
    Assignee: DYM SOLUTION CO., LTD.
    Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
  • Patent number: 10442923
    Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to 15 parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: October 15, 2019
    Assignee: DYM Solution Co., Ltd.
    Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
  • Publication number: 20190180889
    Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 13, 2019
    Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
  • Publication number: 20190040244
    Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 7, 2019
    Inventors: Jong Seok YANG, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
  • Publication number: 20190040243
    Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 7, 2019
    Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
  • Patent number: 10174187
    Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: January 8, 2019
    Assignee: DYM SOLUTION CO., LTD.
    Inventors: Jong Seok Yang, Eun Ho Choi, Chan Ryoo, Baeg Yong Seong, Dong Ha Park
  • Patent number: 9620261
    Abstract: A resin composition for producing an insulating material includes (A) 40 to 50% by weight of a base resin formed with a polyolefin-based resin or a derivative thereof, (B) 40 to 50% by weight of a magnesium hydroxide flame retardant of which surface is treated with vinyl silane, (C) 1 to 2% by weight of an antioxidant in which a first antioxidant and a second antioxidant are mixed in a weight ratio of 1:1 to 3, (D) 0.5 to 2% by weight of a lubricant, (E) 2 to 3% by weight of organosilane, (F) 0.05 to 0.2% by weight of an initiator, and (G) 1 to 4% by weight of a catalyst.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: April 11, 2017
    Assignees: HYUNDAI MOTOR COMPANY, DYM CO., LTD.
    Inventors: Seung Woo Choi, Dong Ha Park, Baeg Yong Seong, Eun Ho Choi, Jong Seok Yang
  • Publication number: 20170058113
    Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.
    Type: Application
    Filed: August 23, 2016
    Publication date: March 2, 2017
    Inventors: Jong Seok YANG, Eun Ho CHOI, Chan RYOO, Baeg Yong SEONG, Dong Ha PARK
  • Publication number: 20150248948
    Abstract: A resin composition for producing an insulating material includes (A) 40 to 50% by weight of a base resin formed with a polyolefin-based resin or a derivative thereof, (B) 40 to 50% by weight of a magnesium hydroxide flame retardant of which surface is treated with vinyl silane, (C) 1 to 2% by weight of an antioxidant in which a first antioxidant and a second antioxidant are mixed in a weight ratio of 1:1 to 3, (D) 0.5 to 2% by weight of a lubricant, (E) 2 to 3% by weight of organosilane, (F) 0.05 to 0.2% by weight of an initiator, and (G) 1 to 4% by weight of a catalyst.
    Type: Application
    Filed: February 9, 2015
    Publication date: September 3, 2015
    Inventors: Seung Woo CHOI, Dong Ha PARK, Baeg Yong SEONG, Eun Ho CHOI, Jong Seok YANG
  • Publication number: 20100023927
    Abstract: An apparatus and method for MIDlet suite management using Digital Rights Management (DRM) in a mobile communication system are provided. A Java Application Descriptor (JAD) file transmission method of a transmit Mobile Station (MS) in a mobile communication system includes inserting a JAD file into an Open Mobile Alliance Digital Rights Management (OMA DRM) file, and transmitting the OMA DRM file in which the JAD file is inserted, to a receive MS.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 28, 2010
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Jong-Seok Yang, Kum-Hyun Cho