Patents by Inventor Jongseon SHIN

Jongseon SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130123
    Abstract: Disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. The semiconductor device comprises a first gate stack structure including a first dielectric pattern and a first conductive pattern that are alternately stacked with each other, a memory channel structure including a first memory portion that penetrates the first gate stack structure, a through contact including a first through portion at a level the same as a level of the first memory portion, and a connection contact including a first connection portion at a level the same as the level of the first memory portion and the level of the first through portion. A minimum width of the first memory portion is less than a minimum width of the first through portion and a minimum width of the first connection portion.
    Type: Application
    Filed: June 12, 2023
    Publication date: April 18, 2024
    Inventors: Yejin PARK, Seung Yoon KIM, Heesuk KIM, Hyeongjin KIM, Sehee JANG, Minsoo SHIN, Seungjun SHIN, Sanghun CHUN, Jeehoon HAN, Jae-Hwang SIM, Jongseon AHN
  • Patent number: 11550685
    Abstract: An integrated circuit chip includes a plurality of function blocks; a mode controller configured to convert an input signal, received from an external device through an input/output pin, into an input pattern and test mode setting data which include a plurality of bits, and to output the test mode setting data and a mode switching enable signal when a secure pattern generated therein is the same as the input pattern; and a mode setting module configured to control the plurality of function blocks to operate in a test mode according to the mode setting data, in response to the test mode switching enable signal.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: January 10, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongseon Shin, Kihong Kim
  • Publication number: 20210133064
    Abstract: An integrated circuit chip includes a plurality of function blocks; a mode controller configured to convert an input signal, received from an external device through an input/output pin, into an input pattern and test mode setting data which include a plurality of bits, and to output the test mode setting data and a mode switching enable signal when a secure pattern generated therein is the same as the input pattern; and a mode setting module configured to control the plurality of function blocks to operate in a test mode according to the mode setting data, in response to the test mode switching enable signal.
    Type: Application
    Filed: July 15, 2020
    Publication date: May 6, 2021
    Inventors: Jongseon SHIN, Kihong KIM