Patents by Inventor Jong Seop Kim

Jong Seop Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT-DISSIPATION SHEET ASSEMBLY MANUFACTURED BY USING ELECTROCHEMICAL METHOD
    Publication number: 20140370222
    Abstract: There is provided a heat-dissipation sheet assembly comprising a heat-dissipation sheet layer having good heat conductivity and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer. When the heat-dissipation sheet layer is immersed in an aqueous solution for electrodeposition added with a material for electrodeposition and electric current is permitted to flow in the aqueous solution, the protection layer(s) is electrodeposited on the one or both sides of the heat-dissipation sheet layer. The heat-dissipation sheet assembly can be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.
    Type: Application
    Filed: July 28, 2013
    Publication date: December 18, 2014
    Applicant: A-TECH SOLUTION CO., LTD
    Inventors: Jong Seop Kim, Ki Sung Lee
  • Polishing slurry composition and method of using the same
    Patent number: 7601273
    Abstract: A polishing slurry composition including an abrasive, a pH-adjusting agent, a water-soluble thickening agent, and a chelating agent, wherein the chelating agent includes at least one of an acetate chelating agent and a phosphate chelating agent, and a method of using the same.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: October 13, 2009
    Assignees: Cheil Industries, Inc., MEMC Korea Co., Ltd.
    Inventors: Hyun Soo Roh, Tae Won Park, Tae Young Lee, In Kyung Lee, Chin Ho Lee, Young Woo Kim, Moon Ro Choi, Jong Seop Kim