Patents by Inventor Jong Sik Kim

Jong Sik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240242884
    Abstract: A multilayer electronic component includes a dielectric layer and internal electrodes; wherein the dielectric layer includes a rare earth element, Mn, and Ti. The rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element. The number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.5 mol?RE?0.9 mol and 1<A2/A1 are satisfied. The number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less.
    Type: Application
    Filed: September 11, 2023
    Publication date: July 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Soon KWON, Hyoung Uk KIM, Kyung Sik KIM, Ji Su HONG, Seung In BAIK, Min Young CHOI, Si Taek PARK, Jong Hwan LEE, Jae Sung PARK
  • Publication number: 20240243084
    Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 18, 2024
    Inventors: Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim, Sang Gyu Lee
  • Publication number: 20240243393
    Abstract: An electrode assembly, a battery, a battery pack and a vehicle are provided. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference, the first electrode includes a first active material portion coated with an active material layer along a winding direction and a first uncoated portion not coated with an active material layer, the first uncoated portion includes a plurality of independently bendable segments, a cut groove is interposed between adjacent segments along the winding direction, and a lower portion of the cut groove has a round portion.
    Type: Application
    Filed: July 19, 2022
    Publication date: July 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jae-Eun LEE, Jong-Sik PARK, Sang-Yeol KIM, Je-Jun LEE, Hak-Kyun KIM, Jae-Won LIM, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE
  • Patent number: 12040516
    Abstract: Provided is a gas diffusion layer, in which a microporous layer has an inner wall of through passages and a region adjacent to the through passages containing a greater amount of a water-repellent binder resin than a region not adjacent to the through passages, and thus water formed by an electrochemical reaction is effectively discharged from the gas diffusion layer. When the gas diffusion layer of the present invention is used, an optimal water management may be possible for smooth operation under all humidity conditions including a high humidity condition and a low humidity condition, and thus a fuel cell having improved cell performance may be obtained.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: July 16, 2024
    Assignee: JNTG CO., LTD.
    Inventors: Eun Sook Lee, Jy Young Jyoung, Na Hee Kang, Do Hun Kim, Jong Sik Ryu
  • Patent number: 12036905
    Abstract: A backboard assembly for a vehicular rear seat is disclosed. The backboard assembly includes an upper part and a lower part, which are made of a hard plastic material. The backboard assembly prevents the formation of a gap between the lower part and a luggage board, regardless of the operational mode of the rear seat. When a seat back is folded, the upper part, the lower part, and the luggage board are aligned in a horizontal direction, thereby allowing the space for passengers in the rear seat to be completely integrated with a luggage compartment.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: July 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc., Daechang Seat Co., LTD-Dongtan
    Inventors: Eun Sue Kim, Seung Sik Han, Hong Heui Lee, Myung Hoe Kim, Cheol Hwan Yoon, Hae Dong Kwak, Jun Sik Hwang, Jong Tak Lee, Sin Chan Yang, In Sun Baek, Myung Soo Lee, Chan Ki Cho
  • Patent number: 12024774
    Abstract: A gas introduction apparatus according to an embodiment of the present disclosure includes a gas feeding block disposed above a chamber, the gas feeding block comprising a plurality of gas channels disposed therein to supply a gas to the chamber, a valve assembly coupled to one side surface of the gas feeding block, the valve assembly comprising a plurality of valves for selectively opening/closing at least one of the plurality of gas channels, and a gas introduction pipe coupled, at one end thereof, to the valve assembly while communicating with the chamber at the other end thereof. A buffer space is provided at least one of the plurality of gas channels such that the buffer space is disposed adjacent to the gas introduction pipe, to accumulate the gas.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: July 2, 2024
    Assignee: JUSUNG ENGINEERING CO., LTD.
    Inventors: Ki Bum Kim, Yun Gyu Ha, Jong Sik Kim, Il Hyung Cho, Chul Joo Hwang
  • Publication number: 20230374663
    Abstract: A substrate processing apparatus includes a process chamber including a reaction space in which at least one substrate is mounted, a transfer chamber for transferring the at least one substrate to the process chamber, and a buffer chamber including a rotating device for rotating the at least one substrate by a predetermined angle, wherein the rotating device includes a rotating plate, a rotating shaft for rotating the rotating plate by the predetermined angle, a drive unit for driving the rotating shaft, a controller for controlling the drive unit, and a plurality of substrate support members, which are disposed on the rotating plate and on which the at least one substrate is mounted.
    Type: Application
    Filed: August 5, 2023
    Publication date: November 23, 2023
    Inventors: Jong Sik KIM, Gu Hyun JUNG, Won Woo Jung
  • Publication number: 20230301279
    Abstract: The objective of the present invention is to provide a poultry weight measurement and weight estimation system, which can estimate weight by considering the unique size of each poultry individual and does not interrupt the transit of poultry.
    Type: Application
    Filed: November 27, 2020
    Publication date: September 28, 2023
    Applicant: UNIAI CORP.
    Inventors: Seung Hwan BAEK, Yong Joon CHO, Jong Sik KIM
  • Patent number: 11651941
    Abstract: The present inventive concept relates to a gas distribution apparatus of a substrate processing apparatus including: a first gas distribution module distributing a processing gas to a first gas distribution space; and a second gas distribution module distributing a processing gas to a second gas distribution space which differs from the first gas distribution space, a substrate processing apparatus, and a substrate processing method.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: May 16, 2023
    Inventors: Min Ho Cheon, Jong Sik Kim, Chul-Joo Hwang
  • Publication number: 20230085592
    Abstract: The present disclosure relates to a substrate processing apparatus and method. The substrate processing apparatus and method can sequentially inject process gases onto substrates located in first and second spaces obtained by dividing the internal space of a chamber in the substrate processing apparatus, thereby forming thin films with uniform thicknesses on the substrates located in the first and second spaces.
    Type: Application
    Filed: February 2, 2021
    Publication date: March 16, 2023
    Inventors: Ji Hun LEE, Jong Sik KIM
  • Publication number: 20220307136
    Abstract: A gas introduction apparatus according to an embodiment of the present disclosure includes a gas feeding block disposed above a chamber, the gas feeding block comprising a plurality of gas channels disposed therein to supply a gas to the chamber, a valve assembly coupled to one side surface of the gas feeding block, the valve assembly comprising a plurality of valves for selectively opening/closing at least one of the plurality of gas channels, and a gas introduction pipe coupled, at one end thereof, to the valve assembly while communicating with the chamber at the other end thereof. A buffer space is provided at least one of the plurality of gas channels such that the buffer space is disposed adjacent to the gas introduction pipe, to accumulate the gas.
    Type: Application
    Filed: August 6, 2020
    Publication date: September 29, 2022
    Inventors: Ki Bum KIM, Yun Gyu HA, Jong Sik KIM, Il Hyung CHO, Chul Joo HWANG
  • Patent number: 11413019
    Abstract: Provided is an ultrasound imaging apparatus comprising: an image processing unit for connecting relevant blood flows and classifying the same into a plurality of blood flow trees on the basis of information on blood flow direction and blood flow velocity obtained from morphological information of a target object and three-dimensional blood flow data; a user input unit for receiving a user input which selects a blood flow tree, in which a target blood flow is included, from among the plurality of blood flow trees; and a display unit for displaying the selected blood flow tree on a three-dimensional rendering image on the basis of the user input.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: August 16, 2022
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Han-jun Kim, Sung-yoon Kim, Jong-sik Kim
  • Patent number: 11417562
    Abstract: One embodiment of a substrate supporting apparatus comprises: a support member for supporting a substrate; and a temperature compensating member disposed at the edge of the support member, and compensating the temperature of the substrate, wherein the support member may be made of a light-transmissive material, the temperature compensating member may be made of an opaque material, and the surface of the temperature compensating member may be made of a material having corrosion resistance against a cleaning gas.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: August 16, 2022
    Inventors: Dong Seok Chun, Jeong Mi Kim, Jong Sik Kim, Won Woo Jung, Min Ho Cheon, Chul Joo Hwang
  • Publication number: 20220230858
    Abstract: Disclosed is a window device for diagnosis of plasma OES (Optical Emission Spectroscopy).
    Type: Application
    Filed: May 28, 2020
    Publication date: July 21, 2022
    Applicant: KOREA INSTITUTE OF FUSION ENERGY
    Inventors: Kang Il LEE, Yong Sup CHOI, Young Woo KIM, Jong Sik KIM
  • Patent number: 11361985
    Abstract: The present invention relates to a substrate supporting device and a substrate processing apparatus. The substrate supporting device, the substrate supporting device of the substrate processing apparatus, may include: a disk; and a plurality of substrate supporting parts disposed radially from a center of the disk, a substrate being supported by each of the plurality of substrate supporting parts. An upper surface of each of the plurality of substrate supporting parts may protrude more upward than an upper surface of the disk.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: June 14, 2022
    Inventors: Jong Sik Kim, Hyun Wook Shin, Su Yeon Lee
  • Patent number: 11268191
    Abstract: An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: March 8, 2022
    Assignee: KOREA INSTITUTE OF FUSION ENERGY
    Inventors: Yong Sup Choi, Kang Il Lee, Dong Chan Seok, Soo Ouk Jang, Jong Sik Kim, Seung Ryul Yoo
  • Patent number: 11219429
    Abstract: Disclosed herein is an ultrasound imaging apparatus capable of setting a region of interest having a shape corresponding to a shape of the cervix canal in an elasticity image of the cervix and displaying the region of interest, and a control method thereof. The ultrasound imaging apparatus includes a display unit configured to display an ultrasound elasticity image and a controller configured to select a point included in a path corresponding to the cervix canal in the elasticity image of the cervix displayed on the display unit, configured to set a region of interest having a shape corresponding to a shape of at least one portion of the cervix canal based on the selected point, and configured to display the region of interest on the display unit.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: January 11, 2022
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Dong Kuk Shin, Dal Kwon Ko, Jong-Sik Kim, Soo-young Oh, Dong-Wook Kwak, Kunwoo Kim, Moon Young Kim, Hyun Soo Park, Hyun-Joo Seol, Sae Kyung Choi, Joon Seok Hong, Han Sung Hwang
  • Patent number: 11203011
    Abstract: Provided is a nitrogen oxide (NOX) reduction catalyst including an active site including at least one of a metal vanadate expressed by [Chemical Formula 1] and a metal vanadate expressed by [Chemical Formula 2], and a support for loading the active site thereon. (M1)XV2OX+5??[Chemical Formula 1] (where M1 denotes one selected from among manganese (Mn), cobalt (Co), and nickel (Ni), and X denotes a real number having a value between 1 and 3.) (M2)YVO4??[Chemical Formula 2] (where M2 denotes one selected from among lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), and lutetium (Lu), and Y denotes a real number having a value between 0.5 and 1.5).
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 21, 2021
    Assignee: Korea Institute of Science and Technology
    Inventors: Jong Sik Kim, Heon Phil Ha, Dong Wook Kwon
  • Patent number: 11154849
    Abstract: A method of manufacturing a honeycomb metal structure includes providing a substrate comprising iron (Fe) and a container containing water; coating at least a part of the substrate with a viscid material whose viscidity is increased by moisture; attaching metal powder onto the viscid material; adhering the metal powder to the substrate due to an increase in viscidity of the viscid material by evaporating a portion of the water in the container and supplying moisture to the viscid material; and generating an uneven structure made of the metal powder bonded to the substrate by performing a heat treatment on the substrate to which the metal powder is adhered. The heat treatment may include performing a first heat treatment on the substrate to generate an intermetallic layer at an interface between the substrate and the metal powder; and performing a second heat treatment to dissolve the intermetallic compound layer.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: October 26, 2021
    Assignee: Korea Institute of Science and Technology
    Inventors: Ji Young Byun, Sang Hoon Kim, Jong Sik Kim
  • Publication number: 20210254213
    Abstract: A substrate processing apparatus includes a process chamber including a reaction space in which at least one substrate is mounted, a transfer chamber for transferring the at least one substrate to the process chamber, and a buffer chamber including a rotating device for rotating the at least one substrate by a predetermined angle, wherein the rotating device includes a rotating plate, a rotating shaft for rotating the rotating plate by the predetermined angle, a drive unit for driving the rotating shaft, a controller for controlling the drive unit, and a plurality of substrate support members, which are disposed on the rotating plate and on which the at least one substrate is mounted.
    Type: Application
    Filed: June 24, 2019
    Publication date: August 19, 2021
    Inventors: Jong Sik KIM, Gu Hyun JUNG, Won Woo Jung