Abstract: A display device includes a plurality of outer banks extending in a first direction and are spaced from one another in a second direction that intersects the first direction, first and second bank parts spaced from the plurality of outer banks in the second direction between the outer banks, and spaced from each other in the first direction, first and second inner banks extending in the first direction between the plurality of outer banks, the first and second inner banks being spaced from each other in the second direction, first and second electrodes on the first and second inner banks, respectively, and spaced from each other in the second direction, light-emitting elements having first end portions on one of the first and second electrodes, the light-emitting elements being arranged along the first direction, and a first insulating layer including a first pattern portion between the first and second inner banks.

Abstract: In a method of manufacturing a packaging unit, a material layer is stacked for forming the semiconductor device on one surface of a substrate, a semiconductor device is formed by performing a semiconductor process on the material layer, a flow channel through which a cooling fluid flows is formed on the other surface of the substrate to enable direct cooling of the semiconductor device using the cooling fluid, a packaging block is disposed at a position spaced apart from the substrate for packaging of the semiconductor device, and an electrode placed on the packaging block is electrically connected to the semiconductor device, and a heat sink unit having a flow path forming portion in which a flow path communicating with the flow channel of the substrate is formed is arranged below the packaging block, and the substrate is combined with the heat sink unit.

Abstract: Disclosed is a vehicle seat sliding device, which prevents noise from being generated when a seat is moved. The vehicle seat sliding device includes: a fixed rail which includes a locking section in which a fixed lock is formed and an unlocking section in which the fixed lock is not formed; a moving rail which slides along the fixed rail; a locking unit which is provided in the moving rail, moves up and down, and has a plurality of locks that is selectively engaged with the fixed lock. When at least one lock of the plurality of locks is located in the unlocking section, remaining locks located in the locking section are disposed apart from the fixed lock so as to have a gap with the fixed lock. With this configuration, when the moving rail is returned from the unlocking section to the locking section, the lock of the locking unit is disposed apart from the fixed lock provided in the fixed rail in such a way as to have a gap, so that noise can be prevented from being generated.

Abstract: Provided is a vibration isolating apparatus for isolating vibration from being transferred from a vehicle to a seat during idling and traveling. The vibration isolating apparatus provides an isolation structure applied between the upper and lower seat frames for a vehicle. A bearing unit having a low friction characteristic are applied so that horizontal vibration is effectively isolated without an up-and-down motion. A damping unit capable of attenuating the motion and frictional noise is applied.

Abstract: The present invention relates to a safeguard zipper bag, and more particularly, to a safeguard zipper bag that has a dual opening part in order to disperse force applied to the zipper bag, such that the safeguard zipper bag is difficult to open by outer opening parts and easy to open by inner opening parts, and the safety of the safeguard zipper bag is improved. A safeguard zipper bag according to the present invention may include: an envelope in the form of a bag; and a male zipper part and a female zipper part attached to inner surfaces of the envelope, in which one portion or the other portion of at least one of the male zipper part and the female zipper part, which is spaced apart, at a predetermined interval, from a portion where the male zipper part and the female zipper part are coupled by male/female engagement, is attached to the inner surface of the envelope.

Abstract: The present invention relates to a photoresist stripper composition for manufacturing a display, and more particularly, to an integrated photoresist stripper composition which can be used in every process for manufacturing a display. More specifically, the photoresist stripper composition for manufacturing a display according to the present invention can be applied to all of transition metals and oxide semiconductor wirings, and has an excellent ability to remove modified photoresist after a hard bake process, and implant process, and a dry etch process have been performed. In particular, the photoresist stripper composition for manufacturing a display according to the present invention exhibits a corrosion inhibitory effect that has been further specialized for copper (Cu) wiring pattern edge portions which are susceptible to corrosion following dry-etching.

Abstract: The present invention relates to a safeguard zipper bag, and more particularly, to a safeguard zipper bag that has a dual opening part in order to disperse force applied to the zipper bag, such that the safeguard zipper bag is difficult to open by outer opening parts and easy to open by inner opening parts, and the safety of the safeguard zipper bag is improved. A safeguard zipper bag according to the present invention may include: an envelope in the form of a bag; and a male zipper part and a female zipper part attached to inner surfaces of the envelope, in which one portion or the other portion of at least one of the male zipper part and the female zipper part, which is spaced apart, at a predetermined interval, from a portion where the male zipper part and the female zipper part are coupled by male/female engagement, is attached to the inner surface of the envelope.

Abstract: The present disclosure relates to a photoresist stripper composition for manufacturing an LCD, and relates to an integrated photoresist stripper composition capable of being used in all processes for manufacturing a TFT-LCD. More specifically, the present disclosure relates to an aqueous photoresist stripper composition capable of being used in all of transition metal, potential metal and oxide semiconductor wires.

Abstract: The present disclosure relates to a photoresist stripper composition for manufacturing an LCD, and relates to an integrated photoresist stripper composition capable of being used in all processes for manufacturing a TFT-LCD. More specifically, the present disclosure relates to an aqueous photoresist stripper composition capable of being used in all of transition metal, potential metal and oxide semiconductor wires.

Abstract: The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.

Abstract: The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.

Abstract: The present invention relates to a method for preparing an extract containing omega fatty acids from a plant containing omega fatty acids, including the following steps: drying the plant containing omega fatty acids to prepare a powder; and extracting omega fatty acids from the prepared plant powder by using supercritical carbon dioxide as a solvent at an optimum temperature and pressure, a dietary supplement and a cholesterol-lowering pharmaceutical composition containing plant-derived omega fatty acids extracted by the method, and omega fatty acids-containing plant extract containing a predetermined or greater amount of omega-3 fatty acids.

Abstract: Naphthylcarbazole derivatives are provided. The naphthylcarbazole derivatives are represented by Formula 1. Further provided are KL host materials, organic electroluminescent devices employing the host materials, and displays and lighting systems comprising the devices.

Abstract: The present invention relates to a method for preparing an extract containing omega fatty acids from a plant containing omega fatty acids, including the following steps: drying the plant containing omega fatty acids to prepare a powder; and extracting omega fatty acids from the prepared plant powder by using supercritical carbon dioxide as a solvent at an optimum temperature and pressure, a dietary supplement and a cholesterol-lowering pharmaceutical composition containing plant-derived omega fatty acids extracted by the method, and omega fatty acids-containing plant extract containing a predetermined or greater amount of omega-3 fatty acids.

Abstract: Embodiments relate to a method for forming a wiring in a semiconductor device, that may include laminating a conductive layer for wiring formation on a semiconductor substrate, forming a photoresist layer pattern on the conductive layer, performing primary dry etching for the conductive layer after employing the photoresist layer pattern as a mask, thereby forming a wiring pattern, partially removing the photoresist layer pattern through secondary dry etching, thereby forming a passivation layer on a surface of the wiring pattern, performing tertiary dry etching for the wiring pattern and a diffusion barrier after employing the photoresist layer pattern as a mask, thereby forming a metal wiring, and removing the photoresist layer pattern.

Abstract: Naphthylcarbazole derivatives are provided. The naphthylcarbazole derivatives are represented by Formula 1. Further provided are KL host materials, organic electroluminescent devices employing the host materials, and displays and lighting systems comprising the devices.

Abstract: Embodiments relate to a method for forming a wiring in a semiconductor device, that may include laminating a conductive layer for wiring formation on a semiconductor substrate, forming a photoresist layer pattern on the conductive layer, performing primary dry etching for the conductive layer after employing the photoresist layer pattern as a mask, thereby forming a wiring pattern, partially removing the photoresist layer pattern through secondary dry etching, thereby forming a passivation layer on a surface of the wiring pattern, performing tertiary dry etching for the wiring pattern and a diffusion barrier after employing the photoresist layer pattern as a mask, thereby forming a metal wiring, and removing the photoresist layer pattern.

Abstract: Embodiments relate to a method for forming a wiring in a semiconductor device, that may include laminating a conductive layer for wiring formation on a semiconductor substrate, forming a photoresist layer pattern on the conductive layer, performing primary dry etching for the conductive layer after employing the photoresist layer pattern as a mask, thereby forming a wiring pattern, partially removing the photoresist layer pattern through secondary dry etching, thereby forming a passivation layer on a surface of the wiring pattern, performing tertiary dry etching for the wiring pattern and a diffusion barrier after employing the photoresist layer pattern as a mask, thereby forming a metal wiring, and removing the photoresist layer pattern.

Abstract: Embodiments relate to a method for forming a wiring in a semiconductor device, that may include laminating a conductive layer for wiring formation on a semiconductor substrate, forming a photoresist layer pattern on the conductive layer, performing primary dry etching for the conductive layer after employing the photoresist layer pattern as a mask, thereby forming a wiring pattern, partially removing the photoresist layer pattern through secondary dry etching, thereby forming a passivation layer on a surface of the wiring pattern, performing tertiary dry etching for the wiring pattern and a diffusion barrier after employing the photoresist layer pattern as a mask, thereby forming a metal wiring, and removing the photoresist layer pattern.