Abstract: An electrolyte capable of lip roving the stability of a lithium-metal battery is provided. The electrolyte includes an organic solvent, a cosolvent, which is different from the organic solvent and includes a fluorine-based compound, and an additive having a lower lowest unoccupied molecular orbital (LUMO) value than the organic solvent.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric layers and the internal electrodes in a first direction, and a cover portion disposed on both end-surfaces of the capacitance forming portion in the first direction. One of the dielectric layers includes a first acceptor element containing Al, a second acceptor element containing at least one of Mg, Mn, or V, and Ti. The one of the dielectric layers and the cover portion include a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one of the dielectric layers relative to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00?G1/G2<1.50.

Abstract: A cathode active material precursor for a lithium secondary battery includes nickel and at least one metal except for nickel. The cathode active material precursor includes primary particles having a major axis length of 500 nm or less and an aspect ratio in a range from 1.0 to 3.0. A volume ratio of micropores having a pore diameter of 2 nm or less relative to a total pore volume is 1.4% or less.

Abstract: A direct cooling type semiconductor package unit includes a substrate made of a material capable of manufacturing a semiconductor device, and having a material layer for forming the semiconductor device stacked on one side of the substrate, and a flow channel through which a cooling fluid flows formed on the other side of the substrate to enable direct cooling of the semiconductor device using the cooling fluid; a packaging block disposed at a position spaced apart from the substrate for packaging the semiconductor device, and having an electrode electrically connected to the semiconductor device through wiring and placed thereon to be insulated; a heat sink unit disposed on a lower side of the packaging block and having a fluid movement region formed at a position corresponding to a flow channel of the substrate; and a thin film type structure disposed between the substrate and the heat sink unit for coupling between the substrate and the heat sink unit and being moldable to have pattern structures of variou

Abstract: Provided is a direct cooling device for an integrated circuit configured to form a direct cooling portion with a flow channel through which cooling fluid may flow in a through via hole of a substrate constituting the integrated circuit, and to couple the substrate to a heat sink unit through a bonding portion formed integrally with the direct cooling portion, unlike the prior art in which only a ground circuit is possible through the through via hole, which derives the effect of increasing product reliability due to improved thermal management efficiency of the integrated circuit by directly cooling the semiconductor device as well as the ground circuit, and the effect of simplifying and miniaturizing the structure by implementing the cooling function using a circuit for grounding the semiconductor device even without forming an additional flow path structure for cooling the semiconductor device.

Abstract: A multilayer electronic component includes a dielectric layer and internal electrodes; wherein the dielectric layer includes a rare earth element, Mn, and Ti. The rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element. The number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.5 mol?RE?0.9 mol and 1<A2/A1 are satisfied. The number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less.

Abstract: Disclosed is a vehicle seat sliding device, which prevents noise from being generated when a seat is moved. The vehicle seat sliding device includes: a fixed rail which includes a locking section in which a fixed lock is formed and an unlocking section in which the fixed lock is not formed; a moving rail which slides along the fixed rail; a locking unit which is provided in the moving rail, moves up and down, and has a plurality of locks that is selectively engaged with the fixed lock. When at least one lock of the plurality of locks is located in the unlocking section, remaining locks located in the locking section are disposed apart from the fixed lock so as to have a gap with the fixed lock. With this configuration, when the moving rail is returned from the unlocking section to the locking section, the lock of the locking unit is disposed apart from the fixed lock provided in the fixed rail in such a way as to have a gap, so that noise can be prevented from being generated.

Abstract: Provided is a vibration isolating apparatus for isolating vibration from being transferred from a vehicle to a seat during idling and traveling. The vibration isolating apparatus provides an isolation structure applied between the upper and lower seat frames for a vehicle. A bearing unit having a low friction characteristic are applied so that horizontal vibration is effectively isolated without an up-and-down motion. A damping unit capable of attenuating the motion and frictional noise is applied.

Abstract: The present invention relates to a safeguard zipper bag, and more particularly, to a safeguard zipper bag that has a dual opening part in order to disperse force applied to the zipper bag, such that the safeguard zipper bag is difficult to open by outer opening parts and easy to open by inner opening parts, and the safety of the safeguard zipper bag is improved. A safeguard zipper bag according to the present invention may include: an envelope in the form of a bag; and a male zipper part and a female zipper part attached to inner surfaces of the envelope, in which one portion or the other portion of at least one of the male zipper part and the female zipper part, which is spaced apart, at a predetermined interval, from a portion where the male zipper part and the female zipper part are coupled by male/female engagement, is attached to the inner surface of the envelope.

Abstract: The present invention relates to a photoresist stripper composition for manufacturing a display, and more particularly, to an integrated photoresist stripper composition which can be used in every process for manufacturing a display. More specifically, the photoresist stripper composition for manufacturing a display according to the present invention can be applied to all of transition metals and oxide semiconductor wirings, and has an excellent ability to remove modified photoresist after a hard bake process, and implant process, and a dry etch process have been performed. In particular, the photoresist stripper composition for manufacturing a display according to the present invention exhibits a corrosion inhibitory effect that has been further specialized for copper (Cu) wiring pattern edge portions which are susceptible to corrosion following dry-etching.

Abstract: The present invention relates to a safeguard zipper bag, and more particularly, to a safeguard zipper bag that has a dual opening part in order to disperse force applied to the zipper bag, such that the safeguard zipper bag is difficult to open by outer opening parts and easy to open by inner opening parts, and the safety of the safeguard zipper bag is improved. A safeguard zipper bag according to the present invention may include: an envelope in the form of a bag; and a male zipper part and a female zipper part attached to inner surfaces of the envelope, in which one portion or the other portion of at least one of the male zipper part and the female zipper part, which is spaced apart, at a predetermined interval, from a portion where the male zipper part and the female zipper part are coupled by male/female engagement, is attached to the inner surface of the envelope.

Abstract: The present disclosure relates to a photoresist stripper composition for manufacturing an LCD, and relates to an integrated photoresist stripper composition capable of being used in all processes for manufacturing a TFT-LCD. More specifically, the present disclosure relates to an aqueous photoresist stripper composition capable of being used in all of transition metal, potential metal and oxide semiconductor wires.

Abstract: The present disclosure relates to a photoresist stripper composition for manufacturing an LCD, and relates to an integrated photoresist stripper composition capable of being used in all processes for manufacturing a TFT-LCD. More specifically, the present disclosure relates to an aqueous photoresist stripper composition capable of being used in all of transition metal, potential metal and oxide semiconductor wires.

Abstract: The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.

Abstract: The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.

Abstract: The present invention relates to a method for preparing an extract containing omega fatty acids from a plant containing omega fatty acids, including the following steps: drying the plant containing omega fatty acids to prepare a powder; and extracting omega fatty acids from the prepared plant powder by using supercritical carbon dioxide as a solvent at an optimum temperature and pressure, a dietary supplement and a cholesterol-lowering pharmaceutical composition containing plant-derived omega fatty acids extracted by the method, and omega fatty acids-containing plant extract containing a predetermined or greater amount of omega-3 fatty acids.

Abstract: Naphthylcarbazole derivatives are provided. The naphthylcarbazole derivatives are represented by Formula 1. Further provided are KL host materials, organic electroluminescent devices employing the host materials, and displays and lighting systems comprising the devices.

Abstract: The present invention relates to a method for preparing an extract containing omega fatty acids from a plant containing omega fatty acids, including the following steps: drying the plant containing omega fatty acids to prepare a powder; and extracting omega fatty acids from the prepared plant powder by using supercritical carbon dioxide as a solvent at an optimum temperature and pressure, a dietary supplement and a cholesterol-lowering pharmaceutical composition containing plant-derived omega fatty acids extracted by the method, and omega fatty acids-containing plant extract containing a predetermined or greater amount of omega-3 fatty acids.

Abstract: Embodiments relate to a method for forming a wiring in a semiconductor device, that may include laminating a conductive layer for wiring formation on a semiconductor substrate, forming a photoresist layer pattern on the conductive layer, performing primary dry etching for the conductive layer after employing the photoresist layer pattern as a mask, thereby forming a wiring pattern, partially removing the photoresist layer pattern through secondary dry etching, thereby forming a passivation layer on a surface of the wiring pattern, performing tertiary dry etching for the wiring pattern and a diffusion barrier after employing the photoresist layer pattern as a mask, thereby forming a metal wiring, and removing the photoresist layer pattern.