Abstract: Disclosed is a buffer system for mining a deep seafloor mineral resource. The buffer system includes a hopper part that introduces and stores a crushed mineral resource to discharge the crushed mineral resource upward, a first pipe that communicates with an upper portion of the hopper part to introduce the mineral resource, a feeder part provided under the hopper part to discharge the mineral resources upward, a second pipe that communicates with the feeder part and lifts the mineral resource, a hydraulic part provided under the hopper part to convert power received from a surface boat into hydraulic power to operate at least one actuator and a driving motor to introduce the mineral resource into the first pipe, and a structure frame coupled to a lifting pipe to transmit an external load applied to the buffer system, and constituting an external frame of the buffer system to protect internal units.

Abstract: A robot for mining a manganese nodule on a deep sea floor. The apparatus includes a plurality of moving apparatuses detachably disposed in parallel with each other; a mining apparatus installed to a front end of the moving apparatuses to mine a manganese nodule; a transferring apparatus installed to an upper portion of the moving apparatuses to crush the manganese nodule in a constant size or less such that the manganese nodule is transferred to an external; a power control measuring unit installed to an upper portion of the moving apparatuses for providing power to the moving apparatuses and controlling operations of the mining apparatus and the transferring apparatus; a structure frame for connecting the moving apparatuses to each other and for supporting the mining apparatus, the transferring apparatus and the power control measuring unit; and a buoyancy unit installed to a top end of the structure frame.

Abstract: In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.

Abstract: Disclosed is an apparatus for bi-directionally mining a manganese nodule. The apparatus includes a traveling device to travel in a predetermined traveling direction, collecting devices installed at both ends of the traveling device, respectively, to collect the manganese nodule, and a control device to sense the traveling direction of the traveling device and to drive one of the collecting devices installed at both ends of the traveling device, which is placed in the sensed traveling direction.

Abstract: Disclosed is a buffer system for mining a deep seafloor mineral resource. The buffer system includes a hopper part that introduces and stores a crushed mineral resource to discharge the crushed mineral resource upward, a first pipe that communicates with an upper portion of the hopper part to introduce the mineral resource, a feeder part provided under the hopper part to discharge the mineral resources upward, a second pipe that communicates with the feeder part and lifts the mineral resource, a hydraulic part provided under the hopper part to convert power received from a surface boat into hydraulic power to operate at least one actuator and a driving motor to introduce the mineral resource into the first pipe, and a structure frame coupled to a lifting pipe to transmit an external load applied to the buffer system, and constituting an external frame of the buffer system to protect internal units.

Abstract: Disclosed is a robot for mining a manganese nodule on a deep sea floor. The apparatus includes a plurality of moving apparatuses detachably disposed in parallel with each other; a mining apparatus installed to a front end of the moving apparatuses to mine a manganese nodule; a transferring apparatus installed to an upper portion of the moving apparatuses to crush the manganese nodule in a constant size or less such that the manganese nodule is transferred to an external; a power control measuring unit installed to an upper portion of the moving apparatuses for providing power to the moving apparatuses and controlling operations of the mining apparatus and the transferring apparatus; a structure frame for connecting the moving apparatuses to each other and for supporting the mining apparatus, the transferring apparatus and the power control measuring unit; and a buoyancy unit installed to a top end of the structure frame.

Abstract: The present invention relates to a four degrees of freedom motion apparatus, and more particularly, to a four degrees of freedom motion apparatus capable of implementing three degrees of freedom (pitch, roll, heave) motions by three actuators positioned at a lower plate and a center plate, and between the lower plate and the center plate, and a spline, and additionally implementing an one degree of freedom (sway) motion by a connecting means provided between the center plate and an upper plate.

Abstract: The present invention relates to a spraying apparatus and a spraying method of water and air having effected 4D, and more particularly, to a spraying apparatus and a spraying method of water and air having effected 4D capable of controlling power of sprayed water and air and spraying water and air from one nozzle.

Abstract: The present invention provides a method that can maintain the temperature of a wafer at a process temperature before a coating process is performed by supplying a photoresist. According to the present invention, a thinner which helps a diffusion of the photoresist is supplied onto the wafer before the photoresist is supplied. The thinner is supplied in a temperature-controlled state such that the wafer has the process temperature by the thinner.

Abstract: Provided is a substrate treating method for selectively etching a surface of a substrate. In the substrate treating method, an etchant is supplied to a center portion of a rotating substrate through a first nozzle, and an etch prevention fluid is supplied through a second nozzle disposed at a predetermined position apart from the center portion of the substrate so as to dilute the etchant.

Abstract: The present invention provides a method that can maintain the temperature of a wafer at a process temperature before a coating process is performed by supplying a photoresist. According to the present invention, a thinner which helps a diffusion of the photoresist is supplied onto the wafer before the photoresist is supplied. The thinner is supplied in a temperature-controlled state such that the wafer has the process temperature by the thinner.

Abstract: A silencing device for a vacuum cleaner includes dampers for absorbing operational vibration of a suction motor. The operational noises of the suction motor are intercepted and suppressed by a middle case, a lower case, a bottom case and a top case. The exhaust noises caused by exhaust air flow are repeatedly absorbed and suppressed by a plurality of exhaust ports. The exhaust air flow is also dispersed so as to suppress the exhaust noises. In the primary embodiment, the noises generated by both the suction motor and the exhaust air flow are effectively suppressed to desired low levels. In a second embodiment, the silencing device comprises a noise absorber for absorbing and suppressing both suction noises caused by suction air flow and operational noises of the suction motor. The silencing device also has a cover for covering and supporting the front surface of the noise absorber. The back of the noise absorber is supported by a rear supporter.