Patents by Inventor Jong Suk Bae

Jong Suk Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
    Patent number: 7169707
    Abstract: Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: January 30, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Duck Young Maeng, Byung Kook Sun, Tae Hoon Kim, Jee Soo Mok, Jong Suk Bae, Yoong Oh, Chang-Kyu Song, Suk-Hyeon Cho